BOND WIRE GOLD Search Results

MXP400X

Abstract: 7400 family bonder 150-degree
Contextual Info: Application Note - MXP400x Wire bond InGaAs/InP PIN Photo Diode Family OPTO-ELECTRONIC PRODUCTS W W W. Microsemi .COM Guideline for wire bond to MXP400x bare die. Recommend Wedge Bond used. Wedge detail informations: * 45 degee wire feed angle. * .0015 in. hole size.

Contextual Info: PRODUCT CHANGE NOTICE Contact Date: Implementation Date: February 25, 2008 May 25, 2008 Alert Category: DCS/PCN-1093 Alert Type: Bond Wire Change Discrete Semiconductor PCN #: PCN-1093 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE

Contextual Info: PRODUCT CHANGE NOTICE DCS/PCN-1105 Contact Date: Implementation Date: Alert Category: Alert Type: March 31, 2008 June 30, 2008 Analog Semiconductors Bond Wire Change PCN #: PCN #: 1105 TITLE ANALOG COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE

702 sot23

Abstract: 1N4448W13F BAV99-7-05-F sot 23 70.2 MMBT3906R BZT52C6V8 DVRN6056
Contextual Info: PRODUCT CHANGE NOTICE DCS/PCN-1116 Contact Date: Implementation Date: Alert Category: Alert Type: September 16, 2008 December 15, 2008 Discrete Semiconductor Bond Wire Change PCN #: PCN #: 1116 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE

FMMT593TA

Contextual Info: PRODUCT CHANGE NOTICE Initial DCS/PCN-1155 Rev00 Final Contact Date: Implementation Date: Alert Category: Alert Type: PCN #: December 11, 2009 March 11, 2010 Discrete Semiconductor Bond Wire Change PCN #: 1155 Rev00 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT

23/DMP2215L-7

Contextual Info: PRODUCT CHANGE NOTICE DCS/PCN-1111 Contact Date: Implementation Date: Alert Category: Alert Type: May 23, 2008 June 21, 2008 Discrete Semiconductor Bond Wire Change PCN #: PCN #: 1111 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE

ZXNB4200JA16TC

Contextual Info: PRODUCT CHANGE NOTICE Contact Date: Implementation Date: Alert Category: November 20, 2008 December 20, 2008 Analog Semiconductors Products DCS/PCN-1121 Alert Type: PCN #: Bond wire change PCN #: 1121 TITLE Copper bond wire implementation IMPACT None DESCRIPTION OF CHANGE

Contextual Info: PRODUCT CHANGE NOTICE Contact Date: Implementation Date: Alert Category: Alert Type: June 19, 2008* September 17, 2008* Analog Semiconductor Bond Wire Change DCS/PCN-1115 Rev 03 PCN #: PCN-1115, Rev 03 TITLE ANALOG COPPER BOND WIRE IMPLEMENTATION IMPACT None

Contextual Info: TaNSil WIRE BONDABLE SILICON CHIP RESISTORS ISO-9001 Registered WBC SERIES • Highly reliable aluminum bond pads Gold bond pads available • Discrete or tapped schematics • Ultra-stable TaNSil® resistors on silicon • MIL screening available • High resistor density

Contextual Info: TaNSil Wire Bondable W NE Silicon Chip Resistors WBC SERIES ● Ultra-stable TaNSil® resistors on silicon ● MIL screening available ● High resistor density ● Highly reliable aluminium bond pads Gold bond pads available ● Discrete or tapped schematics

Contextual Info: TaNSil Wire Bondable Silicon Chip Resistors Welwyn Components WBC Series • Ultra-stable TaNSil® resistors on silicon • MIL screening available • High resistor density • Highly reliable aluminium bond pads Gold bond pads available • Discrete or tapped schematics

Contextual Info: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME

Contextual Info: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME

Contextual Info: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT 0.035" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME

tantalum nitride

Abstract: ceramic resistor
Contextual Info: TT electronics: Bond With The Best TaNFilm silicon and ceramic wire bondable resistor/capacitor chips from TT electronics T T electronics now provides its proven tantalum nitride thin film technology in ultra-miniature silicon or ceramic-based wire bondable

heraeus

Abstract: Heraeus paste profile sl dielectric thinners W. HUGHES cool compiled 5007 resistivity wire in 5007 screen emulsion
Contextual Info: Conductors C 5007 Cadmium-Free & Bondable Au Conductor Paste Description: C 5007 is a wire bondable gold conductor, containing a mixed bonded Au formulation. It is entirely free of Cadmium and may therefore be classified as non-harmful & non-toxic. It offers excellent aged wire bond adhesion and contact

Contextual Info: RFLW 5N www.vishay.com Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • High frequency • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF

Contextual Info: RFLW 3N www.vishay.com Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.030" x 0.030" FEATURES • High frequency • Wire bond assembly • Small size: 0.030" x 0.030" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF

Contextual Info: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10  to 1 M • Oxidized silicon substrate for good power dissipation

bcr20

Contextual Info: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10  to 1 M • Oxidized silicon substrate for good power dissipation

hot wire anemometer

Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
Contextual Info: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance

power inductor markings

Abstract: RFLW5N1500 bond wire gold AEC-Q200-002
Contextual Info: RFLW 5N Vishay Electro-Films Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF RFLW series of thin film spiral inductors on quartz are

Contextual Info: RFLW 3N Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.030" x 0.030" FEATURES • High frequency • Wire bond assembly • Small size: 0.030" x 0.030" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed

RFLW5N1500

Contextual Info: RFLW 5N Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • High frequency • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed