61995AB124D1
Contextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 304 C4QFP, 255 CBGA 609 SERIES Standard P/N 609-50AB 609-100AB 40mm C4QFP 21mm CBGA Base Dimensions in. (mm
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BGA 64 PACKAGE thermal resistance
Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
Contextual Info: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight
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624-25ab624-35ab624-45ab624-60ab+5bga 64 package thermal resistancebga package thermal resistance612-series643-35ap655-53ab
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7476
Abstract: P628 CX486slc D10650-40 pin fin heat sink 624-25AB 655-26AB 655-53AB 658-25AB 658-35AB
Contextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs Unidirectional Fin Heat Sink for AMD Am386 , PowerPC™ 601 659 SERIES Standard P/N 659-65AB ̆ 14 x 14, 38, 40 mm CQFP Base Dimensions in. mm Height in. (mm)
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am386659-65ab7476p628+8cx486slcd10650-40pin fin heat sink624-25ab655-26ab655-53ab658-25ab658-35ab
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Wakefield Thermal Solutions
Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
Contextual Info: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:
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wakefield thermal solutionschomerics* t405bergquist bp-108d10650-40+6658-35ab77abdatasheet of bgast405bga package weightt411
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T405R
Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
Contextual Info: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide
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0486sxi860xri960cai960cf+15am486dx2am486dx4669-32ag669-33ab669-40abt405rchomerics* t405bergquist softfacet410rintel 82495bergquist bp-108intel 80486sxintel 82495 cache controller651bthermal printer 2 inch
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T405R
Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Contextual Info: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink
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BERGQUIST softface
Abstract: 61995AB124D1
Contextual Info: Thermal Management Solution for BGA and Pow e r P C packages Wakefield Engineering’s Series 619 fan heat sink provides processor spot cooling with direct impingement air flow. Features and Benefits : ♦ Captivated clips for ease of assembly Designed for use on a variety
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