BD40 Search Results

BD-406

Abstract: BD406N-BD406P bd406
Contextual Info: BD406N-BD406P 40 AMP Block Diodes 特征 BLOCK DIODE FEATURES .大电流承受能力.High current capability .高压利用能力.High voltage available .玻璃被钝化的压模结构.Glass passivated die construction .高浪涌承受能力.High surge current capability

Contextual Info: BD40-931 Diodes Single-Phase Full-Wave Bridge Rectifier Military/High-RelN I O Max.(A) Output Current50 @Temp (øC) (Test Condition)60 V(RRM)(V) Rep.Pk.Rev. Voltage400 I(FSM) Max.(A) Pk.Fwd.Sur.Cur.500 V(FM) Max.(V) Forward Voltage1.1 @I(FM) (A) (Test Condition)25

Contextual Info: BD402N-BD402P 40 AMP Block Diodes 特征 BLOCK DIODE FEATURES .大电流承受能力.High current capability .高压利用能力.High voltage available .玻璃被钝化的压模结构.Glass passivated die construction .高浪涌承受能力.High surge current capability

BD404N-BD404P

Abstract: BD404N 40Amaximum
Contextual Info: BD404N-BD404P 40 AMP Block Diodes 特征 BLOCK DIODE FEATURES .大电流承受能力.High current capability .高压利用能力.High voltage available .玻璃被钝化的压模结构.Glass passivated die construction .高浪涌承受能力.High surge current capability

TIP290

Abstract: 2N4001 diode MJ029C 2SC1624Y TIP-290 2N2202 BDY66 2SC16250 2N2204 TO-202AC
Contextual Info: POWER SILICON NPN Item Number Part Number I e 5 10 15 20 >= 30 BC618l 2N2405 2N2405S 2N2405S oTl1634 2N2611 SSP58C MJ029C b!F~f~4 35 40 BD400 2N2201 2N2202 2N2203 2N2204 2N2988 2N2992 2N2472 ~~~:~~ 45 50 2N2995 STll0 STll05 SVT100-5 DTl1654 2N5681 2N4001

BD401N-BD401P

Contextual Info: BD401N-BD401P 40 AMP Block Diodes 特征 BLOCK DIODE FEATURES .大电流承受能力.High current capability .高压利用能力.High voltage available .玻璃被钝化的压模结构.Glass passivated die construction .高浪涌承受能力.High surge current capability

Contextual Info: BD4005N-BD4005P 40 AMP Block Diodes 特征 BLOCK DIODE FEATURES .大电流承受能力.High current capability .高压利用能力.High voltage available .玻璃被钝化的压模结构.Glass passivated die construction .高浪涌承受能力.High surge current capability

Contextual Info: 10-Element Bargraph, B—10 Series and 20-mm Large Lamp, B—40 series The ten element bargraph is designed to display visual information such as level, position, intensity in a graphic form. The large lamp is a multiple dice LED that can be used to draw attention or to achieve special effects.

T9550

Abstract: intel p8400 p8600 P9700 diode AH44 320-122 T9900 X9100 CXE DIODE micro switch lie n41
Contextual Info: Intel Core 2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Intel® Core™2 Extreme Mobile Processor on 45-nm Process Datasheet For platforms based on Mobile Intel® 4 Series Express Chipset Family March 2009 Document Number: 320120-004

Contextual Info: Mobile 3rd Generation Intel Core Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family Datasheet, Volume 1 of 2 June 2013 Document Number: 326768-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

c 337 25

Abstract: SC160D tic 2160 triac V130HE150 General electric SCR C220 ES5449 4533 gem 2n4401 2n3904 2222a 1N21 es5451
Contextual Info: GENERAL ^ E L E C T R I C SEMICONDUCTORS SEMICONDUCTEURS * HALBLEITER CONTENTS SOMMAIRE INHALT I N D E X . 3 I N D E X . 3

FB75

Contextual Info: PRELIMINARY DATA SHEET MICRONAS Edition March 16, 2000 6251-459-3PD MAS 3507D MPEG 1/2 Layer 2/3 Audio Decoder MAS 3507D PRELIMINARY DATA SHEET Contents Page Section Title 5 5 6 6 6 1. 1.1. 1.2. 1.2.1. 1.2.2. Introduction Features Application Overview Multimedia Mode

TC4042BP

Abstract: TC4042 SCL4042 hfe4042 CD4042B MC14042B MSM4042 MSM4042BRS M4042BP BU4042B
Contextual Info: - 64 - 4042B Quad T ra n s p a re n t L a tc h □ V 5 "J 5 a, i -1 6 V q d Qo 2 • ^ + ^ foiJF ÖT röu5- . ätcke s I 7 m m m 9 A? ^ 7/^ 4 t'/h T/ 4 7Ü-/7 ? ’j r T 'J -t -y b 3 X f- h 15 Q j i t rf-14 Oj D0 A 13 Oj CLOCK 5 2 O', POLA­ RITY a l l in p u ts a r e

Contextual Info: Pin Information for the Stratix V 5SGXA5 Device Version 1.2 Note 1 Bank Number GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1 GXB_L1

d37c

Contextual Info: DIP Type Common Mode Signal Line DIP Noise Filters D-37C, 40C, 42C, 45C, 47C [RoHS [RoHS Compliant] Compliant] Model Number of terminals/ Circuits Rated voltage DC V Rated current DC (mA/Line) DC resistance (m⏲/Line) max. Operating temperature range (˚C)

g41 motherboard repair

Abstract: TOM - 2088 - BH AF 82801 IBM TOM 2088 BH gm45 intel intel chipset g33 motherboard repair 2088 rgb matrix 320123 laptop lcd cable 30 pin diagram intel g31 motherboard repair
Contextual Info: Mobile Intel 4 Series Express Chipset Family Datasheet August 2008 Document Number: 320122-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

bddf

Contextual Info: CP3SP33 www.ti.com SNOSCW5 – MAY 2013 Connectivity Processor with Cache, DSP, and Bluetooth , USB, and Dual CAN Interfaces Check for Samples: CP3SP33 1 Introduction 1.1 Features 123 • CPU Features – Fully static RISC processor core, capable of operating from 0 to 96 MHz with zero

TPS5117

Abstract: SN0608098 EMC4002 MEC5035 SRN100KJ-6-GP BCM5761 WISTRON power sequence EPSON C691 MAIN THERMAL fuse M33 07F schematic lcd inverter dell
Contextual Info: 5 4 3 2 1 D D FOOSE 15" UMA Schematics Document uFCPGA Mobile Penryn www.kythuatvitinh.com 2008-06-04 Intel Cantiga-GM + ICH9M C C REV : -1 B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM A A Wistron Corporation

cx3804

Abstract: pegatron pegatron A35 A35 pegatron diode c0510 pegatron a24 Cx3808 q8607 IT8752E tpc8118
Contextual Info: 5 4 3 M52V BLOCK DIAGRAM 2 1 Power CPU VCORE PENRYN DC&QC Page 80 System Page 3~5 D D Page 81 FSB 1066MHz 1.5VS & 1.05VS LCD Panel Page 82 Page 45 PCIE x16 MXM CRT DDR2 800MHz CANTIGA nVIDIA NB9x Page 46 DDR & VTT DDR2 So-DIMM Page 83 Page 7~9 Page 70 +2.5VS

U665B

Abstract: SCD1U10V2KX-5GP aol14 H5PS5162 0R2J-2-GP ICS9LPRS365YGLFT-GP TPS51125 WPC775L RTM875T-606 si7686
Contextual Info: A C D Mobile CPU CLK GEN. PCB STACKUP 667/800/1066MHz@1.05V 800/667MHz Cantiga AGTL+ CPU I/F 12,13 LVDS DDR Memory I/F PCI-EG INPUTS 71.CNTIG.00U 12,13 X4 DMI 400MHz 4 36 OUTPUTS DCBATOUT 1D8V_S3 10A RT9026 35 DDR_VREF_S0 (1.5A) S 1D8V_S3 GND DDR_VREF_S3

bosch 0 281 003 039

Abstract: kb3926 bosch amplifier 0831 006 003 IDT92HD75 bosch 0 281 003 009 rtl8102el 0 281 020 032 bosch BOSCH 0 281 005 019 BOSCH 0 281 003 024 92HD75
Contextual Info: 1 2 3 4 5 7 8 Jones/Cujo BLOCK DIAGRAM PCB STACK UP 6L UMA LAYER 2 : SGND 14.318MHz PAGE 4 A 478P uPGA /35W PAGE 3,4 LAYER 3 : IN1 01 CPU THERMAL SENSOR CPU Penryn LAYER 1 : TOP A 6 CLK_CPU_BCLK,CLK_CPU_BCLK# CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK# LAYER 4 : IN2

SLG8SP553V

Abstract: KB926 LA4101P SP8K10 LM 4863 D FBMA-L11-201209-221LMA30T 4101p ich9 JMB385 compal notebook schematics
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_GM+ICH9-M core logic 3 3 2008-01-01 4 4 Compal Secret Data Security Classification 2007/08/28 Issued Date 2006/03/10 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

KB3926

Abstract: RTM875N-606-VD-GR bosch 0 281 003 039 Quanta qt6 bosch AXF 12V ME4410A G9931P1U bosch 0 281 003 009 bosch amplifier 0831 006 003 BOSCH 281 005 019
Contextual Info: 1 2 3 4 PCB STACK UP 6L 5 7 8 QT6 BLOCK DIAGRAM LAYER 2 : SGND 14.318MHz PAGE 4 A 478P uPGA /35W PAGE 3,4 LAYER 3 : IN1 01 CPU THERMAL SENSOR CPU Penryn LAYER 1 : TOP A 6 CLK_CPU_BCLK,CLK_CPU_BCLK# CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK# LAYER 4 : IN2 DREFCLK,DREFCLK#

samsung 822

Abstract: 37 TV samsung lcd Schematic circuit diagram samsung lcd tv power supply schematic schematic diagram crt tv samsung BD40 SAMSUNG TV 40 LCD SAMSUNG ELECTRONICS BA44 schematic atx 2.03 P4 37 TV samsung lcd Schematic g1003 lyon samsung
Contextual Info: -이 기술 자산으로 승인자만이 사용할사용할 수 있습니다 이 문서는 문서는삼성전자의 삼성전자의 기술 자산으로 승인자만이 수 있습니다 - This can notnot be be used without Samsung's authorization ThisDocument