package
Abstract: aon4409 AON3404 AON3603 AON4404 AON4605 AON4604 AON4703 Alpha Omega cross AON4405
Contextual Info: Document No. DSMT-0003 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN3x2 and DFN3x3 Punched Packages Introduction DFN package is a plastic encapsulated package with a copper lead frame substrate. It offers near chip scale footprint, thin profile, low weight and good thermal and electrical performance.
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dsmt-0003aon3603aon3404aon4402+11aon4405aon4602aon4603aon4701packageaon4409aon4404aon4605aon4604aon4703alpha omega cross
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