BGA 731 Search Results

BGA 731

Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

BGA 731

Abstract: bga thermal cycling reliability material for ball grid array packaging
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board

Surface Insulation Resistance FR 4 PCB

Contextual Info: MAXIMUM solutions MILL-MAX 1mm & .050” GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow

Contextual Info: BGA Adapter Sockets Ball Grid Array BGA Adapter Sockets Table of Models Description: Standard Socket (S) Material: High Temp. Liquid Crystal Polymer (LCP)* Index: -60°C to 260°C (-76°F to 500°F) Insulator Size: Same size as BGA device body Description: Extraction Socket (SB)

Contextual Info: Product Number: 582-11-731-17-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 731-17-005 34 X 34

Contextual Info: Product Number: 587-10-731-17-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 731-17-005 34 X 34 # Of Pins Mill-Max Part Number 731 587-10-731-17-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737

BGA reflow guide

Contextual Info: BGA Socket Adapter System Features: • Facilitates easy insertion and withdrawal for high pin count Ball Grid Array devices. • Four extraction screws supplied allow BGA adapter to be easily removed from socket. Screws push off socket insulator without

AH35

Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
Contextual Info: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8

AA10

Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
Contextual Info: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8

BGA 731

Contextual Info: Ball Grid Array BGA Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com BGA Sockets Standard Socket (S): • Mates with Standard Adapter (A)

F33 1067

Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
Contextual Info: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6

292 MAPBGA

Abstract: cluster stepper motor pp e MC9S12XHZ256 MC9S12XHZ512 HCS12X MC9S12XHZ384 S12XE S12XEETX4KV2 BA 508 C0 S12XMMCV3
Contextual Info: Data Sheet Covers MC9S12XHZ384, MC9S12XHZ256 HCS12X Microcontrollers MC9S12XHZ512 Rev. 1.05 11/2008 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

Contextual Info: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FEATURES 324 Pin BGA North Bridge Chip Supports the Pentium C om patible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and

ATM-18

Abstract: ATM-5 DG 7-119 ATM machine using microprocessor 0x760 GSM modem M10 icp multiplexer 24 pin SINGLE POINT load cell C3 CLASS CX28225 CX28229
Contextual Info: CX28224/5/9 Inverse Multiplexing for ATM IMA Family Data Sheet 28229-DSH-001-B January 2003 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX28224 28224-14 D 256-pin, 17 mm BGA –40 °C to 85 °C

IC BOSCH 30536

Abstract: Bosch throttle body motor MPC5606SRM MPC5606S 2PCS02 transistor h331 S13 instrument cluster schematic bosch edc 17 EIC 4021 eMIOS200
Contextual Info: Devices Supported: MPC5602S MPC5604S MPC5606S MPC5606SRM Rev. 5 4 May 2010 MPC5606S Microcontroller Reference Manual, Rev. 5 Freescale Semiconductor 1 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are

mc68302FE16

Abstract: omron liteon power supply PC LITE-ON 18 pin "eye pattern generator" Nippon capacitors differential code shift keying omron e5a valor
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: ZEUS Freescale Semiconductor, Inc.

ATM-18

Abstract: CX28229-14 CX28225-14 DG 7-119 GSM modem M10 CX28224-14 CX28225 CX28229 512K16
Contextual Info: CX28224/5/9 Inverse Multiplexing for ATM IMA Family Data Sheet 28229-DSH-001-D March 2004 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX28224 CX28224-14 D 256-pin, 17 mm BGA –40 °C to 85 °C

manual PACE PSR 800 Plus

Abstract: Circuit diagram of 3d output surround sound system
Contextual Info: DSP56303UM Rev. 2, October 2005 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56303

Contextual Info: TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 1.1 www.ti.com CTZ/ZTZ BGA Package Bottom View The TMS320C6472 devices are designed for a package temperature range of 0°C to 85°C (commercial temperature range) or -40°C to 100°C (extended temperature range).

MC9S12XEG384

Abstract: 3M25J LOG RX2 diagram bosch al 1450 dv TCNT20 CPU12XV2 Freescale HCS12X PFlash
Contextual Info: MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010

Contextual Info: Ball Grid Array BGA Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com Now Available In 0.75mm Pitch Standard Socket (S) • Mates with Standard Adapter (A)

3M25J

Abstract: S12XEG256 9S12XEG384 2M53J 5m48h led 30 pin diagram lvds 2949 MC9S12XEG256 9S12XEG128 S12XEQ512 MC9S12XEG384
Contextual Info: MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010