SOT711 Search Results

Contextual Info: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA240 package SOT711-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5

BGA240

Abstract: MS-034 BGA-240 sot711
Contextual Info: Package outline Philips Semiconductors BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F E D C B A shape

BGA240

Abstract: IC-7315-001 BGA-240 MS 034 MS-034 sot711
Contextual Info: PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F