BGA 256 PACKAGE THERMAL RESISTANCE Search Results

BGA PACKAGE thermal profile

Abstract: 896-Pin TQFP 144 PACKAGE DIMENSION CII51015-2 EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015
Contextual Info: 15. Package Information for Cyclone II Devices CII51015-2.3 Introduction This chapter provides package information for Altera Cyclone® II devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Table 15–1 shows Cyclone II device package options.

BGA 256 PACKAGE thermal resistance

Abstract: bga 208 PACKAGE ep1c6-144 324 bga thermal BGA PACKAGE thermal resistance C52006-1 EP1C12 BGA400 EP1C6 C5200
Contextual Info: 15. Package Information for Cyclone Devices C52006-1.3 Introduction This data sheet provides package information for Altera devices. It includes the following sections: • ■ ■ “Device and Package Cross Reference” on page 15–1 “Thermal Resistance” on page 15–2

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

bd248

Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

pin information ep3c10

Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
Contextual Info: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

BGA PACKAGE thermal profile

Abstract: BGA 256 PACKAGE thermal resistance 484-pin BGA The Diode Data Book with Package Outlines CII51015-2 EP2C20 EP2C35 EP2C50 F256 MS 034 aaj
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. The chapters in this section contain the required PCB layout guidelines and package specifications.

BGA 256 PACKAGE thermal resistance

Abstract: C5200 C52006-1 EP1C12 TQFP 144 PACKAGE altera 324 bga thermal altera cross reference BGA EP1C20
Contextual Info: 15. Package Information for Cyclone Devices C52006-1.2 Introduction This data sheet provides package information for Altera devices. It includes these sections: Section Page Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . 15–1

altera cyclone 3

Abstract: C5200 C52006-1 EP1C12 BGA256 altera cross reference EP1C6
Contextual Info: Section VII. Cyclone Device Package Information This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.

altera cyclone 3

Abstract: C52006-1 EP1C12 table 15
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications. This section includes the following chapter:

pin information ep3c10

Abstract: u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
Contextual Info: Cyclone Series Device Thermal Resistance May 2008, version 3.0 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made May 2008 3.0 Updated Tables 2, 4, and 5. July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.

micro fineline BGA

Abstract: EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z
Contextual Info: 7. Package Information MII51007-2.1 Introduction This chapter provides package information for Altera’s MAX II devices, and includes these sections: • “Board Decoupling Guidelines” on page 7–1 ■ “Device and Package Cross Reference” on page 7–1

CE51484

Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
Contextual Info: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.

E700G

Contextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

MPC5668G

Abstract: MPC5668x SPC5668 emios MPC5668 eMIOS200
Contextual Info: Document Number: MPC5668X Rev. 3, 9/2009 MPC5668x MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category – 32 KB unified cache with line locking and eight-entry

MPC5668

Abstract: MPC5668x MPC5668G sram ecc nexus 5001 ph-15 diode pj12 diode BGA mpc5668x 5668G mha 36
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 5, 01/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category

mpc5668g

Abstract: MPC5668X a3700 automotive power transistor PJ15 SPC5668GF1AMMG SPC5668GF1 PJ59 SPC5668 317 MG 707 SPC5668x
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 6, 03/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 6, 03/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category