AMKOR TECHNOLOGY Search Results

laptop ic list

Abstract: NS6040 contactor Amkor Technology handler
Contextual Info: data sheet TEST CONTACTOR FusionQuad Test Contactor Test Hardware List: Amkor FusionQuad® Test Contactor: Amkor Technology is now offering the FusionQuad® Test Contactor Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective

NS6040

Abstract: amkor DS814A pop sheet DS814 PoP PACKAGE TESTING contactor
Contextual Info: data sheet TEST CONTACTOR PoP Dual Sided Test Contactor Features: • • • • • Benefits: • Single socketing for testing both sides of package • Improved test coverage Stacked Package Amkor PoP Package on Package Dual Sided Test Contactor: Amkor Technology is now offering the PoP

CDIP

Abstract: glass frit electronics
Contextual Info: data sheet CERAMIC / HERMETIC CDIP / CerDIP Ceramic Dual-Inline Package CDIP / CerDIP Amkor Technology is committed to continuing to service this long established standard industry package. The Amkor Technology CDIP capability provides a wide range of lead counts and body

CERPAK

Abstract: glass frit electronics DS802
Contextual Info: data sheet CERAMIC / HERMETIC CerPak Ceramic Pack CerPak Amkor Technology continues to service this established industry package. The Amkor Technology CerPak capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The

Contextual Info: data sheet CERAMIC / HERMETIC CQFP Ceramic Quad Flat Pack Package CQFP Amkor Technology is continuing to service this established industry package. The Amkor Technology CQFP capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The

MO-112

Abstract: MS-022 MS-029 DS250G JEDEC standard 033
Contextual Info: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,

MO-112

Abstract: MS-029 MATRIX TRAY MS-022 LD240
Contextual Info: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced

LD 337

Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Contextual Info: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material

MS-001

Abstract: MO-010 MS-011
Contextual Info: LEADFRAME data sheet PDIP Features: Plastic Dual In-Line PDIP Packages: Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of

"0.4mm" bga "ball collapse" height

Abstract: BGA PACKAGE thermal profile BGA reflow guide BGA and QFP Package 304 QFP amkor BGA and QFP Package ibm paste profile pitch 0.4mm BGA pcb warpage* in smt reflow Amkor SBGA
Contextual Info: Applications Notes on Surface Mount Assembly of Amkor/Anam PBGA and SuperBGA Packages Paul Mescher October, 1995 amkor anam 1347 N. Alma School Road Chandler, AZ 85224 1.0 Introduction Ball Grid Array packages provide a new challenge for the surface mount industry. In all

MO-010

Abstract: MS-011 MS-001 MO-026
Contextual Info: LEADFRAME data sheet PDIP/SPDIP Features: Plastic Dual In-Line PDIP Packages: Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of

MO-153

Abstract: MO-187 MO-194 PPF leadframe MO153 MO-153 Packages JEDEC MO-187 JEDEC MO-153 38 Amkor mold compound tssop
Contextual Info: LEADFRAME data sheet TSSOP Features: Thin Shrink Small Outline Package TSSOP : With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research

DS811

Contextual Info: data sheet CERAMIC / HERMETIC PPGA Plastic Pin Grid Array Package PPGA Amkor Technology incorporates the most advanced assembly processes for today and tomorrow's cost/performance applications. This IC package technology allows application and design engineers to optimize innovations while

SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

Abstract: amkor
Contextual Info: service green packaging Green / Pb Free Technology Solution A combination of governmental legislation and consumer sentiment has driven the Electronics Industry in general and Semiconductor Packaging specifically to adopt more environmentally friendly materials and processes. Amkor is a leader in the

Contextual Info: data sheet CERAMIC / HERMETIC Flat Pack Ceramic Flat Pack Package FP Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has leads brazed to

HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

JEDEC Jc-11 free

Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
Contextual Info: LAMINATE data sheet Package on Package PoP Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA platform in the 4th quarter of 2004. The next four years saw many new

MS-026 lqfp 80

Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging

nitto GE

Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
Contextual Info: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array PBGA : Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application

DS810

Contextual Info: data sheet CERAMIC / HERMETIC LCC Leadless Chip Carrier Package LCC Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has metalized

sumitomo EME G700L

Abstract: SUMITOMO g700l g700l Loctite 536 EME-G700 EME G700L lead frame cu C194 ablestick tqfp upsd
Contextual Info: 05/12/06 µPSD ATK Assembly Qualification Test Report The following report summarizes the qualification testing of the uPSD family of µPSD Microcontrollers additional assembly and test locations AMKOR Technology Korea. To meet the increased product demand, and to enable flexibility for

IPC-9701

Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
Contextual Info: LAMINATE data sheet FCMBGA Features Thermal Performance Flip Chip Molded Ball Grid Array FCMBGA Packages: Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the

MO-166

Abstract: PPF leadframe MO166 MS-013 tip 142
Contextual Info: LEADFRAME data sheet PowerSOP 2&3 Features: Thermal Resistance: PowerSOP® Packages: PSOP This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP (PSOP) improves

BGA 64 PACKAGE thermal resistance

Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect