ic shelf life
Abstract: J-STD-002 J-STD-002B B827 SZZA002 IPC EIA J-STD-001 J-STD-001 SZZA046 um43a
Contextual Info: Application Report SZZA046 - June 2004 Shelf-Life Evaluation of Lead-Free Component Finishes Douglas W. Romm, Donald C. Abbott, and Bernhard Lange ABSTRACT The integrated circuit IC industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time
|
Original
|
szza046ic shelf lifej-std-002j-std-002b+5b827szza002ipc eia j-std-001j-std-001um43a
|
PDF
|
JESD22A121
Abstract: IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031
Contextual Info: Application Report SZZA051B – August 2005 – Revised August 2005 Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm . SLL Logic ABSTRACT Integrated circuits ICs with both tin-lead (SnPb) and Pb-free finished leads were
|
Original
|
szza051bjesd22a121ic sem 2005chopin+3jedec no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin aljesd22a121 measuring whisker growth on tin and tin alloy surfaces finishesszza031
|
PDF
|
JESD22-B102D
Abstract: J-STD-002 ipc 610D ISO 1073-2
Contextual Info: Application Report SCEA038 – November 2007 Factors That Influence Side-Wetting Performance on IC Terminals Donald C. Abbott, Bernhard Lange, Douglas W. Romm, and John Tellkamp . ABSTRACT A designed experiment evaluated the influence of several variables on appearance and
|
Original
|
scea038jesd22-b102dj-std-002ipc 610d+1iso 1073-2
|
PDF
|
AN214
Abstract: AN214D DS78LS12
Contextual Info: AN-214 Transmission Line Drivers and Receivers for EIA Standards RS-422 and RS-423 National Sem iconductor Application N ote 2 1 4 John Abbott With the advent of the microprocessor, logic designs have become both sophisticated and modular in concept. Fre
|
OCR Scan
|
an-214rs-422rs-423an214+2an214dds78ls12
|
PDF
|
EAS3000
Abstract: cruise missile AH-64 BQS-15 APS-137 uav design abbott ecm of Synthetic aperture radar m2a3 MD 202
Contextual Info: Since 1961, Martek Power Abbott has been a main power supplies vendor to many major military and aerospace companies around the world. Following is a partial list of recent programs where our power supplies are being designed in. PROGRAM NAME DESCRIPTION POWER
|
Original
|
m-109eas3000cruise missileah-64+7bqs-15aps-137uav designabbottecm of synthetic aperture radarm2a3md 202
|
PDF
|
Lead-Free
Abstract: SZZA037A smema wiring smema specifications DAY20 1600X
Contextual Info: Application Report SZZA037A - February 2003 Whisker Evaluation of Tin-Plated Logic Component Leads Douglas W. Romm, Donald C. Abbott, Stu Grenney, and Muhammad Khan Logic Packaging ABSTRACT Integrated circuits ICs with matte tin (Sn) finished leads for logic products were tested for
|
Original
|
szza037alead-freesmema wiringsmema specifications+2day201600x
|
PDF
|
an214
Abstract: 188-114 AN-108 AN-214 DS1691 DS78LS120 EIA-422-B RS-423
Contextual Info: National Semiconductor Application Note 214 John Abbott John Goldie August 1993 Introduction tor’s application note AN-108 and TIA/EIA standards TIA/ EIA-422-B balanced and TIA/EIA-423-B (unbalanced). In this application note the generic terms of RS-422 and
|
Original
|
an-108eia-422-btia/eia-423-brs-422+6rs-423an214188-114an-214ds1691ds78ls120
|
PDF
|
DS1691
Abstract: AN-108 AN-214 DS78LS120 EIA-422-B RS-423 188-114 application note AN-214
Contextual Info: National Semiconductor Application Note 214 John Abbott John Goldie August 1993 INTRODUCTION With the advent of the microprocessor, logic designs have become both sophisticated and modular in concept. Frequently the modules making up the system are very closely
|
Original
|
ds1691an-108an-214ds78ls120+4eia-422-brs-423188-114application note an-214
|
PDF
|
SZZA031
Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
Contextual Info: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)
|
Original
|
szza031cu osp and cu sopgold embrittlement palladiumdiamond technologies+3ipc-a-610cgold embrittlementsn-pb-ag solder paste
|
PDF
|
sn-pb-ag solder paste
Abstract: 62Sn36Pb2Ag IPC-A-610C
Contextual Info: Application Report SZZA035 - October 2002 Board-Mount Evaluation of Tin-Plated Component Leads Douglas W. Romm, Donald C. Abbott, Bernhard Lange, and Muhammad Khan Standard Linear & Logic ABSTRACT The solderability performance of tin Sn -plated integrated circuit (IC) component leads is
|
Original
|
szza035sn-pb-ag solder paste62sn36pb2agipc-a-610c |
PDF
|
AN-214 Application Note
Abstract: DS88LS120 AN-108 AN-214 DS1691 DS78LS120 EIA-422-B RS-423
Contextual Info: National Semiconductor Application Note 214 John Abbott John Goldie August 1993 INTRODUCTION With the advent of the microprocessor, logic designs have become both sophisticated and modular in concept. Frequently the modules making up the system are very closely
|
Original
|
an005854an-214 application noteds88ls120an-108+5an-214ds1691ds78ls120eia-422-brs-423
|
PDF
|
188-114
Abstract: application note AN-214 an-214 ir receiver transistor AN-108 C1996 DS1691 DS78LS120 EIA-422-B RS-423
Contextual Info: National Semiconductor Application Note 214 John Abbott John Goldie August 1993 INTRODUCTION With the advent of the microprocessor logic designs have become both sophisticated and modular in concept Frequently the modules making up the system are very closely
|
Original
|
188-114application note an-214an-214ir receiver transistor+6an-108c1996ds1691ds78ls120eia-422-brs-423
|
PDF
|
SZZA024
Abstract: ic ZN 415 ic ZN 415 datasheet CU-106A IPC-A-610C 91Sn Cu6Sn5
Contextual Info: Application Report SZZA024 - January 2001 Evaluation of Nickel/Palladium-Finished ICs With Lead-Free Solder Alloys Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT A nickel/palladium Ni/Pd lead finish for integrated circuits (IC) was introduced in 1989. In
|
Original
|
szza024ic zn 415ic zn 415 datasheetcu-106a+3ipc-a-610c91sncu6sn5
|
PDF
|
szza026
Abstract: Finishes Cu OSP and Cu SOP CU-106A IPC-A610C IPC-A-610C heraeus oxygen entek plus cu 106a heraeus osp 75
Contextual Info: Application Report SZZA026 – July 2001 Evaluation of Nickel/Palladium/Gold-Finished Surface-Mount Integrated Circuits Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT Texas Instruments has introduced a refined version of its nickel/palladium NiPd finish for
|
Original
|
szza02640-billionfinishescu osp and cu sop+7cu-106aipc-a610cipc-a-610cheraeus oxygenentek plus cu 106aheraeusosp 75
|
PDF
|
|
|
|
Contextual Info: www.martekpower.com Series AM AC-DC / DC-DC Converters 50 watt triple output 50 watt single output 100 watt The AM series AC-DC/DC-DC power supplies can accept a wide range of input powers making them true multiple input power supplies. The AM models are uniquely qualified for a variety of military applications
|
Original
|
mil-std-810cmil-s-901c50vdc |
PDF
|
50hz to 60hz converter circuit diagram
Abstract: MIL-STD-1299 3 phase bridge rectifier 400HZ 60hz to 50hz converter circuit diagram DDME-24H7S-J martek power MIL-STD-129 MILSTD704A 115 vac SINGLE phase bridge rectifier dc-dc converter 380V
Contextual Info: MW400S 400 Watts Output Power ACTIVE POWER FACTOR CORRECTION & ISOLATED DC OUTPUT MODULE HOW TO ORDER MW FEATURES 400 - S • Meets Harmonic Requirements of MIL - STD - 1399 • Meets CE101 and CE102 of MIL - STD - 461 No external filter required • Meets all requirements of MIL - STD - 704E
|
Original
|
mw400s115vin400hz230vin+1128vout50hz to 60hz converter circuit diagrammil-std-12993 phase bridge rectifier 400hz60hz to 50hz converter circuit diagramddme-24h7s-jmartek powermil-std-129milstd704a115 vac single phase bridge rectifierdc-dc converter 380v
|
PDF
|
Pacific Silicon Sensor
Abstract: PS0.25-5 TO52 package VAT-20 TO52
Contextual Info: PS0.25-5 TO52S1 PIN Photodiode Special characteristics: High Speed epitaxy Low Dark current 0,25 mm² active area Parameters: PS0.25-5 Ch Active Area 0.5 x 0.5 mm 0,25 mm 2 max. 4.0 nA typ. 0.5 nA typ. 1.8 pF Spectral Responsivity at 800 nm Shunt Resistance
|
Original
|
o52s1pacific silicon sensorps0.25-5to52 package+2vat-20to52
|
PDF
|
IC51-0562-1514
Abstract: Yamaichi IC51-0644-807 footprint IC51-0562 socket tqfp 56 socket Yamaichi TQFP IC51-0804-808 IC51-0644-807
Contextual Info: FIFO Memories: Fine-Pitch Surface-Mount Manufacturability First-In, First-Out Technology SCZA003A March 1996 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest
|
Original
|
scza003aic51-0562-1514yamaichi ic51-0644-807 footprintic51-0562 socket+4tqfp 56 socketyamaichi tqfpic51-0804-808ic51-0644-807
|
PDF
|
74Vdc
Abstract: 2000 Watt AC Input Power sun
Contextual Info: PST-2 - 150 WATT TRIPLE OUTPUT DC-DC CONVERTER FOR RAILWAY APPLICATIONS NOMINAL 74 VDC INPUT STANDARD LOCOMOTIVE POWER BUS WIDE DC INPUT WIDE TEMPERATURE RANGE HIGH RELIABILITY RUGGED CONSTRUCTION SPECIFICATIONS DC INPUT : 50.0 - 82.0 VDC with 74.0 VDC nominal.
|
Original
|
15-ampere2000/as910074vdc2000 watt ac input power sun |
PDF
|
btsti
Abstract: FIR FILTER implementation in ARM instruction M4 30F 149 advantages of arm7 ARM7 MCORE 1998 HC11 M200 MMC2001 V830
Contextual Info: M•CORE Review M•CORE Overview ● Competitive Analysis ● For more information: ● www.mot.com/SPS/MCORE/ Semiconductor Products Sector 1.1 of 14 Technical Strengths For Low Power Markets ● M•CORE Everywhere! $2B in Design Wins True 32-Bit RISC Architecture
|
Original
|
32-bit16-bitbtstifir filter implementation in arm instruction+8m4 30f 149advantages of arm7arm7mcore 1998hc11m200mmc2001v830
|
PDF
|
Yamaichi IC51-0644-807 footprint
Abstract: IC51-0562-1514 IC51-0804-808 IC51-0562 socket TQFP 80 PACKAGE footprint Yamaichi IC51-0804-808 footprint ssop 0.635 IC51-0562 IC51-0644-807 TQFP 256 PACKAGE footprint
Contextual Info: FIFO Memories: Fine-Pitch Surface-Mount Manufacturability First-In, First-Out Technology Tom Jackson Advanced System Logic – Semiconductor Group SCZA003A 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor
|
Original
|
scza003ayamaichi ic51-0644-807 footprintic51-0562-1514ic51-0804-808+7ic51-0562 sockettqfp 80 package footprintyamaichi ic51-0804-808footprint ssop 0.635ic51-0562ic51-0644-807tqfp 256 package footprint
|
PDF
|
c-mac converter
Contextual Info: CM NL Features: • European Manufacture • 15 Watt and 30 Watt Ranges • Industry Compatible Size and Pinout 30HY Series Hybrid DC/DC Converter TRIPLE OUTPUT • Only 10mm 0.375" Height • 550KHz Fixed Frequency Operation • External Synchronisation Facility
|
OCR Scan
|
550khzindust200w0-200w18-400vdc+1c-mac converter
|
PDF
|
|
Contextual Info: NL100 100 Watts Output Power SINGLE DUAL AND OUTPUTS FEATURES FEATURES • • • • • • • • • How to Order: .38 Inch Profile Synchronization Remote Turn On TTL Output Voltage Trim Pin Over Temperature Protection Output Overvoltage/Overcurrent Protection
|
Original
|
nl100nl-b0300reva |
PDF
|
abbott
Abstract: 33C marking
Contextual Info: CB30S 30 Watts Output Power SINGLE OUTPUT FEATURES FEATURES • • • • • • • How to Order CB 30 S SELECTION CHART CHART M / 5 - C - D Series Total Output Power Single Output Unscreened I or Screened (M) Output Voltage: Maximum current as stated
|
Original
|
cb30scb30si/2-ccb30si/3cb30si/5-c+8cb30si/5cb30si/12-ccb30si/15-ccb30si/24-ccb30si/28-ccb30sm/2-cabbott33c marking
|
PDF
|