BGA 23 X 23 ARRAY Search Results

WLFT 404

Contextual Info: Hola1 H A H Heatsinks for BGAs B C – particularly suited for Ball Grid Arrays – heatsink dimensions match the respective BGA-type – can be glued directly on the BGA component D art. no. E ICK BGA 10 x 10 WLF . 10 x 10 art. no. F ICK BGA 10 x 10 x 10

Contextual Info: A Heatsinks for BGAs B C D – – – – – particularly suited for Ball Grid Arrays heatsink dimensions match the respective BGA-type can be glued directly on the BGA component double-sided adhesive thermal conductive foil WLF . ➔ E 7 surface: black anodised

AC-27621

Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842
Contextual Info: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C

bga 576 socket

Abstract: IC280-169-127 IC280-196-126 IC280-225-185 IC280-256-211 IC280-324-186 IC280-72919 4200-005 IC280-868-108 LGA socket
Contextual Info: IC280 Series Clamshell Ball Grid Array (FBGA / CSP / LGA) Specifications Part Number (Details) 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute for 1.00mm pitch 500V AC for 1 minute for 0.80mm pitch 100V AC for 1 minute for 0.75mm pitch

bga 576 socket

Abstract: 7400 NP276-37206-AC03134 NP276-62525-A marcon+capacitor+5840 AC-06524 AC-09801 65227 NP276-37206AC-03134 NP276-37206-AC03327
Contextual Info: BGA NP276 Series Arrays Socket Series No. of Leads Material PEI Glass Filled UL94V-0 Beryllium Copper Gold over Nickel Design No. Positioning Pin Identification Depopulated Versions Available Quad Flat Packages ∅ ∅ ∅ ± Speciality Test Products ∅

Contextual Info: BALL GRID ARRAYS For .050” Grid Male Pin Adapters & Female Socket Series 587, 582 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 8737/4048 adapter or a 4098/4054

Contextual Info: BALL GRID ARRAYS For .050” Grid Male Pin Adapters & Female Socket Series 587, 582 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-toboard interconnect. • The BGA device is soldered to a 8737/4048

SQ3300

Abstract: to 252 footprint
Contextual Info: ADVANCED INTERCONNECTIONS, Ball Grid Array Socketing System 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 80 0-424-9850 / 40 1-823-5200 • Fax 40 1-823-8723 •Email advintcorp@ aol.com • Internet http://wvwv.advlntcorp.com BGA Adapter Sockets

7064B

Abstract: m7512b
Contextual Info: MAX 7000B M Ï Ï I 3 Â. Programmable Logic Device Family August 1999. ve Data Sheet Features. • Preliminary Information ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array M atrix (MAX ) architecture (see Table 1)

ic280 yamaichi

Abstract: IC280-169-127 IC280-196-126 IC280-72918 IC280-72919 X2335
Contextual Info: IC280 Series Clamshell Ball Grid and Fine Ball Grid Array (BGA / FBGA) Part Number (Details) Specifications 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m Ω max. at 10mA/20mV max. or

entek Cu-56

Abstract: thick bga die size Cu-56 stencil tension BGA "direct replacement" bga rework "ball collapse" height
Contextual Info: APPNote #37 BGA Board Level Assembly and Rework Recommendations 4/19/00 Abstract This application note provides the recommendations for board level assembly for the ballgrid array BGA package family. These recommendations were derived from work done by the Universal BGA/DCA (Ball Grid Array/Direct Chip Attach) Consortium. The

Contextual Info: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

HXC125

Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Contextual Info: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The

Contextual Info: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

BGA 23 x 23 array

Contextual Info: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

Contextual Info: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

IC274-625133

Abstract: 625133 IC274-11901 IC274-529118 2212X
Contextual Info: IC274 Series Handler Type Ball Grid Array / Chip Scale Package (BGA/FBGA/CSP) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000MΩ min. at 500V DC 500V AC for 1 minute

to 225 footprint

Abstract: pin grid array ppm
Contextual Info: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929

106 10k 804

Abstract: 106F 213B
Contextual Info: CTS ClearONE Terminator Reliability Test Data RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN &

PJO 399

Abstract: PJO 389 PJO 499 B13128 pjo 489 7512A PJO 376 PJO 386
Contextual Info: MMMA. MAX 7000A Includes MAX7000AE Programmable Logic Device Family May 1999, ver. 2 Data Sheet Features. • ■ ■ Prelim inary Information ■ ■ ■ ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX

1.27mm pitch zif socket 3M 21X21

Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
Contextual Info: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •

C732B

Abstract: 337 BGA 337 BGA footprint EPM7032AE EPM7064AE EPM7128A EPM7128AE EPM7256A EPM7256AE EPM7512AE
Contextual Info: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family August 2000, ver. 3.1 Data Sheet • Features. ■ ■ ■ ■ ■ ■ ■ f High-performance 3.3-V EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX

TTL pin outs

Abstract: 30J341 CMOS TTL Logic Family Specifications BGA and QFP Package BITBLASTER footprint tqfp 208 v16 248 337 BGA footprint N12110 74 series pin outs
Contextual Info: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family September 1999, ver. 2.03 Data Sheet Features. • ■ Preliminary Information ■ ■ ■ ■ ■ f High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX

Routability

Abstract: XAPP157 FG676 BGA 23 x 23 array FG1156 FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball
Contextual Info: Application Note: Virtex Series R XAPP157 v1.0 July 26, 2000 Board Routability Guidelines with Xilinx Fine-Pitch BGA Packages Author: Abhay Maheshwari and Soon-Shin Chee Summary Xilinx supplies full array fine-pitch BGA (Ball Grid Array) packages with 1.00 mm ball pitch.