BGA134 Search Results

Contextual Info: P—BGA1344—4040—l.OOBEF Unlti nn Feb,2004

he804

Abstract: ati connector HE809 smd diode ED MMSD32032602S-C-xx Microspire MB he807 eurofarad TCN30 MMEE08510804S-C-xx mmfl16016604s-c mmfl16016604s-d
Contextual Info: Edition 1.2. Space- & Military Level Components 2008/08 2 Introduction and Table of Contents If you are working on a program for military, industrial and/or space equipments & need product with extended temperature performance, MSA Components can help. To support the customer needs

Contextual Info: P—BGA1344—4040—l.OOAEF Unlti nn □ct.2002

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

Contextual Info: P—BGA1344—4040—l.OOAEF Uniti nn □c-t.2002

FCBGA

Abstract: 1344P BGA134
Contextual Info: FLIP CHIP BALL GRID ARRAY FUJITSU SEMICONDUCTOR DATA SHEET 1344 PIN CERAMIC BGA-1344C-M01 1344-pin cerami FCBGA Lead pitch 1.00 mm Package width x package length 40.00 × 40.00 mm Lead shape Ball Sealing method Under fill Mounting height 3.59 mm Max BGA-1344C-M01