ALUMINUM NITRIDE QFP Search Results

FPT-256C-C02

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02

FPT-256C-C03

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03

Aluminum nitride QFP

Abstract: 368c diode 368-pin
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 368 PIN CERAMIC FPT-368C-C01 368-pin ceramic QFP Lead pitch 0.40 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-368C-C01

Contextual Info: QUAD L-LEADED PACKAGE 304 PIN CERAMIC FPT-304C-C02 Lead pitch 0.50mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Base ceramic material Aluminum nitride 304-pin ceramic QFP FPT-304C-C02 304-pin ceramic QFP (FPT-304C-C02)

Aluminum nitride QFP

Contextual Info: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN CERAMIC FPT-304C-C02 304-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-304C-C02

Aluminum nitride QFP

Abstract: nitride
Contextual Info: QUAD FLAT L-LEADED PACKAGE 160 PIN CERAMIC FPT-160C-C02 Lead pitch 0.65mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm Base ceramic material Aluminum nitride 160-pin ceramic QFP FPT-160C-C02 160-pin ceramic QFP (FPT-160C-C02)

368-pin

Abstract: Aluminum nitride QFP
Contextual Info: QUAD FLAT L-LEADED PACKAGE 368 PIN CERAMIC FPT-368C-C01 Lead pitch 0.40mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Base ceramic material Aluminum nitride 368-pin ceramic QFP FPT-368C-C01 368-pin ceramic QFP (FPT-368C-C01)

296-0025

Abstract: Aluminum nitride QFP
Contextual Info: QUAD L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02 256-pin ceramic QFP (FPT-256C-C02)

nitride

Contextual Info: QUAD FLAT L-LEADED PACKAGE 160 PIN CERAMIC FPT-160C-C04 160-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80 mm Base ceramic material Aluminum nitride FPT-160C-C04 160-pin ceramic QFP (FPT-160C-C04)

nitride

Contextual Info: QUAD FLAT L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03 256-pin ceramic QFP (FPT-256C-C03)

nitride

Abstract: Aluminum nitride QFP method 208
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-208C-C03 208-pin ceramic QFP (FPT-208C-C03)

nitride

Abstract: Aluminum nitride QFP C1995
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C04 Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Aluminum nitride 208-pin ceramic QFP FPT-208C-C04 208-pin ceramic QFP (FPT-208C-C04)

Aluminum nitride QFP

Abstract: 368-pin
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 368 PIN CERAMIC To Top / Package Lineup / Package Index FPT-368C-C01 368-pin ceramic QFP Lead pitch 0.40 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

304-pin dimensions

Abstract: 304 QFP 304 pin ceramic
Contextual Info: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN CERAMIC To Top / Package Lineup / Package Index FPT-304C-C02 304-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

256 pin ceramic Quad flat package

Abstract: FPT-256C-C03
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

Contextual Info: UbE D SILICON SYSTEMS INC • aaSB'ibS Q00S27b 0 ■ SIL T -Y 2-7? CUSTOM SOLUTIONS s m m s iis k m s A TDK Group/Company SILICON SYSTEMS LEADS THE WAY DEVELOPING MIXED-SIGNAL CUSTOM PRODUCTS. Faster to market for mixed-signal applications Whatever your mixed-signal design application, Silicon

K612

Abstract: underfill FR4 epoxy dielectric constant 3.2 Dielectric Constant Silicon Nitride K810 FR4 substrate height and thickness ltcc chip fine line bga thermal cycling reliability
Contextual Info: Bourns Microelectronic Modules Packaging Solutions Device Mounting Technology Surface Mount Technology Surface mounting is still the most common and economical approach for many applications. Bourns® Microelectronic Module products offer the latest in surface mount technology:

Contextual Info: TM September 2013 • What are Semiconductor Devices? • How Semiconductors are Made − Front-End Process − Back-End Process • Fabrication Facility and Equipment Issues • Business Aspects of Supplying Semiconductors TM 2 TM 4 A conductor carries electricity like a pipe

coil gold detector

Abstract: SOLID CONDUCTOR WIRE, MIL SPEC Aluminum nitride QFP 4164 dynamic ram Book Microelectronic cpu aeroflex military mcm military mcm 1553 4164 ram arena
Contextual Info: Aeroflex Plainview Custom Hybrid, MCM, Module, Box Assembly and Testing Services Fact Sheet February 2009 INTRODUCTION PRODUCTION CAPABILITIES Aeroflex Plainview for over thirty-five years has been a leader in the microelectronic packaging arena. Our MCM technology

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

TC180G21

Abstract: TC180G TC160G single port RAM TC180 0724 XBRL16 toshiba ASIC
Contextual Info: TOSHIBA TC180 Series CMOS ASIC Family 3.0V/3.3V, 0.5nm1 The TC180 series increases system performance and device integration while reducing power. Benefits • True 3.0/3.3V 0.5 micron CMOS process with fast 230ps gate delays • Reduced power consumption makes lower cost plastic packag­

TOSHIBA GATE ARRAY

Abstract: TC183e Rambus ASIC Cell tc183
Contextual Info: TOSHIBA TC183G/E CMOS ASIC Family 3.0V/3.3V and 5.0V, 0.5nm1 TheTC183G/E eases the transition from 5V to 3V based systems. Benefits • Mixed 3.0/3.3V and 5V I/O 0.5 micron CMOS process with fast 230ps gate delay performance with the pow er savings of a 3V core

tc183

Abstract: E17G tc183G TC163G TC180G single port RAM TC183e Toshiba TC8570
Contextual Info: TOSHIBA TC183G/ECMOS ASIC Family 3.0V/3.3V and 5.0V, 0.5nm1 TheTC183G/E eases the transition from 5V to 3V based systems. Benefits • Mixed 3.0/3,3V and 5V I/O 0.5 micron CMOS process with fast 230ps gate delay performance with the power savings of a 3V core

DCDD SOT23-5

Abstract: corning frequency oven marking code H.5 Sot 23-5 10134 motorola MARKING BB SOT23-5 Newmarket Transistors
Contextual Info: MCCF33095 MC33095 Advance Information Integral Alternator Regulator The MCCF33095 Flip–Chip and MC33095 (Surface Mount) are regulator control integrated circuits designed for use in automotive 12 V alternator charging systems. Few external components are required for full