BGA24 Search Results

Contextual Info: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5

BGA2450

Abstract: BP317 ISM2400
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D302 BGA2450 MMIC power amplifier Objective specification 2000 July 14 Philips Semiconductors Objective specification MMIC power amplifier BGA2450 PINNING FEATURES • Low-voltage operation 3 V PIN • High power-added efficiency (35 %)

bga244

Abstract: SF-BGA244B-B-11
Contextual Info: D Package Code: BGA244B C 22.48mm [0.885"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y X 22.5mm [0.886"] Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 Ø 0.64mm pad [Ø 0.025"]

bga244

Abstract: 19X19 SF-BGA244A-B-11
Contextual Info: D Package Code: BGA244A .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm 0.025" dia. pad Top View (reference only) 2 0.36mm [0.014"] dia. 0.762mm 5.33mm 3.74mm [0.147"]

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA240 package SOT711-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

SF-BGA248A-B-11

Contextual Info: D Package Code: BGA248A C See BGA pattern code to the right for actual pattern layout Y 24.13mm [0.950"] 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

Contextual Info: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5

BGA240

Abstract: MS-034 BGA-240 sot711
Contextual Info: Package outline Philips Semiconductors BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F E D C B A shape

19X19

Abstract: SF-BGA240E-B-11 land pattern BGA 0,50
Contextual Info: D Package Code: BGA240E .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm Top View (reference only) 0.025" dia. pad 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

BGA240

Abstract: IC-7315-001 BGA-240 MS 034 MS-034 sot711
Contextual Info: PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F

S25FL256

Abstract: S25FL256SA S25FL256SAGMFI00 S25FL256SAG FL256SA fl256saif00 S25FL256S FL128S S25FL256* spansion S25FL256SAGMF
Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion®

SAMSUNG MCP

Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Contextual Info: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)

FL256S

Abstract: SDR-80
Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet (Preliminary)

Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet (Advance Information)

Contextual Info: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised

Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet (Preliminary)

Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion®

Contextual Info: S25FL127S 128 Mbit 16 Mbyte MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core Serial Peripheral Interface with Multi-I/O Data Sheet (Preliminary) S25FL127S Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion®

usb video player circuit diagram

Abstract: toshiba laptop schematic diagram OTG243 TDOTG243-000C laptop screen connector pins PC usb ball mouse CIRCUIT diagram ARM720T TDOTG243 OS20 PXA250
Contextual Info: Product Brief September 24, 2002 Rev 1.7 OTG243 Three Port, Single Chip USB On-The-Go Host/Function Controller Description TransDimension’s OTG243 is a single chip USB Host and Function controller that is the first of a family of integrated low-cost, high-performance, On-the-Go

Contextual Info: ARM-based Embedded MPU SAM9N12 SAM9CN11 SAM9CN12 SUMMARY DATASHEET Description Based on the ARM926EJ-S processor, the Atmel SAM9N12/CN11/CN12 devices offer the frequently-requested combination of user interface functionality and high data rate connectivity, with LCD Controller, resistive touch-screen, multiple UARTs, SPI,

D03316P-103

Abstract: 4.7kohm resistor 88638-61102 DRFC16H st lm385 bcr beckman resistor R36-R38 74C32 Framatome 74c32 datasheet
Contextual Info: 0700D _BoM Location Part Descripition QTY U21 IC/SM 74LVC04AD SOIC14 3.3V 1 U4,U26 IC/SM 74LVC08 3.3V TSSOP-14 2 U22 IC/SM 74LVC14 3.3V TSSOP-14 1 U7,U8 IC/SM 74LVTH273 TSSOP-20 3.3V 2 U14,U15 IC/SM 74LVC573 SOIC20 No Bus H 2 U3 IC/SM 74C32 TSSOP-14 1 Q3,Q6,Q7

TAS5412

Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Contextual Info: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

SAMSUNG MCP

Abstract: samsung K5 MCP BA35 BA4110 ba4410 BA651 Flash Memory SAMSUNG k5
Contextual Info: Preliminary MCP MEMORY K5A3x40YT B B Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM Revision History Revision No. History 0.0 Initial Draft Draft Date Remark February 22, 2002 Preliminary

xr20m1172il32-f

Abstract: HVQFN32 Sc2698 SC16C654BIBM,128 SCC2681AC1A44 SC16C752B SCC2691AC1A28 SC28L198
Contextual Info: High-speed UARTs and Bridge ICs Advanced serial-interface solutions NXP UART applications Fastest baud rate: 20 Mbps SC16C85xS } General Interface U  ART controller is part of the serial data communication of a system. A UART is used to convert parallel data to serial data, and from serial