BGA 576 SOCKET Search Results

Contextual Info: Product Number: 582-11-576-12-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 576-12-005 24 X 24

Contextual Info: Product Number: 582-11-576-15-007414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 576-15-007 29 X 29

Contextual Info: Product Number: 582-11-576-15-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 576-15-005 30 X 30

Contextual Info: Ij BGA TM Characteristics Insulation Resistance: W ithstanding Voltage: IC280 - 576 06 1,000MQminimum at 500 VDC Contact Resistance: 700 VAC for 1 Minute 30mQ max. at 10mA/20mV Initial Operating Temperature: -40"C ~ +150‘C Socket Series No. of Leads Material

HXC125

Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Contextual Info: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The

SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Contextual Info: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

bga 576 socket

Abstract: 7400 NP276-37206-AC03134 NP276-62525-A marcon+capacitor+5840 AC-06524 AC-09801 65227 NP276-37206AC-03134 NP276-37206-AC03327
Contextual Info: BGA NP276 Series Arrays Socket Series No. of Leads Material PEI Glass Filled UL94V-0 Beryllium Copper Gold over Nickel Design No. Positioning Pin Identification Depopulated Versions Available Quad Flat Packages ∅ ∅ ∅ ± Speciality Test Products ∅

bga 576 socket

Abstract: IC280-169-127 IC280-196-126 IC280-225-185 IC280-256-211 IC280-324-186 IC280-72919 4200-005 IC280-868-108 LGA socket
Contextual Info: IC280 Series Clamshell Ball Grid Array (FBGA / CSP / LGA) Specifications Part Number (Details) 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute for 1.00mm pitch 500V AC for 1 minute for 0.80mm pitch 100V AC for 1 minute for 0.75mm pitch

ic280 yamaichi

Abstract: IC280-169-127 IC280-196-126 IC280-72918 IC280-72919 X2335
Contextual Info: IC280 Series Clamshell Ball Grid and Fine Ball Grid Array (BGA / FBGA) Part Number (Details) Specifications 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m Ω max. at 10mA/20mV max. or

16X16

Abstract: bga 576 socket bga 24x24 576
Contextual Info: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00

Contextual Info: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]

bga 576 socket

Abstract: BGA576 LS-BGA576A-31
Contextual Info: Top View 31.00mm [1.220"] 0.90mm [0.035"] 0.90mm [0.035"] 1.27mm typ. 31.00mm [1.220"] 29.21mm [1.150"] Side View 1.68mm [0.066"] 1 3.76mm [0.148"] Ø 0.20mm [0.008"] ±0.0005" 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.

XC3S250E TQ144 STARTER KIT BOARD

Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55
Contextual Info: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6

hc335

Abstract: 1517P WF484
Contextual Info: 1. HardCopy III Device Family Overview HIII51001-3.1 Introduction This chapter provides an overview of features available in the HardCopy III device family. More details about these features can be found in their respective chapters. HardCopy III devices are Altera’s low-cost, high-performance, low-power ASICs with

Contextual Info: Product Index 1381 - FS 5 Energy Way, P.0. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com inch/ mm PART# DESCRIPTION. PAGE

hc335

Abstract: EP3SE110F1152 EP3SE110 EP3SL110F780 1517-pin HC325WF484N hc335ff1152n HC335FF1517N Altera Stratix II BGA 484 pinout HC325
Contextual Info: 3. Mapping Stratix III Device Resources to HardCopy III Devices HIII53003-3.1 This chapter discusses the available options for mapping from a Stratix III device to a HardCopy ® III device. The Quartus II software limits resources to those available to both the Stratix III FPGA

footprint 8M1-A

Abstract: 196-pin bga footprint
Contextual Info: BGA Footprints Arranged by Pitch and Ball Count See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

WMP100

Abstract: sim 300 processor gsm modem datasheet sim 300 processor datasheet for gsm modem wavecom WMP100 sim 300 processor gsm modem wavecom wmp50 sim 300 processor gsm modem for project wavecom WMP150 WMP150 sim 300 processor for gsm modem
Contextual Info: Smart wireless. Smart business. Wireless Microprocessor WMP 50/100/500 Smart Devices Creative Software Services Wireless Microprocessor® The Wireless Microprocessor® is a certified processing and radio solution in a BGA package designed for GSM/GPRS cellular communication in the M2M

SF-BGA576D-B-05

Contextual Info: 32.725mm [1.288"] 2.50mm [0.098"] 23.00mm [0.906"] 2.50mm [0.098"] 2.74mm [0.108"] A1 2.36mm [0.093"] 32.725mm [1.288"] 2.54mm [0.100"] 27.725mm [1.092"] 23.00mm [0.906"] 1.00mm typ. [0.039"] Top View 5.08mm [0.200"] 0-80 Threaded Insert Ø 0.60mm typ. [Ø 0.024"]

SF-BGA576D-B-05F

Contextual Info: 32.725mm [1.288"] 2.50mm [0.098"] 23.00mm [0.906"] 2.50mm [0.098"] 2.74mm [0.108"] A1 2.36mm [0.093"] 32.725mm [1.288"] 2.54mm [0.100"] 27.725mm [1.092"] 23.00mm [0.906"] 1.00mm typ. [0.039"] 5.08mm [0.200"] Top View 0-80 Threaded Insert Ø 0.60mm typ. [Ø 0.024"]

AC-27621

Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842
Contextual Info: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C