6JK3
Abstract: BC733 bc735 usb common mode choke BC380 BC628 MMDR BC148 pin configuration BC702 Wistron Corporation
Contextual Info: A B C D E D H2 BLOCK DIAGRAMVER.-4 Project Code 4 4,5 3 ICS 94239 M/B D/D LAUNCH CDROM IR 2ND HDD DESKTOP CPU For ENG Willamette For M/P Northwood CLK GEN 6 0.18u 1.3G~1.8G G768D 0.13u 2.0G~2.4G 500mA; 600mA 15 7,8 9,10,11 3 2002/06/06 DDR*2 MCH 15 ATI P6
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42z0101384-saadp3203150ma+16g768d500ma600ma41t0141t0241t036jk3bc733bc735usb common mode chokebc380bc628mmdrbc148 pin configurationbc702wistron corporation
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bc733
Abstract: PLW3216S 74BC645 bc732 TSLCX74 BC242 foxconn BC148 pin configuration 6JK3 wistron
Contextual Info: A B C D H2 BLOCK DIAGRAM E 2002/02/18 VER.S2 Project Code Project Code 4 4,5 DESKTOP CPU For ENG Willamette For M/P Northwood 3 CLK GEN ICS 94239 M/B D/D LAUNCH CDROM IR 2ND HDD 0.18u 1.3G~1.5G 0.13u 2.0G~2.4G 6 G768D 48.41T01.001 48.41T02.001 48.41T03.001
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41t0141t0241t0341t05+1541t0643m0341tz1g768d01384-sabc733plw3216s74bc645bc732tslcx74bc242foxconnbc148 pin configuration6jk3wistron
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R5C485-LQFP144
Abstract: bc725 BC698 BC236 BC709 bc711 BC717 BC683 RC300MB SMD RA3 PNP
Contextual Info: 8 Part List 8-1 Exploded View 8-1-1 System Exploded Housing Bottom P28 8-1 This Document can not be used without Samsung’s authorization. 8 Part List No Part Name Code No Q’ty Specification Vendor 1 UNIT/HOUSING-BOTTOM BA75-01374A 1 SON & ARRK 2 FAN BA31-00018A
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ba75-01374aba31-00018aba92-02744aba75-01375a+16ba59-01294aba61-00910aba43-00134aba75-01376aba59-01052aba75-01377ar5c485-lqfp144bc725bc698bc236bc709bc711bc717bc683rc300mbsmd ra3 pnp
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1g22SB
Abstract: SB3211 BC741 SIS 648 SB315 CP2216 AMS1117 1104 BC246 RB342 diode sb315
Contextual Info: M A R G A I D K C O L B M E T S Y S D 3 K PCB LAYER High Speed DDR-SDRAM K4D263238A-GC36 Clock Gen CY28381 100MHz P.17,18 DeskTop CPU Northwood FSB 400/533MHz P.11 2.5V 266/333MHz P.19 275MHz P.5,6 P.3 DDR*2 CRT CONN Delay Buffer CY28352 2.5V 266/333MHz P.4
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cy28381k4d263238a-gc36100mhz400/533mhz+15275mhz266/333mhzcy28352nv18-pro133mhz1g22sbsb3211bc741sis 648sb315cp2216ams1117 1104bc246rb342diode sb315
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BC245C
Abstract: BC822 bc810 max1987 BC495 RTL8110S-32 BC819 BC823 ALC202A ar9270
Contextual Info: 5 4 3 S04 BLOCK DIAGRAM Dothan Yonah /Alviso D +1.8V +1.5V 478 Pins (Micro-FCPGA) FSB 4X100MHZ 4X133MHZ VDIMM DDR SDRAM 2.5V, 400/500MHz DDR-SODIMM1 Clocks +3V CPU Thermal Sensor P:5 MAX6648 PCI-Express x16(GFX) +1.5V CK410 CYPRESS: CY28411 IDT Video Controller
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max1987max1715max1999ck410+15cy28411cv125max1993max8550max6648max8527bc245cbc822bc810bc495rtl8110s-32bc819bc823alc202aar9270
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bc725
Abstract: BC248 BC249 BC195 BC105* BC106* BC107* BC108* BC109* BC110 bc711 BC710 bc188 BC712 BC246
Contextual Info: This Document can not be used without Samsung’s authorization. 9 Schematic Material List 9-1 Main Board Part List Code Location Category Spec 0902-001840 D 730 IC-MICROPROCESSOR 730PGA,1.6GHz,64Bit,uF 3709-001236 J1 CONNECTOR-CARD EDGE 68P,1.27MM,ANGLE,AU
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100nf2k/33ohm220pf10000nf+10bc725bc248bc249bc195bc105* bc106* bc107* bc108* bc109* bc110bc711bc710bc188bc712bc246
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BC539
Abstract: SCD1U10V bc540 BC541 BCB25 BCB47 bc647 ICS952023 bc639 b35 ICS952023FT
Contextual Info: CLK GEN Toucan2+ DesKtop-CPU Northwood 2.2~3.2GHz ICS:ICS952023FT DDRBUF:ICS93732 3,4 5,6 Project code: PCB P/N : REVISION : VRAM*2 FSB 800/533/400MHz K4D263238M-QC40 CRT 17 2.5V 200MHz/266/333MHz DDR * 2 11,12,13 CD-ROM AGP 4X SiS963 24 W/RTC PHY 20,21,22,23
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ics952023ftics93732k4d263238m-qc40800/533/400mhz+15200mhz/266/333mhz47y01sis648fx66mhz16bits/533mbsata100bc539scd1u10vbc540bc541bcb25bcb47bc647ics952023bc639 b35
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Foxconn L S-36
Abstract: wistron rc71 MH187 BC643 b1535 foxconn Wistron Corporation BCC-11 BC148 pin configuration
Contextual Info: CPU TV OUT LCD VGA LVDS PG.18 PG. 14,15,16,17 PG.26 PG.29,30 CARDBUS PORT 802.11b 1394 PORT LAN LAYER 5 SIGNAL LAYER 6 GND RJ45 RJ11 PRIMARY IDE TXFM LAYER 7 SIGNAL ATA 66/100 LAYER 8 COMPONENT MDC PG.21 PG.32 PG.28 LPC DEBUG CONN 1st HDD CD ROM PG.38 FIR
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66mhz100mhz266mhzmap-17+1533mhz44t01upd72010048mb/s8100blfoxconn l s-36wistronrc71mh187bc643b1535foxconnwistron corporationbcc-11bc148 pin configuration
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BC249
Abstract: BC248 BC246 bc711 bc725 bc732 BC247 BC217 samsung R519 BC735
Contextual Info: This Document can not be used without Samsung’s authorization. 9 Schematic Material List 9-1 Main Board Part List Code Location Category Spec 0902-001840 D 730 IC-MICROPROCESSOR 730PGA,1.6GHz,64Bit,uF 3709-001236 J1 CONNECTOR-CARD EDGE 68P,1.27MM,ANGLE,AU
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100nf2k/33ohm220pf10000nf+10bc249bc248bc246bc711bc725bc732bc247bc217samsung r519bc735
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