BGA256 17 Search Results

BGA256

Contextual Info: P-BGA256-1717-1.00AZ Uniti nn Jul.2003

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

P-BGA256-17x17-1

Abstract: 17X17 PRBG0256FA-A
Contextual Info: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FA-A D B D1 Previous Code 256F7X-C MASS[Typ.] 0.7g A b A S AB ZD e y S Index mark S ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 D E A A1 e

BGA256 17 X 17

Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17
Contextual Info: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape

P-BGA256-27x27-1

Abstract: PRBG0256DE-B BP-256A 256AV
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-B Previous Code BP-256A/BP-256AV MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A

PRBG0256DB-A

Abstract: P-BGA256-27x27-1
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DB-A D MASS[Typ.] 2.4g A b A D1 B Previous Code 256F7X-B S AB ZD e Y W V U T R P N M L E1 K J H G F E D C B A ZE E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 y S Index mark S Reference

BGA256

Abstract: MS-034 BGA256 17 X 17 BGA-256 BGA256 17
Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L

sot471

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE Y W V U T R P e N M L K J H G F E D C B A 2 1

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e

P-BGA256-17x17-1

Abstract: P-BGA-256-1 PRBG0256FB-A
Contextual Info: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FB-A D B D1 Previous Code 256F7X-D MASS[Typ.] 0.8g A A ZD b S AB e ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Index mark S D E A A1 e

P-BGA256-27x27-1

Abstract: PRBG0256DA-A
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DA-A Previous Code 256F7X-A D A b A ZD A1 S AB e Y W V U T R P N M L E1 K J H G F E D C B A y S 1pin corner S ZE E e B D1 MASS[Typ.] 2.1g 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

BGA256

Abstract: BGA256 17 X 17
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

PRBG0256DD-A

Abstract: 2.5G P-BGA-256-2
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DD-A D MASS[Typ.] 2.5g A A D1 B Previous Code 256F7X-F ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

BGA256

Abstract: sot466 BGA256 17 X 17
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 D D1 ball A1 index A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1

D 2395

Abstract: BGA256 17 X 17 BGA256 MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L

BGA256

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x

bga256

Abstract: BGA-256 BGA256 17
Contextual Info: 1.3 Pin Arrangement The pin arrangement of this LSI is shown in figure 1.2. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 A A B B C C D D E E F F G G H H J SH7641 J K BGA-256 K L L Top view M M N N P P R R T T U U V V W W Y Y 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Contextual Info: NXP 180 MHz, 32-bit Cortex-M4 /Cortex-M0 DSC LPC4300 series First asymmetrical, dual-core digital signal controller featuring Cortex-M4 & Cortex-M0 A dual-core architecture and a unique set of configurable peripherals make it possible to develop DSP and MCU applications within a single architecture and development environment.

BGA256

Abstract: lpc1800 TBGA100 LQFP144 LPC1810 LPC1833 LPC1837 LPC1850 LQFP208 LPC1817
Contextual Info: NXP 150 MHz, 32-bit Cortex-M3 microcontrollers LPC1800 Fastest Cortex-M3 MCU, Largest SRAM, High Speed USB The LPC1800 series of low power, high-performance Cortex-M3 MCUs features frequencies up to 150 MHz and flexible Dual-Bank Flash for the highest reliability in-application re-programming.

BGA256

Contextual Info: NXP 204-MHz, 32-bit Cortex-M4/ Cortex-M0 MCU LPC4300 series Cortex-M4 MCUs with Cortex-M0 coprocessor, HS USB, and more Multiple cores and a unique set of configurable peripherals make it easy to develop advanced applications within a single architecture and development environment.

BGA180

Contextual Info: NXP 150 MHz, 32-bit Cortex-M4 /Cortex-M0 DSC LPC4300 series First asymmetrical, dual-core digital signal controller featuring Cortex-M4 & Cortex-M0 A dual-core architecture and a unique set of configurable peripherals make it possible to develop DSP and MCU applications within a single architecture and development environment.

Contextual Info: NXP 204 MHz, 32-bit Cortex-M4 /Cortex-M0 DSC LPC4300 series First asymmetrical, dual-core digital signal controller featuring Cortex-M4 & Cortex-M0 A dual-core architecture and a unique set of configurable peripherals make it possible to develop DSP and MCU applications within a single architecture and development environment.

CE51484

Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
Contextual Info: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.