ams-qq-p-416 type II, Class 2
Abstract: NAS 1790 NASM 17984 AMS-H-6875 AMS-S-6758 AMS-QQ-A-200 nasm ASTM a240 QQ-A-225/6 ams-qq-p-416
Text: DZUS Lockwell® LG Quick Release Pins Single Acting Pins LG-T .05 MIN .05 MIN F Selecting LG-T LG-L Styles U F F/2 D DD 15º 17.5º U C G U GRIP +.020 -.000 15º 17.5º C F/2 C F .05 MIN D T G G GRIP +.020 -.000 U Quick Access Fasteners Grip length for Lockwell pins is
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LG3CT300F750
AMS-STD-130
ams-qq-p-416 type II, Class 2
NAS 1790
NASM 17984
AMS-H-6875
AMS-S-6758
AMS-QQ-A-200
nasm
ASTM a240
QQ-A-225/6
ams-qq-p-416
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NASM35338
Abstract: nasm35649 NASM35650 NASM35206 FED-STD-H28 nasm ms27183 .164 -32 unc -2A NASM35649 -282 RW37
Text: INCH-POUND MS75009J 16 May 2005 SUPERSEDING MS75009H 6 August 2001 DETAIL SPECIFICATION SHEET BRACKET ASSEMBLY, RESISTOR POWER TYPE This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of
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MS75009J
MS75009H
MIL-PRF-26,
MIL-R-19365.
MIL-PRF-26
MIL-R-19365
MS27183
NASM35338
nasm35649
NASM35650
NASM35206
FED-STD-H28
nasm
ms27183
.164 -32 unc -2A
NASM35649 -282
RW37
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CXM052
Abstract: hypertac CXB he807 CXF041 astm a17 steel JN1123 hypertac connector insertion tools Hypertronics CXB008 hypertac chb
Text: CH/CX PCB Connectors May 2005 ISSUE 1.0 • ENGLISH HYPERTAC CONTACT wire sleeve before insertion of pin pin partially inserted into sleeve pin completely inserted into sleeve HYPERTAC SOCKET CONTACT BRIEFLY HYPERTAC = HYPERboloid conTACt is a socket contact designed and manufactured in such a
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SIL-PAD to-247
Abstract: ASTM-A228 A228 T247 SIL-PAD K10 A366 C110 ASTM-A-366 TO220 HEATSINK Heatsinks TO247
Text: WV Series Heatsinks For TO-220 and TO-247 devices T220 0.72" 18.3mm T247 0.92" (23.4mm) 0.63" (16.0mm) T220 1.20" (30.5mm) T247 1.20-1.26" (30.5-32.0mm) Ohmite Manufacturing has launched a series of heatsink solutions for use with our popular TO-220 and TO-247
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O-220
O-247
O-247
6063T5
900-S,
800-S,
WV-T220-101E
O-220
WV-T247-101E
SIL-PAD to-247
ASTM-A228
A228
T247
SIL-PAD K10
A366
C110
ASTM-A-366
TO220 HEATSINK
Heatsinks TO247
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Untitled
Abstract: No abstract text available
Text: heatsink B60/C60 Series Ohmite introduces the power C series heat sink with improved Cam N Lock spring clip Pat. Pending . This series offers flexible, high performance and compact heat sink with exchangeable cam clip system for TO-220, TO-247, and TO-264 devices. The built in lip is provided for mounting ease. The optional B
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B60/C60
O-220,
O-247,
O-264
C60XX-058-AE
CLA-T247-21E
O-247
O-264
1-866-9-OHMITE
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SIL-PAD to-247
Abstract: ASTM-A228 SIL-PAD 1000 TO 247 SIL-PAD density Tgon 800 A228 A366 MV102
Text: Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type
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O-247
O-264
6063T5
MV-102-55E
MA-102-55E
1-866-9-OHMITE
SIL-PAD to-247
ASTM-A228
SIL-PAD 1000 TO 247
SIL-PAD density
Tgon 800
A228
A366
MV102
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ASTM A36
Abstract: 37690B ES45T-R ES45T-T satellite Andrew ANTENNA
Text: Installation Instructions Bulletin 37690B Revision F Foundation Specifications for Type ES45T-T and ES45T-R 4.5-Meter Earth Station Antennas 1.0 INTRODUCTION 1.1 This document specifies typical foundation characteristics, designs, requirements and dimensional specifications
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37690B
ES45T-T
ES45T-R
ASTM A36
37690B
satellite Andrew ANTENNA
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SIL-PAD 1000 TO 247
Abstract: SIL-PAD to-247 A228 SIL-PAD density MA-102-55E
Text: M Series Heatsinks For TO-264 and TO-247 1.34" 34.1mm 1.52" (38.6mm) Features Ohmite introduces the M series, patented (Pat. No. 7,151,669), high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink
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O-264
O-247
O-247
6063T5
800-S
MV-102-55E
1-866-9-OHMITE
SIL-PAD 1000 TO 247
SIL-PAD to-247
A228
SIL-PAD density
MA-102-55E
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Untitled
Abstract: No abstract text available
Text: C40 Heat Sink System For TO-247, TO-264 and SOT-227 Packages The C40 Series Heat Sink System Patent Pending offers flexible, high performance and compact heat sinks with an exchangeable cam clip system for TO247, TO-264 and SOT-227 (clip in development)
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O-247,
O-264
OT-227
OT-227
C40-058-AE
CLA-T247-21E
O-247
O-264
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Untitled
Abstract: No abstract text available
Text: B60/C60 Series Heat Sink System Ohmite introduces the power C series heat sink with improved Cam N Lock spring clip Pat. Pending . This series offers flexible, high performance and compact heat sink with exchangeable cam clip system for TO-220, TO-247, and
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B60/C60
O-220,
O-247,
O-264
C60XX-058-AE
CLA-T247-21E
O-247
O-264
1-866-9-OHMITE
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Heatsinks to-220
Abstract: A366 A228 thermal resistance case heat sink heat sink Tgon 800 SIL-PAD to-247 SIL-PAD density
Text: C Series Ohmite introduces the C series Pat. Pending . This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-247 packages (TO-220 and TO-264 available). This powerful heat sink provides tool and
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O-247
O-220
O-264
O-220
1-866-9-OHMITE
Heatsinks to-220
A366
A228
thermal resistance case heat sink
heat sink
Tgon 800
SIL-PAD to-247
SIL-PAD density
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37690B
Abstract: ES45T-R Andrew ANTENNA 6,4
Text: Installation Instructions Bulletin 37690B Revision E Foundation Specifications for Type ES45T-T and ES45T-R 4.5-Meter Earth Station Antennas 1.0 INTRODUCTION 1.1 This document specifies typical foundation characteristics, designs, requirements and dimensional specifications
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37690B
ES45T-T
ES45T-R
37690B
Andrew ANTENNA 6,4
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SIL-PAD density
Abstract: ASTM-A228 A228
Text: Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type
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O-247
O-264
6063T5
MV-102-55E
MA-102-55E
1-866-9-OHMITE
SIL-PAD density
ASTM-A228
A228
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Untitled
Abstract: No abstract text available
Text: HEATSINK For TO-220, TO-247, and TO-264 F E AT U R E S Ohmite’s R2 Series patent pending heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the
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O-220,
O-247,
O-264
O-264
O-220:
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Untitled
Abstract: No abstract text available
Text: HEATSINK For TO-220, TO-247, and TO-264 F E AT U R E S Ohmite’s R2 Series patent pending heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the
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O-220,
O-247,
O-264
O-220:
R2V-CT2-38E
1-866-9-OHMITE
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M Series Heatsink
Abstract: Heatsinks
Text: M Series Heatsinks Heatsink with clips for TO-264 and TO-247 F e at u r e s Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest
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O-264
O-247
O-247
MV-102-55E
MA-102-55E
MV-101-27E
MA-101-27E
MV-302-55E
MA-302-55E
M Series Heatsink
Heatsinks
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Untitled
Abstract: No abstract text available
Text: rîïï i T V M ¡ â e h l i n FEATURES For use w ith Small O utline JED EC SO J) packages Socket profile allow s ultra low packaging High tem perature m aterial resists distortion Leads are tin plated after stam ping fo r high reliability Open fram e a llo w s solder join t inspection
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UL94V-0)
E120111
00D04bfi
IS09001
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Untitled
Abstract: No abstract text available
Text: 'I M Ü ilJ i u i U l i s ï Straight FEATURES . • • ■ ■ Excellent for high density applications Minimizes PC Board stacking height IR, vapor phase and wave solder compatible Chamfered entry prevents pin stubbing Mates with Crane's PGM, IPGM, MPGM Series headers
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E120111
00D04bfi
IS09001
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1285b
Abstract: MIL-STD-11898
Text: FEATURES . • • * ■ SiNGLt ROW 1 to 32 positions Excellent for high density applications Minimizes PC Board stacking height IR, vapor phase and wave solder compatible Insulator standoffs reduce rework due to flux residue Mates with Crane's PGM, DPGM, LPGM, MPGM Series headers
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E120111
IS09001
1285b
MIL-STD-11898
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MIL-STD-109
Abstract: MIL-STD-11898 UL746B MIL-STD-45662A D995 MIL-STD-1285B
Text: £ u ¡ÏMGS a ri XU Straight, Dual Insulator' 1 FEATURES SINGLE ROW (3 to 60 positions MPFH • Excellent for low profile board stacking • Smaller centers allow higher density packaging ■ IR, ■ Custom applications available. call us! • Mates with Crane's
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E120111
IS09001
00D04bfi
MIL-STD-109
MIL-STD-11898
UL746B
MIL-STD-45662A
D995
MIL-STD-1285B
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ml 94v-0
Abstract: No abstract text available
Text: ATP/ATL Series A 'i.r l- c ' FEATURES ./ T SINGLE ROW 1 to 36 positions Chamfered entry prevents pin stubbing High reliability tuning fork contact Standoffs reduce rework due to flux residue Low insertion force and Hi Temp versions available Mates with PEG, MPEG, DPEG, LPEG, TPEG headers
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Untitled
Abstract: No abstract text available
Text: jj Straight, Dual Insulator FEATURES SINGLE ROW (1 to 40 positions) Dual insulator design adds mechanical stability Custom heights available for unusual board spacing MATE-RITE TIP prevents scraping of mating socket Insulator standoffs reduce rework due to flux residue
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38mion
E120111
IS09001
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86101 crane
Abstract: No abstract text available
Text: D.E.S.C. APPROVED CONNECTORS The Defense Electronics Supply Center D ESC , is an arm of the United States Departm ent o f Defense. The Center is responsible for initiating all military specifications and standards for com ponents - including PC connectors - as w ell as m onitoring suppliers o f those com ponents.
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ISO9001
86101 crane
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Untitled
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC G ALL RIGHTS RESERVED. DIST REVISIONS 50 LTR DESCRIPTION REV PER 0G3H— 0 0 2 5 — 04 DATE DWN APVD 23JAN04 JR MS D D + .0 2 5 A36^m DIA. B B CDLDR
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23JAN04
31MAR2000
20APR01
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