BERGQUIST SOFTFACE Search Results

TRANSISTOR REPLACEMENT GUIDE d882

Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Contextual Info: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,

D1065

Abstract: Chomerics* T-405 BERGQUIST softface Chomerics* T405 Chomerics T710 tape BGA 21x21 ARCLAD 8223 Chomerics T710 D10650-40 D10650-40 datasheet
Contextual Info: Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX BGA Sizes Foot Print mm Heat Sink Height (inches) Series # Solution Page # Attachment Method 21mm 21mm 25mm 27mm 35mm 35mm 37mm 37mm 40mm 40mm 40mm 40mm 45mm 45mm 45mm 45mm 45mm 45mm 21x21

BERGQUIST softface

Abstract: 61995AB124D1
Contextual Info: Thermal Management Solution for BGA and Pow e r P C packages Wakefield Engineering’s Series 619 fan heat sink provides processor spot cooling with direct impingement air flow. Features and Benefits : ♦ Captivated clips for ease of assembly Designed for use on a variety

Cyrix 6x86

Abstract: DC Centaur BERGQUIST softface media gx cyrix
Contextual Info: Thermal Solutions for Intel: Pentium, Pentium MM X AMD: K6, K6-2 Cyrix: 6x86, Media GX Features and Benefits : Centaur: W inChip C6 ♦ Compact design heat sinks can comfortably fit a variety of Robust Socket 7 – based PC boxes. ♦ Works with Sockets 5 & 7 processors

retention mechanisms

Abstract: AAVID Thermal Products
Contextual Info: HEAT SINKS FOR INTEL’S CELERON MICROPROCESSOR OPTIMIZED FOR OEM INSTALLATION An array of Low Cost Solutions for the Pentium® II in the Single Edge Processor Package S.E.P.P. ASSEMBLY VIEW FEATURES: • Scalable passive solutions • Optimized for cost performance with

T405R

Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
Contextual Info: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide

MIL-C-47113

Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

Wakefield Thermal Solutions

Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
Contextual Info: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:

BGA 64 PACKAGE thermal resistance

Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
Contextual Info: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight

T405R

Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Contextual Info: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink

BERULUB FR 16 B

Abstract: circuit diagram of 5kw smps full bridge thyristor aeg UC3854 5kw harmer simmons BERULUB FR 16 Grease Berulub FR 16 Berulub FR 66 5kw smps pfc ups PURE SINE WAVE schematic diagram
Contextual Info: Reliability Reliability General Power semiconductors used in high power electronic equipment are exposed to different conditions compared to plastic encapsulated components applied in equipment used for communication electronics. Controlling and converting of high power

BERULUB FR 16

Abstract: ixys vuo 52-16 ups PURE SINE WAVE schematic diagram Vienna Rectifier TL 82036 BERULUB FR 43 UC3858 schema inverter welding veridul BERULUB FR 16 B
Contextual Info: Application Notes & Technical Information Volume 2 Volume 1 Contents Title Page Standard IGBT "G" Series M1 - 2 What is a HiPerFET Power Mosfet? M1 - 3 New 1600 V BIMOSFET Transistors Open up New Appl. M1 - 5 Comparative Performance of BIMOSFET in FLY Back Converter Circuits

533002B02551

Abstract: 530614 00 AAVID THERMALLOY COMPOUND 250 577102b04000 63815 MULTIWATT die semiconductors cross index CC 3053 566010B03400 53010-1
Contextual Info: PRODUCT SELECTION GUIDE Condensed AAVID THERMALLOY AAVID THERMALLOY PRODUCT SELECTION GUIDE Condensed This condensed catalog features the more popular devices and configurations that Aavid Thermalloy produces today to cool high speed microprocessors and other commonly used semi