ARIES Search Results

Contextual Info: P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 15x15 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

FORCE-90

Abstract: B545 C17200
Contextual Info: Series 800 Vertisockets Horizontal Mounting with Collet Contacts FEATURES: • Aries offers a full line of Vertisockets™ for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. The variations of mounting positions provide exceptional design

Contextual Info: ARIES ELECTRONICS INC 5 ME J> 0T23053 000CHÛ3 27T EJECT-A-DIP RRIES P.O. Box 130, Frenchtown, NJ 08825 Phone 1-908-996-6841 FAX 1-908-996-3891 LOCK/EJECT DIP SOCKETS W ITH COLLET CONTACTS ELECTRONICS, INC. NOW: A rugged, solderable DIP socket with a unique ejector latch

Contextual Info: Series 650 Header Covers FEATURES: • Aries offers a complete line of DIP headers and covers useful for mounting components such as resistors, diodes, etc. Consult Data Sheet 12032 for mating DIP header information. • Four cover heights provide mounting of 1/8” [3.18] high

Contextual Info: DALLAS SEMICONDUCTOR DS2176 T1 Receive Buffer FEATURES PIN ASSIGNMENT • Synchronizes loop-timed and system-timed T1 data streams s ìg h C 1 24 H VDD RMSYNC C 2 • Two-frame buffer depth; slips occur on frame bound­ aries • Output indicates when slip occurs

Contextual Info: Series 514 TO Collet Sockets FEATURES: • Aries’ TO sockets feature molded chamfer lead-ins for easy device insertion. • High stand-off design for heat dissipation and easy cleaning. • External polarization for positive location. SPECIFICATIONS: • Body material is black UL 94-V0 Glass-filled 4/6 Nylon.

X55X

Contextual Info: Series X55X Universal Zero-Insertion-Force DIP Test Socket FEATURES • Aries Universal Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers. • All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers. • Contacts are normally closed to eliminate dependence on plastic to sustain contact.

B545

Abstract: C17200 SP200
Contextual Info: Series F40 Thru-Hole .040 [1.02] Female DIP Strips FEATURES: • This female DIP strip is used in conjunction with Aries’ Shorting Plug SP200, available separately, for your programming needs. • ”Break” feature allows strips to be cut to the number of positions

MILG-45204

Abstract: MIL-T-10727
Contextual Info: Series 675 DIP Program Headers FEATURES • Aries DIP programmable headers offer unusual versatility for programming within the header itself • They can be individually programmed using cutters or Aries programming tool, P/N T-675, available separately, to remove the interconnecting sections. Consult Data

95-132I25

Abstract: AMS-QQ-N-290
Contextual Info: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

Contextual Info: Series 537 Insert Plates for Universal PLCC ZIF Test Socket FEATURES • Seven separate Insert Plates are conveniently hand-inserted into Aries ‘Live Bug’ Universal PLCC ZIF Test Socket P/N 84-537-21 to hold seven different sizes of PLCC footprints. Consult Data Sheet 10010 for test socket information.

stl 106 a

Abstract: MIL-T-10727
Contextual Info: Series 100 thru 111 DIP Jumpers FEATURES: • Aries offers a wide array of DIP jumper configurations and wiring possibilities for all your programming needs. • Reliable, electronically tested solder connections. • Protective covers are ultrasonically welded on and

lenovo

Abstract: OZ862AS lenovo t42 VIA10 foxconn FB-23 VIA15 FMC-101 Lenovo fpc R4573
Contextual Info: 本图纸版权属原厂家所有 5 仅在服务该产品使用者时使用 4 3 立成网：综合性笔记本维修服务平台 2 1 < SONOMA > DC/DC & Charger CPU VR ARIES II BLOCK DIAGRAM Dothan Yonah /Alviso D +1.8V MAX6648 +VCCP C P:5 P:4 VCORE_VGA LVDS

Contextual Info: Series X518 Single and Dual Row Collet Sockets with Solder Tail Pins FEATURES: • Aries collet sockets are available in single or dual rows. • Cuttable to the number of pins desired to fit the application. • Side-to-side and end-to-end stackable. SPECIFICATIONS:

ASTM-B194-01

Abstract: 13005 13005 2 B545 C17200
Contextual Info: Series 800 Vertisockets Vertical Mounting with Collet Contacts FEATURES: • Aries offers a full line of VertisocketsTM for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. The variations of mounting positions provide exceptional design

LA 4440 IC

Abstract: LA 3840 ic la 4440
Contextual Info: ARIES ELECTRONICS INC SME D • SERIES BC FEMALE BOX CONNECTOR GTEBDiB 0001003 7bb P .O . B o x 1 3 0 , F r e n c h t o w n , N J 0 8 8 2 5 P h o n e 1 - 9 0 8 -9 9 6 -6 8 4 1 F A X 1 - 9 0 8 -9 9 6 -3 8 9 1 §] FI R I E S SI ELECTRONICS, INC. FEATURES • Connector assem blies mate with .025"

14033

Contextual Info: Pin Grid Array Socket/Header on 0.100 [2.54] Centers w/Solder Pin Tails FEATURES • Aries offers a wide number of pin grid array configurations from which to choose. • Low-insertion-force contacts standard. GENERAL SPECIFICATIONS • PGM SERIES SOCKET BODY: black UL 94V-0 glass-filled 4/6 Nylon

Contextual Info: Series 637 Universal PLCC ZIF Test Socket Receptacle Features: • 84 pin socket receptacle for mounting Aries’ Series 537 Universal PLCC ZIF Test Sockets. Consult Data Sheet Nos. 10008 thru 10011 for additional test socket information. • Mounting hardware included.

Contextual Info: Series 115, 116, & 117 DIP-ER Logic Jumper Features: • Aries offers a wide array of DIP jumper configurations and wiring possibilities for all your programming needs. • Reliable, electronically tested solder connections. • Protective covers are ultrasonically welded on and

Contextual Info: Series 800 Vertisocket Horizontal Mounting w/Collet Contacts FEATURES • Aries offers a full line of Vertisocket™ for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. The variations of mounting positions provide exceptional design freedom.

13002

Abstract: HB 541 X810 MIL-T-10727 c s x 13001 H 08
Contextual Info: -f l O — no - - sqs Series 800 Vert¡sockets" Vertical Mounting with Bifurcated Contacts FEATURES: • Aries offers a full line of Vertisockets for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc.

ASTM B194

Abstract: ASTM-B16-85 C17200 MIL-G45204
Contextual Info: Part Nos. 1106396 & 1107254 Row-to-Row DIP Adapter Sockets FEATURES: • Aries’ adapter sockets allow the use of .300 [7.62] center devices when the PCB is drilled on .600 [15.24] centers and vice-versa, giving the flexibility of using .600 [15.24] or .300 [7.62] center devices in the same application.

Contextual Info: ARIES ELECTRONICS INC S4E ]> □T23DS3 DOGDT? T7b RRIES P.O. Box 130, Frenchtown, NJ 08825 Phone 1-908-996-6841 FAX 1-908-996-3891 L O - PRO file Sockets ELECTRONICS, INC. A %3 C5 .30 7,62 fo r 6 pin .40 (10,16) fo r 8 pin .70 (17,78) fo r 14 pin .80 (2 0 3 2 ) fo r 16 pin

MIL-T-10727

Abstract: QQN-290 Hitachi "J suffix" 405701 QQ-N290
Contextual Info: ARIES ELECTRONICS ÎNC S4E D • 0^23053 □ D 0 0 ti73 320 ■ A R IE S P IN C O N T A C T S T Y L E S .F O R A L L H E U U IK t M b N T S fe atu re s: ARIES SIN G LE BEAM FACE-GRIP CONTACT • Performance at competitive price for production use. • Low profile - .165 4,19 max. IC seating plane.