BSC 68J Search Results

footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5

footprint jedec MS-026 TQFP

Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

atmel 0328

Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
Contextual Info: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

0555B

Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Contextual Info: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

Contextual Info: HU 166 Semiconductor September 1998 8-Bit, 250 MSPS, Flash A/D Converter File Number 3579.4 Features T h e H 11 1 6 6 is an 8-bit, ultra high s p e e d , flash A n alo g-to- Differential Linearity E r r o r . ± 0 .5 L S B or Less Digital con verter IC c a p a b le of digitizing analo g signals at a

Contextual Info: Features • High-density, High-performance, Electrically-erasable Complex • • • • • • • • • • Programmable Logic Device – 3.0 to 3.6V Operating Range – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell

QC1002

Abstract: AU100 ATF1504ASV ATF1504ASV-15 ATF1504ASVL
Contextual Info: Features • High-density, High-performance, Electrically-erasable Complex • • • • • • • • • • Programmable Logic Device – 3.0 to 3.6V Operating Range – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell

Contextual Info: Features • High-density, High-performance, Electrically-erasable Complex Programmable • • • • • • • • • • • Logic Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 Pins

ATF1504AS

Abstract: ATF1504ASL MC64
Contextual Info: Features • High-density, High-performance, Electrically-erasable Complex Programmable • • • • • • • • • • • Logic Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 Pins

ATF1504ASV

Abstract: ATF1504ASV-15 ATF1504ASVL
Contextual Info: Features • High-density, High-performance, Electrically-erasable • • • • • • • • • Complex Programmable Logic Device – 3.0 to 3.6V Operating Range – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell

ci 555

Abstract: "XOR Gate" Atmel CPLD In-System Program sr flip flop ATF1504ASV ATF1504ASV-15 ATF1504ASVL
Contextual Info: Features • High-density, High-performance, Electrically-erasable • • • • • • • • • Complex Programmable Logic Device – 3.0 to 3.6V Operating Range – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)

Contextual Info: Features • High-density, High-performance, Electrically-erasable • • • • • • • • • Complex Programmable Logic Device – 3.0 to 3.6V Operating Range – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell

ATF1504ASV

Abstract: ATF1504ASV-15 ATF1504ASVL
Contextual Info: Features • High-density, High-performance, Electrically-erasable • • • • • • • • • Complex Programmable Logic Device – 3.0 to 3.6V Operating Range – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell

AC100

Abstract: ATF1504AS
Contextual Info: Features • High Density, High Performance Electrically Erasable Complex Programmable Logic • • • • • • • • • • Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 pins – 7 ns Maximum Pin-to-Pin Delay

AC100

Abstract: ATF1504AS ATF1504ASL bsc 68j
Contextual Info: Features • High-density, High-performance, Electrically-erasable Complex Programmable • • • • • • • • • • Logic Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 Pins – 7.5 ns Maximum Pin-to-pin Delay

ATF1504AS

Abstract: ATF1504ASL jk flip flop to d flip flop conversion
Contextual Info: Features • High-Density, High-Performance, Electrically-Erasable Complex Programmable Logic • • • • • • • • • • Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 pins – 7.5 ns Maximum Pin-to-Pin Delay

Contextual Info: Features • High-density, High-performance, Electrically-erasable Complex Programmable Logic • • • • • • • • • • Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 pins – 7.5 ns Maximum Pin-to-pin Delay

Contextual Info: Features • High-density, High-performance, Electrically-erasable Complex Programmable • • • • • • • • • • Logic Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 Pins – 7.5 ns Maximum Pin-to-pin Delay

AC100

Abstract: ATF1504AS ATF1504ASL
Contextual Info: Features • High-density, High-performance, Electrically-erasable Complex Programmable • • • • • • • • • • Logic Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 Pins – 7.5 ns Maximum Pin-to-pin Delay

AC100

Abstract: ATF1504AS ATF1504ASZ 6116A
Contextual Info: Features • High Density, High Performance Electrically Erasable Complex Programmable Logic • • • • • • • • • • Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 pins – 7 ns Maximum Pin-to-Pin Delay

Atmel 546

Abstract: MC64 ATF1504AS ATF1504ASL
Contextual Info: Features • High-density, High-performance, Electrically-erasable Complex Programmable • • • • • • • • • • Logic Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 Pins – 7.5 ns Maximum Pin-to-pin Delay

AC100

Abstract: ATF1508AS 85F45
Contextual Info: ATF1508AS/L Features • High Density, High Performance Electrically Erasable Complex • • • • • • • • • • Programmable Logic Device – 128 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 68, 84, 100, 160-pins

bsc 68j

Abstract: AC100 ATF1504AS
Contextual Info: Features • High Density, High Performance Electrically Erasable Complex Programmable Logic • • • • • • • • • • Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 pins – 7 ns Maximum Pin-to-Pin Delay