ABLEBOND EPOXY Search Results

mark a7 sot23

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1815, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Ablebond 84-1 LMISR4

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1812, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1813, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Tsi148-133IL

Abstract: G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1001-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: Apr 2, 2010 TSI148-133CL TSI148-133IL

mark a7 sot23

Abstract: J-STD-20A atec 6710S CDA194 mp8000
Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1816, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

CDA194

Abstract: mark a7 sot23
Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1810, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

LMISR4

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1811, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

CDA194

Abstract: mark a7 sot23 mold compound
Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1817, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1818, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Sumitomo G700K

Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

ABLEBOND

Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

G700K

Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

EME-G700A

Contextual Info: LOGIC Devices Green Initiative ROHS Policy LOGIC Devices Incorporated – Green Initiative – Rev. C 4/01/13 1 Table of Contents LOGIC Devices’ Green Initiative . 3

Nitto MP8000

Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

LMISR4

Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Contextual Info: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

sumitomo G700

Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
Contextual Info: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

ablebond 84-3J

Abstract: Ablebond 84-3j ricoh marking smd transistor 3j ABLEBOND 84-3 SMD-49 pc1a FM803TS3X ILC5061M31X
Contextual Info: Date Created: 1/23/2004 Date Issued: 2/25/2004 PCN # 20040407 FORECAST CHANGE NOTIFICATION This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence. This is a preliminary notification. A final PCN will

Ablebond 8380

Abstract: Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond APN3001
Contextual Info: Application Note Epoxy Die Attachment for GaAs Flip Chip Devices APN3001 A major concern in developing a process using epoxy as the attachment material for assembly is the exposure to temperatures and subsequent cooling during epoxy curing or the ability of the epoxy to withstand temperature cycling.

CDA194

Abstract: 9731
Contextual Info: 02/25/2003 RELIABILITY REPORT FOR DS2404 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

C18045

Abstract: CDA151 9918 9936
Contextual Info: 05/31/2005 RELIABILITY REPORT FOR DS80C390, Rev C3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

AMS-5511

Abstract: ams 5642 AMS-QQ-N-290 C173
Contextual Info: P/N APPLICABLE NOTE S BASIC SF CC CCSF CCCESF 1.2 1.2 1,2 1,2 1,2 M IE BY (2X 0 .102) EPOXY CAPTIVATION (.500 SQ) (.460) 5642 NOTES(S): SMA FEMALE INTERFACE PER M IL-STD-348 1. MATERIAL(S): 1.1 BODY: 304 SST PER A M S -5 5 1 1 1.2 CENTER CONDUCTOR: BeCu ALLOY C173 PER ASTM B -196.

Contextual Info: APPLICABLE NOTE S P/N BASIC SF 1.2 CC 1,2 C CSF 1,2 1.2 M1E BY 1.2 CCCESF (2X 0 .102) EPOXY CAPTIVATION (.500 SQ) (.460) 5642 . , NOTES(S): SMA FEMALE INTERFACE PER M IL -S T D -3 4 8 1. MATERIAL(S): 1.1 BODY: 3 0 4 SST PER A M S - 5 5 1 1 1.2 CENTER CONDUCTOR: BeCu ALLOY C 17 3 PER ASTM B - 1 9 6 .

ultrasonic amplifier circuit diagram

Abstract: Ablebond LMA116 162mm
Contextual Info: 2-10GHz MESFET Amplifier Filtronic LMA116 Solid State Features • • • • • • • • • • 4.5dB Typical Noise Figure 15dB Typical Gain 18dBm Saturated Output Power 12dB Input/Output Return Loss Typical 2-10GHz Frequency Bandwidth +8 Volts Single Bias Supply