ACME10256 Search Results

Contextual Info: Hi-Flow 565UT Tacky, High Performance, Un-Reinforced Phase Change Thermal Interface Material Features and Benefits TYPICAL PROPERTIES OF HI-FLOW 565UT PROPERTY Color • Thermal impedance: 0.05°C-in2/W @25 psi • High thermal conductivity: 3.0 W/m-k

Contextual Info: Gap Pad VO Soft Highly Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO SOFT • Thermal conductivity: 0.8 W/m-K • Conformable, low hardness • Enhanced puncture, shear and tear resistance

Contextual Info: Hi-Flow 565U High Performance, Unreinforced Phase Change Thermal Interface Material Features and Benefits • Thermal impedance: 0.04°C-in2/W @25 psi • Very high thermal conductivity: 3.5 W/m-K • 52°C phase change temperature • Unsupported TYPICAL PROPERTIES OF HI-FLOW 565U

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

Contextual Info: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction

Contextual Info: Hi-Flow 330P Electrically Insulating,High Performance,Thermally Conductive Phase Change Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 330P • Thermal impedance: 0.18°C-in 2/W @25 psi • Natural tack for ease of assembly • Exceptional thermal performance in an

Contextual Info: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction

Contextual Info: Hi-Flow 300P Electrically Insulating,Thermally Conductive Phase Change Material Features and Benefits • Thermal impedance: 0.13°C-in2/W @25 psi • Field-proven polyimide film - excellent dielectric performance - excellent cut-through resistance • Outstanding thermal performance in an

ASTM d792

Abstract: astm D150 conductivity meter circuit for second tear C351 D149 D150 D2240 D257 D374
Contextual Info: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R • Thermal conductivity = 1.5 W/mK • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction

Contextual Info: Hi-Flow 650P Electrically Insulating, High Performance,Thermally Conductive Phase Change Material Features and Benefits TYPICAL PROPERTIES OF HI-FLOW 650P • Thermal Impedance: 0.20°C-in2/W @25 psi • 150°C high temperature reliability • Natural tack one side for ease of assembly

SIL-PAD density

Abstract: ACME10256 D149 D150 D2240 D257 D374 D575 D792 ASTM D374
Contextual Info: Gap Pad VO Soft Highly Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO SOFT • Thermal conductivity: 0.8 W/m-K • Conformable, low hardness • Enhanced puncture, shear and tear resistance