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Catalog Datasheet	Type	Document Tags	PDF
90Pb 10Sn solder paste Abstract: underfill with or without underfill Flip Chip Substrate nitto chip Contextual Info: APPLICATION NOTE Solder bumped ICs AN01028 Philips Semiconductors Application information Solder bumped ICs AN01028  Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright	Original	an01028 sca73 853503/01/pp20 90pb 10sn solder paste +4underfill with or without underfill flip chip substrate nitto chip	PDF

Catalog Datasheet

Type

Document Tags

PDF

90Pb 10Sn solder paste

Abstract: underfill with or without underfill Flip Chip Substrate nitto chip
Contextual Info: APPLICATION NOTE Solder bumped ICs AN01028 Philips Semiconductors Application information Solder bumped ICs AN01028  Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright

Original

an01028 sca73 853503/01/pp20 90pb 10sn solder paste +4

PDF