BGA256 17 Search Results

BGA256

Contextual Info: P-BGA256-1717-1.00AZ Uniti nn Jul.2003

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

P-BGA256-17x17-1

Abstract: 17X17 PRBG0256FA-A
Contextual Info: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FA-A D B D1 Previous Code 256F7X-C MASS[Typ.] 0.7g A b A S AB ZD e y S Index mark S ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 D E A A1 e

P-BGA256-27x27-1

Abstract: PRBG0256DE-B BP-256A 256AV
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-B Previous Code BP-256A/BP-256AV MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A

PRBG0256DB-A

Abstract: P-BGA256-27x27-1
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DB-A D MASS[Typ.] 2.4g A b A D1 B Previous Code 256F7X-B S AB ZD e Y W V U T R P N M L E1 K J H G F E D C B A ZE E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 y S Index mark S Reference

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e

PRBG0256DD-A

Abstract: 2.5G P-BGA-256-2
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DD-A D MASS[Typ.] 2.5g A A D1 B Previous Code 256F7X-F ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

BP-256

Abstract: P-BGA256-27x27-1 PRBG0256DE-A
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-A Previous Code BP-256 MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A G A1 F 2.5

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x

bga256

Abstract: BGA-256 BGA256 17
Contextual Info: 1.3 Pin Arrangement The pin arrangement of this LSI is shown in figure 1.2. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 A A B B C C D D E E F F G G H H J SH7641 J K BGA-256 K L L Top view M M N N P P R R T T U U V V W W Y Y 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Contextual Info: NXP 180 MHz, 32-bit Cortex-M4 /Cortex-M0 DSC LPC4300 series First asymmetrical, dual-core digital signal controller featuring Cortex-M4 & Cortex-M0 A dual-core architecture and a unique set of configurable peripherals make it possible to develop DSP and MCU applications within a single architecture and development environment.

BGA256

Abstract: lpc1800 TBGA100 LQFP144 LPC1810 LPC1833 LPC1837 LPC1850 LQFP208 LPC1817
Contextual Info: NXP 150 MHz, 32-bit Cortex-M3 microcontrollers LPC1800 Fastest Cortex-M3 MCU, Largest SRAM, High Speed USB The LPC1800 series of low power, high-performance Cortex-M3 MCUs features frequencies up to 150 MHz and flexible Dual-Bank Flash for the highest reliability in-application re-programming.

BGA256

Contextual Info: NXP 204-MHz, 32-bit Cortex-M4/ Cortex-M0 MCU LPC4300 series Cortex-M4 MCUs with Cortex-M0 coprocessor, HS USB, and more Multiple cores and a unique set of configurable peripherals make it easy to develop advanced applications within a single architecture and development environment.

BGA180

Contextual Info: NXP 150 MHz, 32-bit Cortex-M4 /Cortex-M0 DSC LPC4300 series First asymmetrical, dual-core digital signal controller featuring Cortex-M4 & Cortex-M0 A dual-core architecture and a unique set of configurable peripherals make it possible to develop DSP and MCU applications within a single architecture and development environment.

CE51484

Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
Contextual Info: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.

BGA-169

Abstract: TQFP112 BGA169 PQFP144 BGA-421 BQFP-84 qfp132 BGA196 PLCC18 BGA-256
Contextual Info: НАКОНЕЧНИКИ Изображения наконечников Наименование/размер A/B/C/D Наконечники для монтажа (для паяльника PS90) PS, 0.4 мм, конический PS, 0.8 мм, конический

QFP256

Abstract: QFP-256 AD10 AD11 AD12 AD14 AD17 K17R BGA256
Contextual Info: , AD30 AD31 AD21 AD22 AD23 C/ AD24 AD25 AD26 AD27 AD28 AD29 , C/ AD16 AD17 AD18 AD19 AD20 AD11 AD12 AD13 AD14 AD15 C/ PAR , , 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160

SCK D54

Abstract: BGA256 QFP208 SH7750 SH7750R SH7750S HD-36 D2156 VDDRTC
Contextual Info: 1 2 3 4 5 6 7 D33 D45 F D34 D44 G D35 D43 H D36 D42 J D39 D15 D0 D14 D1 D13 D2 D12 D3 D11 D4 D10 D5 D9 M N P R T 14 15 16 VDD-RTC 3.3V VSS-RTC EXTAL2 XTAL2 17 18 19 20 NMI MD1/TXD2 MD0/SCK D63 D48 D62 D49 D61 CA* MD2/RXD2 D50 D60 RD/ / / RXD , , , ,

ADV0505

Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Contextual Info: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The

LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,

MB86H35

Abstract: FBGA24 MB86H
Contextual Info: Product Profile MB86H35 SmartMPEG-C Dig. TV Decoder for STBs, PVRs and IDTV INTRODUCTION: FEATURES The SmartMPEG-C is an advanced Digital Television Decoder designed to meet the needs of tomorrow’s settop-box and IDTV market. The SmartMPEG-C includes advanced features to support personal video recorder

MOSFET R166

Abstract: SMC C92 0603 footprint FERRITE BEAD INDUCTOR PH C75 SMC C75 0805 size footprint 0603732K SMC34C60QF op amp 7343 smc C106
Contextual Info: Item Quantity Reference 1 21 TP1,DGND1,TP2,DGND2,TP3, TP4,TP5,TP6,TP7,TP9,TP13, TP14,TP15,TP16,TP17,TP18, TP19,TP20,TP21,TP22,AGND 2 3 CR1,CR2,CR3 3 1 CR4 4 1 CR5 5 1 CT1 6 1 CT2 7 2 CT3,CT4 8 8 CT5,CT6,CT7,CT8,CT9,CT10, CT12,CT13 9 1 CT11 10 2 CT15,CT14 11 4

ATMEL 420

Abstract: HIGH VOLTAGE SCR 6kv C51 Microcontroller nds videoguard iso7816 Smart Cards Reader AT83c26 at91so101 nds smart card security AT89STK-09 QFN64
Contextual Info: MICROCONTROLLER Contact Smart Card Readers ICs INTEGRATED SOLUTIONS Compliant with Major Industry Standards EMV , PC/SC Workgroup, WHQL, ISO 7816, GSM 11.11 Atmel offers a wide range of smart card readers ICs. Compliant with major industry standards, they provide easy-to-implement and

"Frame rate conversion"

Contextual Info: Product Profile MB86H30 SmartMPEG-E Digital TV Decoder for STBs & PVRs INTRODUCTION: FEATURES The SmartMPEG-E is an advanced Digital Television Decoder designed to meet the needs of tomorrow’s settop-box and IDTV market. The SmartMPEG-E includes advanced features to support personal video recorder