BWF CS 30 Search Results
BWF CS 30 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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50642-1240ELF |
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High Pin Count, Backplane Connectors, Receptacle, Right Angle, 4 Row, 0 Guide Pin, Solder-less Press-Fit, 240 Positions, 2.54mm (0.100in) Pitch | |||
89891-442LF |
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Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 84 Positions, 2.54mm (0.100in) Pitch | |||
76384-312LF |
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Dubox®2.54mm, Board to Board Connector, Shrouded Header, Single Row, Straight. | |||
85674-1156LF |
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5 Row Signal Header, Straight, Press-Fit, Wide body, 1 Mod | |||
98424-G52-08ULF |
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Surface Mount, Double Row, 8 Position ,2.00mm (0.079in) Pitch. |
BWF CS 30 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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K7N167245A
Abstract: K7N167249A 326J
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256Kx72 K7N167245A 256Kx72-Bit K7N167249A K7N167245A. 11x19 K7N167245A 326J | |
tc-l 11w
Abstract: K7N167245A K7N167249A
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256Kx72 K7N167245A 256Kx72-Bit K7N167249A K7N167245A. 11x19 tc-l 11w K7N167245A | |
Contextual Info: White Electronic Designs 256Kx72 Synchronous Pipeline SRAM WEDPY256K72V-XBX Preliminary* FEATURES DESCRIPTION n Fast clock speed: 100, 133, 150, 166 and 200* MHz The WEDPY256K72V-XBX employs high-speed, low-power CMOS designs that are fabricated using an advanced CMOS |
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256Kx72 WEDPY256K72V-XBX WEDPY256K72V-XBX | |
CS22
Abstract: dq35j fast sram 100mhz CS11 CS21 WEDPY256K72V-XBX DQ9-17
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WEDPY256K72V-XBX 256Kx72 WEDPY256K72V-XBX CS22 dq35j fast sram 100mhz CS11 CS21 DQ9-17 | |
K7N327245M
Abstract: K7N327249M
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512Kx72 K7N327245M 512Kx72-Bit K7N327249M 11x19 K7N327245M | |
dq35j
Abstract: CS11 CS21 CS22 WEDPY256K72V-XBX
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WEDPY256K72V-XBX 256Kx72 WEDPY256K72V-XBX dq35j CS11 CS21 CS22 | |
Contextual Info: Preliminary 256Kx72 Pipelined NtRAMTM K7N167245A Document Title 256Kx72-Bit Pipelined NtRAMTM Revision History History Draft Date Remark 0.0 1. Initial document. April. 21. 2001 Preliminary 0.1 1. Add JTAG Scan Order May. 10. 2001 Preliminary Rev. No. The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to c hange the |
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K7N167245A 256Kx72-Bit 256Kx72 11x19 00x10 | |
Contextual Info: WEDPZ512K72S-XBX 512K x 72 Synchronous Pipeline Burst ZBL SRAM *PRELIMINARY FEATURES DESCRIPTION ! Fast clock speed: 150, 133, and 100MHz The WEDC SyncBurst - SRAM employs high-speed, lowpower CMOS design that is fabricated using an advanced CMOS process. WEDC’s 32Mb SyncBurst SRAMs integrate |
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WEDPZ512K72S-XBX 100MHz 1Mx72. | |
Contextual Info: Preliminary 256Kx72 Pipelined NtRAMTM K7N167249A Document Title 256Kx72-Bit Pipelined NtRAMTM Revision History History Draft Date Remark 0.0 1. Initial document. April. 21. 2001 Preliminary 0.1 1. Add JTAG Scan Order May. 10. 2001 Preliminary Rev. No. The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to c hange the |
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K7N167249A 256Kx72-Bit 256Kx72 11x19 00x10 | |
K7N167249AContextual Info: Preliminary 256Kx72 Pipelined NtRAMTM K7N167249A Document Title 256Kx72-Bit Pipelined NtRAMTM Revision History Rev. No. 0.0 0.1 0.2 History Draft Date Remark 1. Initial document. 1. Add JTAG Scan Order 1. Upate DC characteristics icc,isb April. 21. 2001 May. 10. 2001 |
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256Kx72 K7N167249A 256Kx72-Bit 11x19 00x10 00x18 K7N167249A | |
dq35j
Abstract: CS11 CS21 CS22 WEDPY256K72V-XBX
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WEDPY256K72V-XBX 256Kx72 WEDPY256K72V-XBX dq35j CS11 CS21 CS22 | |
cs113
Abstract: WEDPZ512K72S-XBX CS10 CS11 CS20 CS21
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WEDPZ512K72S-XBX 100MHz cs113 WEDPZ512K72S-XBX CS10 CS11 CS20 CS21 | |
Contextual Info: WEDPY256K72V-XBX 256Kx72 Synchronous Pipeline SRAM FEATURES DESCRIPTION Fast clock speed: 100, 133, 150, 166 and 200* MHz The WEDPY256K72V-XBX employs high-speed, low-power CMOS designs that are fabricated using an advanced CMOS process. The 16Mb Synchronous SRAMs integrate two 256K x 36 SRAMs |
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WEDPY256K72V-XBX 256Kx72 WEDPY256K72V-XBX | |
Contextual Info: WEDPY256K72V-XBX 256Kx72 Synchronous Pipeline SRAM FEATURES DESCRIPTION Fast clock speed: 100, 133, 150, 166 and 200* MHz The WEDPY256K72V-XBX employs high-speed, low-power CMOS designs that are fabricated using an advanced CMOS process. The 16Mb Synchronous SRAMs integrate two 256K x 36 SRAMs |
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WEDPY256K72V-XBX 256Kx72 WEDPY256K72V-XBX | |
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av339
Abstract: Bf b9 IS61NVVP51236-200B IS61NVVP25672 IS61NVVP25672-200B IS61NVVP25672-250B IS61NVVP51236
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IS61NVVP25672 IS61NVVP51236 256Kx72 IS61NVVP25672-250B IS61NVVP25672-250BI IS61NVVP25672-200B IS61NVVP25672-200BI av339 Bf b9 IS61NVVP51236-200B IS61NVVP25672 IS61NVVP25672-200B IS61NVVP25672-250B IS61NVVP51236 | |
Contextual Info: W2Z512K72SJ White Electronic Designs 36Mb, 512K x 72 Synchronous Pipeline Burst NBL SRAM Advanced* FEATURES DESCRIPTION n n n n n n n The WEDC SyncBurst - SRAM family employs highspeed, low-power CMOS designs that are fabricated using an advanced CMOS process. WEDCs 72Mb |
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150MHz W2Z512K72SJ 209-bump W2Z512K72SJ35ES W2Z512K72SJ38ES W2Z512K72SJ28BC W2Z512K72SJ30BC W2Z512K72SJ35BC W2Z512K72SJ38BC W2Z512K72SJ30BI | |
W2Z1M72SJContextual Info: W2Z1M72SJ 72Mb, 1Mx72 Synchronous Pipeline Burst NBL SRAM Preliminary* FEATURES DESCRIPTION n n n n n n n The WEDC SyncBurst - SRAM family employs highspeed, low-power CMOS designs that are fabricated using an advanced CMOS process. WEDCs 72Mb SyncBurst SRAMs integrate two 1Mx36 SRAMs into a |
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W2Z1M72SJ 1Mx72 1Mx36 W2Z1M72SJ35ES W2Z1M72SJ38ES W2Z1M72SJ28BC W2Z1M72SJ30BC W2Z1M72SJ35BC W2Z1M72SJ38BC W2Z1M72SJ | |
Contextual Info: W2Z1M72SJ White Electronic Designs 72Mb, 1M x 72 Synchronous Pipeline Burst NBL SRAM Advanced* FEATURES DESCRIPTION n n n n n n n The WEDC SyncBurst - SRAM family employs highspeed, low-power CMOS designs that are fabricated using an advanced CMOS process. WEDCs 72Mb |
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150MHz W2Z1M72SJ 209-bump W2Z1M72SJ35ES W2Z1M72SJ38ES W2Z1M72SJ28BC W2Z1M72SJ30BC W2Z1M72SJ35BC W2Z1M72SJ38BC W2Z1M72SJ30BI | |
W2Z512K72SJContextual Info: W2Z512K72SJ 36Mb, 512Kx72 Synchronous Pipeline Burst NBL SRAM Preliminary* FEATURES DESCRIPTION n Fast clock speed: 225, 200, 166 and 150MHz The WEDC SyncBurst - SRAM family employs highspeed, low-power CMOS designs that are fabricated using an advanced CMOS process. WEDCs 72Mb |
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W2Z512K72SJ 512Kx72 150MHz 512Kx36 W2Z512K72SJ35ES W2Z512K72SJ38ES W2Z512K72SJ28BC W2Z512K72SJ30BC W2Z512K72SJ35BC W2Z512K72SJ | |
Contextual Info: Preliminary 512Kx72 Pipelined NtRAM TM K7N327245M Document Title 512Kx72-Bit Pipelined NtRAMTM Revision History History Draft Date Remark 0.0 0.1 1. Initial document. 1. Speed bin merge. From K7N327249M to K7N327245M 2. AC parameter change. tOH min /tLZC(min) from 0.8 to 1.5 at -25 |
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K7N327245M 512Kx72-Bit 512Kx72 K7N327249M K7N327245M 11x19 00x10 | |
K7N167245A
Abstract: K7N167249A
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256Kx72 K7N167245A 256Kx72-Bit K7N167249A K7N167245A. 11x19 K7N167245A | |
NtRAM
Abstract: K7N327245M K7N327249M
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512Kx72 K7N327245M 512Kx72-Bit K7N327249M 11x19 NtRAM K7N327245M | |
Contextual Info: ADVANCE U II^ C a n iM ni — 1 MT3LST3264 P , MT5LST6464(P) 32K, 64K x 64 SYNCHRONOUS SRAM MODULE 32K, 64K x 64 SRAM with TAG RAM 256KB/512KB, 3.3V, FLOW-THROUGH OR PIPELINED SYNCHRONOUS BURST, SECONDARY CACHE MODULES FEATURES PIN ASSIGNMENT (Front View) |
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MT3LST3264 MT5LST6464 160-lead, 82430FX 256KB/512KB, 160-PIN | |
Contextual Info: . TOSHIBA 11\ I I TC55V1325FF-8, TC55V1325FF -10, TC55V1325FF -12 TECHNICAL DATA SILICON G A TE CMOS TENTATIVE 32,768 W O R D x 32 BIT Synchronous Pipelined Burst SRAM DESCRIPTION The TC55V1325FF is a 1,048,576 bit synchronous pipelined burst SRAM that is organized as 32,768 |
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TC55V1325FF-8, TC55V1325FF 32KX32 TC55V1325FFâ 002b117 TC55V1325FF-10. |