BOILER Search Results
BOILER Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Update the boilerplate to current requirements as specified in MIL-PRF-38535. – jak 07-06-11 Thomas M. Hess B Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. LTG 13-05-16 Thomas M. Hess |
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mil-prf-38535 | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Correct junction temperature in paragraph 1.3. - LTG 02-07-23 Thomas M. Hess B Update boilerplate to current MIL-PRF-38535 requirements. - CFS 07-11-09 Thomas M. Hess C Update boilerplate to current MIL-PRF-38535 requirements. - PHN |
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mil-prf-38535 | |
C0910Contextual Info: REVISIONS DATE DESCRIPTION LTR APPROVED YR-MO-DA A Changes in accordance with NOR 5962-R231-93. 93-09-21 M. A. Frye B Updated boilerplate. Added device types 03-05. Removed programming requirements from drawing. TABLE I. changes. Editorial changes throughout. |
OCR Scan |
5962-r231-93mil-bul-10310047dc0910 | |
cds photo diode
Abstract: diode assembly
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s10108s10109se-171kpic1066e01+2 | |
5962-96663
Abstract: HS-26CLV31RH HS-26CLV31 5962F9666302VXC qml-38535 26C31RH CDFP4-F16 F8859 STMicroelectronics smd DIODE marking code HS9-26CLV31-RH8
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5962-r032-97f8859bp41995962-96663+8 | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Update drawing to the latest requirements. -sld 07-10-01 Robert M. Heber B Table II, add note to Group C end-point test parameters. Update boilerplate paragraphs. -gz 10-01-22 Charles F. Saffle C Corrected dimensions for symbols D, D2, and L1 for case outline U. |
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afl5015sz/ch | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Update drawing to the latest requirements. -sld 07-08-03 Robert M. Heber B Table II, add note to Group C end-point test parameters. Update boilerplate paragraphs. -gz 09-12-08 Charles F. Saffle C Corrected dimensions for symbols D, D2, and L1 for case outline U. |
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afl5009sz/ch | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add paragraph 3.1.1 and Appendix A for microcircuit die. Changes in accordance with N.O.R. 5962-R014-98. 97-12-21 Raymond Monnin B Make changes to boilerplate and add device class T. - ro 98-12-03 Raymond Monnin |
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5962-r014-98 | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Update drawing to the latest requirements. -sld 07-07-30 Joseph Rodenbeck B Table II, add note to Group C end-point test parameters. Update boilerplate paragraphs. -gz 09-12-08 Charles F. Saffle C Corrected dimensions for symbols D, D2, and L1 for case outline U. |
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afl503r3sz/ch | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Update drawing to the latest requirements. -sld 07-11-26 Robert M. Heber B Table II, add note to Group C end-point test parameters. Update boilerplate paragraphs. -gz 10-01-22 Charles F. Saffle C Corrected dimensions for symbols D, D2, and L1 for case outline U. |
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afl5015dz/ch | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Table II, add note to Group C end-point test parameters. Update boilerplate paragraphs. -gz 11-01-19 Charles F. Saffle B Add case outline Y. -gc 13-06-20 Charles F. Saffle REV SHEET REV SHEET REV STATUS |
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ls2803r3sn/ckals2803r3sn/ckc | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Make change to descriptive designator in 1.2.4 and add 1.5. Boilerplate updated. - ro 99-07-21 R. MONNIN B Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. – gt 03-08-20 R. MONNIN C Add die appendix A and 3.1.1. - ro |
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mil-std-973mil-prf-38535 | |
Transistor A431 Equivalent list
Abstract: 40107Bn 5962R9664402VXC 5962R9664401VXC qml-38535 smd marking 1331 40107B military finishes ASTM A36
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5962-r229-975962-r425-97mil-prf-38535transistor a431 equivalent list+8 | |
NOx sensor
Abstract: so2 Gas sensor ndir so2 sensor sensor Nox block diagram of suction pump infrared gas analyzer 5K65A TK7H8043P1 so2 Gas infrared detector NDIR CO sensor
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nox sensorso2 gas sensor ndirso2 sensorsensor nox+6 | |
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5962-8954201gContextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add device type 03. Add case outline H. Add radiation hardness requirements. Update boilerplate to reflect new requirements. - rrp 00-07-12 R. MONNIN B Make change to TCVOS, IOS, IIB, CMRR, VO, PSRR, SR, GBW, PD tests as |
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5962-8954201g | |
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Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Correct notes 4 and 5 of table I. Correct table II subgroups for final electrical and Group A test requirements. Update figure 1, case outline X. Update drawing boilerplate. Editorial changes throughout. |
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ad10242tz/883b | |
5962-8956806QYC
Abstract: qml-38535 GDFP2-F28 GDIP1-T28 GDIP4-T28 REV00 D431 ASTM F1192M-95 IDT7204L30TDB
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5962-r187-95f74005962-8956806qycqml-38535+7 | |
qml-38535
Abstract: 5962-88771012A 5962-8877101RA
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f8859mil-prf-38535sup4act299k01vqml-38535+2 | |
5962-9310504QXA
Abstract: MG80486DX-25 mg80486DX-33 MG80486DX33 59629310506QXA MG80486 80486dx33 TA80486DX266 80486DX-25 5962-9310505QXA
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OCR Scan |
td0m7000e4fc5962-9310504qxamg80486dx-25+8 | |
smd marking ARB
Abstract: QML-38535 TSB14C01AMHVB TSB14C01 TSB14C01A TI-136 SMD 5 PIN MARK CODE ARB smd marking code ARB SMD
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OCR Scan |
03153bsmd marking arbqml-38535tsb14c01amhvb+5 | |
qml-38535
Abstract: 54F125 CDFP2-F14 CQCC1-N20 GDFP1-F14 MARKING M2X
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OCR Scan |
n2-907810154f125bdx54f125b2xqml-38535+5 | |
Matra-Harris Semiconductor
Abstract: X15C Matra-Harris qml-38535 Matra-Harris 40 pin
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OCR Scan |
5962-r009-915962-r036-92003l10lmatra-harris semiconductor+4 | |
QML-38535
Abstract: 5962-8853801GA 59628853802PA CQCC1-N20 OP215A OP215B 80naM 5962-8853801 5962-8853802 5962-8853803
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OCR Scan |
qml-385355962-8853801ga59628853802pacqcc1-n20+6 | |
QML-38535
Abstract: 5962F9678501VPA HS-1115RH HS7B-1115RH-Q
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OCR Scan |
5962f9678501vpahs7-1115rh-q5962f9678501vpchs7b-1115rh-q+2 | |