BGA FT64 Search Results
BGA FT64 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 84501-001 | Amphenol Communications Solutions | 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array | |||
| 84500-002LF | Amphenol Communications Solutions | 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free | |||
| 84553-101LF | Amphenol Communications Solutions | 300 Position BGA Receptacle, 8mm Component Height, 1.27mm x 1.27mm Array, Lead-free | |||
| 84520-102LF | Amphenol Communications Solutions | 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free | |||
| 55724-101LF | Amphenol Communications Solutions | 200 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
BGA FT64 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
FTG64
Abstract: FT64 BGA ft64
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ft64/ftg64pk37064-ballftg64+2 | |
xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
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ug112ug072ug075xapp427+10 | |
BFG95Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL |
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ug112ug072ug075xapp427+1 | |
XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
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ug112ug072ug075xapp427+10 | |
xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
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ug112ug072ug075xapp427+9 | |
qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
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ug112ug072ug075xapp427+10 | |
camera-link to hd-SDI converter
Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400
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camera-link to hd-sdi convertervirtex-4qvds-kit-fx12mm1-gaes-s6dev-lx150t-g+6 | |
XC3S250E TQ144 STARTER KIT BOARD
Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55
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xc3s250e tq144 starter kit boardaes-s6dev-lx150t-gconnector fmc lpc samtecds-kit-fx12mm1-g+6 | |
220v AC voltage stabilizer schematic diagram
Abstract: BA 49182 RJh 3047 rjh 3047 equivalent a1458 opto philips ecg master replacement guide MOSFET, rjh 3077 sc1097 philips ecg semiconductors master replacement guide Electronic ballast 40W using 13005 transistor
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p390-ndp465-ndp466-ndp467-nd+14 |