ALTERA TOP MARKING Search Results

ADV9707

Abstract: altera Date Code Formats lot Code Formats altera ALTERA PART MARKING Date Code Formats Date Code Formats Altera altera top marking altera "date code format" Identification Traceability ALTERA die identifier
Contextual Info: CUSTOMER ADVISORY TOP MARK TRACEABILITY ENHANCEMENTS As Altera adds additional sources of supply and in order for customers to maintain product traceability via device top mark, Altera will enhance its top marking scheme. In order to facilitate die identification, Altera will expand its current six character top mark date code and

ADV0012

Abstract: ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark
Contextual Info: CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Altera will begin marking a one-line internal traceability code on all BGA packages beginning January 2001. The Altera lot number, country of origin, and new internal marking code will be laser marked, or ink marked, on the top of all BGA packages for

ADV0201

Abstract: ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark
Contextual Info: CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE TOP MARK ENHANCEMENT Change Description: Altera will begin marking the assembly lot number and a one-line internal traceability code on all non-BGA packages beginning March 2002. Reason For Change: The assembly lot number and new internal traceability marking code will be laser or ink

EPCS64N

Abstract: EPCS64 EPCS64 phl programmer EPLD EPCS16
Contextual Info: EPCS64 Configuration Device Errata Sheet March 2005, ver 1.1 Introduction This document provides updated information on 64-Mbit EPCS64 serial configuration devices. These configuration devices can be used to configure Stratix II, Cyclone II, and Cyclone FPGAs.

PCN0904

Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this

PCN1002

Abstract: EPF10K100ARI240-3 EPM9560ARI208-10 EPM7256SRI208-10N EPF10K30RI208-4N epm9560ri208-20 EPF10K20RI208-4 EPF10K30RI240-4N EPM7256SRI208-10 EPF10K20RC208-4
Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION P CN1 0 0 2 Additional Assembly Source and Power Quad Flat Pack RQFP 208 and 240 Package Conversion Change Description Altera is introducing Amkor, Philippines (ATP) as an additional assembly source for the RQFP 208

ADV0812

Abstract: ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F
Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0812 ADDITIONAL PACKAGE OPTION FOR SELECTED STRATIX III FPGA DEVICES Description Altera will be introducing the Fine-Line BGA F1152 non-OPD on package decoupling 8-layer substrate design as an additional package option. The Stratix® III FBGA F1152 package is

eQFP 144 footprint

Abstract: vhdl code for lcd display for DE2 altera
Contextual Info: Adding New Design Components to the PROFINET IP AN-677 Application Note This application note shows how you can change the out-of-the-box PROFINET IP design so that it incorporates a UART interface that is implemented through the RS-232 port on the DE2-115 board from Terasic. The DE2-115 board is the main board

PCN0414

Abstract: EME-G700 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera’s Thin Quad Flat Pack TQFP packages. All

PCN0903

Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of

PCN0415

Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function.

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

PCN0901

Abstract: ALTERA PART MARKING EP1C12F256C8EC EP1C6F256C8N EP1C12F256C8N altera top marking DEVICE MARKING CODE table EP1C12F324I7N EP1C12F256C8 EP1C12F324C8N
Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0901 SUBSTRATE CHANGE FOR SELECTED FBGA PACKAGES Change Description This is an update to PCN0901; please see the revision history table for information specific to this update. Altera is implementing a substrate change on selected product lines assembled in the Fine-Line

MIL-I-8835A

Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Contextual Info: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from

PCN0412

Abstract: kyocera datecode IPC-9701 datasheet of BGAS DATE SHEET 9TH 10TH 0619 817A 9701 100C EP1S60 IPC 9701
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0412 Rev01 FINELINE BGA SUBSTRATE SECOND SOURCE KINSUS Change Description: Altera is adding the Kinsus substrate as an additional source for the FineLine BGA (FBGA) packages. The surface finish of the Kinsus substrate is electrolytic

camtex trays

Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

ADV0601

Abstract: altera top marking EP1K100 altera marking Code epf10k30a altera EPM7032B PCL 27 EP1C12 EP1K10 EP20K30E EP20K60E
Contextual Info: CUSTOMER ADVISORY ADV0601 Rev01 ADDITION OF ASSEMBLY PLANT FOR FBGA PACKAGES Change Description: Amkor, Philippines, will be added as an additional assembly source for Altera FineLine BGA® FBGA and Ultra FineLine BGA (UBGA) packages using BT-based substrates. This will not affect the current moisture rating for these packages. The current

PCN0803

Abstract: TI date code altera date code format marking ic 2008 EP1S60 stiffener ALTERA BGA packages PART MARKING date code marking stratix traceability FC1020
Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0803 PACKAGE-LID STIFFENER CHANGE FOR THE STRATIX FLIP-CHIP FAMILY Change Description Altera is introducing a dimension change to the package-lid stiffener for the Stratix FPGA flip-chip package. This effectively reduces the overall package height by approximately 0.2mm. This change

PCN1205

Abstract: EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3
Contextual Info: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION P C N1 2 0 5 ADDITIONAL ASSEMBLY SOURCE ASE AND TRANSITION TO CENTER PIN GATE MOLD FOR FBGA PACKAGES Change Description This is an update to PCN1205; please see the revision history table for information specific to this

PCN0715

Abstract: ABF-SH9K ABF-GX3 altera date code altera SOP top marking kyocera date code marking ic 2008 EP1S60 ALTERA 484 BGA packages PART MARKING
Contextual Info: Revision: 1.1.1 PROCESS CHANGE NOTIFICATION PCN0715 ALTERNATE KYOCERA SUBSTRATE FOR FLIP-CHIP PACKAGES Change Description This is an update to PCN0715, published Oct 2007. Altera is introducing an alternate Kyocera substrate as an additional source for the Stratix FPGA Flip-Chip packages. This change is being

PCN0515

Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently

PCN0902

Abstract: HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA
Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0902 ADDITIONAL ASSEMBLY SOURCE AND BILL OF MATERIAL CHANGE FOR ALTERA FLIP CHIP PRODUCTS Change Description This is an update to PCN0902; please see the revision history table for information specific to this

Contextual Info: Errata Sheet for Arria V GX and GT Devices ES-01036-2.0 Errata Sheet This errata sheet provides information about known device issues affecting Arria V production devices. Device Errata for Arria V Production Devices Table 1 lists the specific device issues and the affected Arria V production devices.

Contextual Info: Errata Sheet for Arria V GX and GT Devices ES-01036-2.3 Errata Sheet This errata sheet provides information about known device issues affecting Arria V production devices. Device Errata for Arria V Production Devices Table 1 lists the specific device issues and the affected Arria V production devices.