C173 Search Results

Contextual Info: REVISIONS REV. DESCRIPTION DATE A INITIAL RELEASE 11/20/09 APPROVED M.J. B ECN #7967 07/22/10 D.N. .570 .492 .386 .156 SQ. .330 "D" FLAT .252 #6-40 UNF-2A .174 .188 HEX .040 .096 NOTES: MATERIALS: 1. CONTACT = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04.

DIMENSIONS

Abstract: AMS 2700
Contextual Info: ROHS COMPLIANT REVISION HISTORY DESCRIPTION REV - PRODUCT DATA DRAWING DCN 34959 DATE APPROVED 03/07 STW MATERIAL: BODY: STAINLESS STEEL PER AMS-5640, ALLOY UNS S30300, TYPE 1 CONTACT: BERYLLIUM COPPER PER ASTM B196, ALLOY No. UNS C17300, TD04 INSULATOR: .222 5.64

C173

Abstract: CD54HC173 CD54HCT173 CD74HC173 CD74HCT173
Contextual Info: [ /Title CD74H C173, CD74H CT173 /Subject (High Speed CMOS Logic Quad DType C173, C173, CD54HCT173, CD74HCT173 Data sheet acquired from Harris Semiconductor SCHS158E High-Speed CMOS Logic Quad D-Type Flip-Flop, Three-State February 1998 - Revised October 2003

C17300

Abstract: C-17300 ASTM b196 UNS-C17300
Contextual Info: NO A A DESC RIPTIO N DATE MODIFICATION FDR @ D 11,09,00 BACKGROUND FORMAT UP DA TED 06,27,02 3,20(126 NOTES: UNLESS OTHERWISE SPECIFIED 1. BODIES:BRASS PER JIS -C 360 4 BERYLLIUM COPPER PER ASTM B196 UNS C17300 2. CENTER CONTACT: BERYLLIUM COPPER PER ASTM B196 UNS C17300

oximeter

Abstract: PDV-C173SM
Contextual Info: PDV-C173SM Photodiode in Plastic Surface Mount Package PACKAGE DIMENSIONS INCH [mm] PACKAGE DIMENSIONS INCH [mm] .158 [4.00] .079 [2.00] .043 [1.10] CATHODE MARK .019 [0.48] CATHODE 2X .020 [0.51] .085 [2.15] 130° VIEWING ANGLE .197 [5.00] .158 [4.00] .173 [4.40]

Contextual Info: REVISIONS REV. DESCRIPTION DATE APPROVED A INITIAL RELEASE 09/25/09 A.D.M. .620 .220 .360 "D" FLAT #6 40 UNF 2A BOTH ENDS .156 HEX .188 HEX NOTES: MATERIALS: 1. 2. 3. 4. BODY & CONTACT = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04. INSULATOR = VIRGIN WHITE TEFLON PER ASTM D1710, GRADE 1, TYPE I, CLASS "B".

Contextual Info: REVISIONS REV. DESCRIPTION DATE APPROVED A INITIAL RELEASE 06/18/13 D.N. .52 .391 .63 .500 .375 .040 .106 NOTES: MATERIALS; 1. 2. 3. 4. INSULATORS = VIRGIN WHITE TEFLON PER ASTM D1710, GRADE 1, TYPE I, CLASS "B". CONTACT & SPRING = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04.

Contextual Info: REVISIONS REV. DESCRIPTION DATE APPROVED A INITIAL RELEASE 01/18/08 A.D.M. B ECN #7967 07/22/10 D.N. .570 .492 .386 .156 SQ. .330 "D" FLAT .252 #6-40 UNF-2A .174 .188 HEX .040 .096 NOTES: MATERIALS: 1. CONTACT = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04.

1002-1551-003

Contextual Info: REVISIONS REV. DESCRIPTION DATE APPROVED A INITIAL RELEASE 04/10/13 J.S. .67 .121 .219 HEX NOTES: MATERIALS: 1. 2. 3. CONTACT = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04. INSULATOR = VIRGIN WHITE TEFLON PER ASTM D1710, GRADE 1, TYPE I, CLASS "B".

1002-1551-902

Contextual Info: REVISIONS REV. DESCRIPTION DATE APPROVED A INITIAL RELEASE 01/11/13 D.N. .67 .089 .219 HEX .219 HEX NOTES: CONFORMS TO MIL-PRF-39012/73-0003 MATERIALS: 1. 2. 3. CONTACT = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04. INSULATOR = VIRGIN WHITE TEFLON PER ASTM D1710, GRADE 1, TYPE I, CLASS "B".

d1710

Abstract: C3604 brass jis c3604 JIS C3604 JIS-C1730B D1457 COPPER C3604 JIS-C3604 ASTM-D1710 RG17B
Contextual Info: AD ^^TU S Solder f3.5±0 = 6.5±1 ïa |. -? w CO I NOTES: UNLESS OTHERWISE SPECIFIED 1. BODIES: BRASS PER JIS-C3604 2. PIN: BERYLLIUM COPPER PER JIS-C1730B 3. INSULATION: TEFLON PER ASTM D1457 AND ASTM D1710 4. CONNECTOR INTERFACE PER 10L-STD-348A 5. PART TO BE CLEAN AND FREE OF BURRS

Contextual Info: [ /Title CD74H C173, CD74H CT173 /Subject (High Speed CMOS Logic Quad DType C173, C173, CD54HCT173, CD74HCT173 Data sheet acquired from Harris Semiconductor SCHS158E High-Speed CMOS Logic Quad D-Type Flip-Flop, Three-State February 1998 - Revised October 2003

AMS-QQ-P-35

Contextual Info: REVISION HISTORY DESCRIPTION REV B REL. DCN 32900 DATE APPROVED 03/05 BRT PRODUCT DATA DRAWING MATERIAL BODY, COUPLING NUT: .442 11.233 STAINLESS STEEL PER AMS-5640 ALLOY UNS S30300, TYPE 303 LOCK RING: BERYLLIUM COPPER PER ASTM B196 ALLOY C17300, COND. TD04

PAF700F48-12

Abstract: PAF700F48-28
Contextual Info: DENSEI-LAMBDA PAF700F48-* SPECIFICATIONS C173-01-01 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 ITEMS Nominal Output Voltage Maximum Output Current Nominal Output Power Efficiency Typ. Input Voltage Range Input Current (Typ.) Output Voltage Accuracy

Contextual Info: CAD GENERATED DRAWING D DCN CONTROLLED DOCUMENT D W G .N O . SF 1754 -6001 MATERIALS: BODY, INSERT: STAINLESS STEEL PER AMS-5640, UNS 530300, TYPE I CONTACTS 8 SHIM SPRING: INSULATOR: GASKET: BERYLLIUM COPPER PER ASTM-196, COND. T D 0 4 , ALLOY UNS-C17300

Contextual Info: REVISIONS REV. DESCRIPTION DATE APPROVED A ECN #7743 10/15/09 A.D.M. .55 .420 .59 .219 HEX .470 .219 HEX NOTES: .121 MATERIALS: 1. INSULATORS = VIRGIN WHITE TEFLON PER ASTM D1710, GRADE 1, TYPE I, CLASS "B". 2. CONTACT = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04.

Contextual Info: 40E D E3 3 4 c c173a 0QQ1Q47 S ^ S E N I FASCO INDS/ SENISVS CLM5H10A CLM7H16A Photomods Low Current Modules • • • • • Ten and Sixteen Volts, 17 Ma Lamps Long Life, Low Current Lamps ON Resistance Tolerance ± 50% Voltage Isolation 2500V PAC

Contextual Info: M ICROWAVE A Division of Crystek Corporation NOTE: Distance from end of cable center conductor to Ref. Pl is 0.735 NOTES: 1.0 Materials 1.1 Body, Coupling, and Clamp Nuts: Steel. Corrosion Resistant per ASTM-A582. UNS No. S30300. 1.2 Center Conductor: Beryllium Copper per ASTM-B196. UNS C17300.

Contextual Info: M ICROWAVE A Division of Crystek Corporation NOTE: Distance from end of cable center conductor to Ref. Pl. is 0.645 NOTES: 1.0 Materials 1.1 1.2 1.3 1.4 1.5 1.6 1.7 Body, Coupling, and Clamp Nut: Steel. Corrosion Resistant per ASTM-A582. UNS No. S30300. Center Conductor: Beryllium Copper per ASTM-B196. UNS C17300.

Contextual Info: M ICROWAVE A Division of Crystek Corporation NOTE: Distance from end of cable center conductor to Ref Pl. is 0.455 NOTES: 1.0 Materials 1.1 Body, Coupling, and Clamp Nuts: Steel. Corrosion Resistant per ASTM-A582. UNS No. S30300. 1.2 Center Conductor: Beryllium Copper per ASTM-B196. UNS C17300.

C173

Abstract: CD54HC173 CD54HCT173 CD74HC173 CD74HCT173 hc173
Contextual Info: [ /Title CD74H C173, CD74H CT173 /Subject (High Speed CMOS Logic Quad DType C173, C173, CD54HCT173, CD74HCT173 Data sheet acquired from Harris Semiconductor SCHS158E High-Speed CMOS Logic Quad D-Type Flip-Flop, Three-State February 1998 - Revised October 2003

D1710

Abstract: JIS-C3604 JIS-C1730B
Contextual Info: Solder li ±0, 5±o.a 6.5±1 i a |. >-? w co I NOTES: UNLESS OTHERWISE SPECIFIED 1. BODIES: BRASS PER JIS-C3604 2. PIN: BERYLLIUM COPPER PER JIS-C1730B 3. INSULATION: TEFLON PER ASTM D1457 AND ASTM D1710 4. CONNECTOR INTERFACE PER 10L-STD-348A 5. PART TO BE CLEAN AND FREE OF BURRS

SN74HC173

Abstract: HC173
Contextual Info: C173, C173 4-BIT D-TYPE REGISTERS WITH 3 STATE OUTPUTS D 268 4, D ECEM BER 1 982 - High-Current 3-State Outputs Interface Directly with System Bus or Can Drive Up to 15 LSTTL Loads R E V IS E D S E P T E M B E R 1 9 8 7 SN 54H C173 . . . J PACKAG E

C173

Abstract: CD54HC173 CD54HCT173 CD74HC173
Contextual Info: [ /Title CD74H C173, CD74H CT173 /Subject (High Speed CMOS Logic Quad DType CD54/C173, CD54/74HCT173 Data sheet acquired from Harris Semiconductor SCHS158A High Speed CMOS Logic Quad D-Type Flip-Flop, Three-State February 1998 - Revised May 2000 Features