AAAB OP Search Results
AAAB OP Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| TC75S67TU | Toshiba Electronic Devices & Storage Corporation | Operational Amplifier, 2.2V to 5.5V, Low Noise type:VNI=6nV/√Hz@1kHz, SOT-353F | Datasheet | ||
| TA75W01FU | Toshiba Electronic Devices & Storage Corporation | Operational Amplifier, Bipolar (358) type Dual Op-Amp, 3V to 12V, SOT-505 | Datasheet | ||
| TC75S102F | Toshiba Electronic Devices & Storage Corporation | Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 | Datasheet | ||
| TC75S103F | Toshiba Electronic Devices & Storage Corporation | Operational Amplifier, 1.8V to 5.5V, I/O Rail to Rail, IDD=100μA, SOT-25 | Datasheet | ||
| TC75S51F | Toshiba Electronic Devices & Storage Corporation | Operational Amplifier, 1.5V to 7.0V, IDD=60μA, SOT-25/SOT-353 | Datasheet |
AAAB OP Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
EIA-783
Abstract: EIA-364-13 contact retention EIA-700 AAAB
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eia-700vme64vme64xeia-783+2 | |
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Contextual Info: MAXIMUM SOLUTIONS Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications. |
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eia-700vme64vme64x891-10-064-30-12000ethod | |
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Contextual Info: MAXIMUM solutions Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications. |
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eia-700vme64vme64x891-10-064-3ethod | |
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Contextual Info: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions |
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eia-700eia-783330mm | |
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Contextual Info: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions |
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eia-700eia-783 | |
EIA-783Contextual Info: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions |
Original |
eia-700eia-783 | |
HPF Switched Capacitor
Abstract: MN6516 MN6516S
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OCR Scan |
932j352mn6516mn6516shpf switched capacitor | |
EIA-700 AAAB
Abstract: amp 120527-1 IEEE1386 AAAB
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64position84positioneia-700l-800-522-6752+4 | |
EIA-700 AAAB
Abstract: 1-5146896-1 5120521-1 2-5120527-2 EIA-700 1-5146894-1 IEEE1386 1-5120528-1 5146898-1 5120532-1
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64-position84-positioneia-700eia-700 aaab+8 | |
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Contextual Info: Feat ur es Single P ow er Supply R e a d an d W r i t e V o l t a g e , 5 V ± 5% Hi gh P e r f o r m a n c e j 200 ns M a x i m u m A c c e s s T i m e l m Ë L 6 m s T y p i c a l S e c t o r Wr i t e CMOS Low Power Consumption 25 m A T yp i c a l A c t i v e C u r r e n t By t e M o d e |
OCR Scan |
at5fc008at5fc008-20 | |
IEEE1386Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm Free Height (FH) (IEEE 1386) Connectors Product Facts • For board stacking applications ■ High density packaging on 1.0 [.039] centerline spacing ■ Available in standard 64-position and optional |
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64-position84-positioneia-700ieee1386 | |
EIA-700 AAAB
Abstract: 5120521-1 5120532-1
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eia-700eia-700 aaab5120521-15120532-1 | |
amp 120527-1
Abstract: EIA-700 AAAB 120527-1 AMP
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OCR Scan |
eia-700amp 120527-1eia-700 aaab120527-1 amp | |
AMP 120521-1Contextual Info: Fine Pitch S M T S tack in g C o n n e cto rs Parallel B oard -to-B oard 889092 Revised 2-99 1.0mm FH (IEEE 1386) Receptacles with Locating Posts, 1.0 [.039] Pitch 8 [ 315] thru 15 [ 591] Stacking Heights Material and Finish: Housing — L iq jiri crystal polymer, |
OCR Scan |
000050jeia-700s23-2amp 120521-1 | |
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Contextual Info: C atalog Fine Pitch SM T Stacking Connectors Parallel Board-to-Board 889092 Revised 2 99 8 [.315] thru 15 [.591] Stacking Heights Material and Finish: Housing — . ¡quid crystal polymer, black Contacts — Phosphor bronze, duplex plated 0.DUO/6 ,'.000030] min. gold on |
OCR Scan |
eia-7001-8d0-722-1111 | |
120521-1Contextual Info: Catalog 1307515 Issued 9-99 Free Height FH Connectors (Continued) 1.0mm FH (IEEE 1386) Receptacles with Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights Material and Finish: Housing — black L iq u id crystal polym er, Contacts — P h o s p h o r bronze; d u p le x |
OCR Scan |
eia-700120521-1 | |
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Contextual Info: Catalog 389092 Revised 2-99 Fine Pitch S M T Stacking Connectors Parallel Board-to-Board 1 .0 m m F H ( I E E E 1386) Receptacles with Vacuum Cover, 1 .0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights Material and Finish: Housing — I qu id crystal polymer |
OCR Scan |
cq075uu003cjeia-700 | |
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Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm FH (IEEE 1386) Plugs with Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights A 1.0 [.039] Pitch 0.5 [.020] 2 Plc. Material and Finish C L Housing — Liquid crystal polymer, |
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eia-700 | |
AAAB
Abstract: EIA-700 AAAB
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OCR Scan |
eia-700aaabeia-700 aaab | |
5120523-2Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm FH (IEEE 1386) Receptacles with Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights A 1.0 [.039] Pitch 0.6 [.024] 2 Plc. Material and Finish Housing — Liquid crystal polymer, |
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eia-7005120523-2 | |
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Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm FH (IEEE 1386) Receptacles without Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights A 1.0 [.039] Pitch 0.6 [.024] 2 Plc. Material and Finish Housing — Liquid crystal polymer, |
Original |
eia-700 | |
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Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm FH (IEEE 1386) Plugs without Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights A 1.0 [.039] Pitch 0.5 [.020] 2 Plc. C L Material and Finish Housing — Liquid crystal polymer, |
Original |
eia-700 | |
EIA-700 AAAB
Abstract: SC140 149 dsi MSC8103 freescale superflash MSC81xx
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Original |
msc81x281x2pfc-hvmsc81xxmsc8103+5 | |
sda 5222Contextual Info: 13 10 3 A :iRcun SIZE DIM.B DIM. C DIM. D I3.90 .547 I8.90 .744 23.90 .941 28.90 1.138 33.90 1.335 35.90 1.413 38.90 1.531 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2.122 58.90 2.319 63.90 2.516 9.00 .354 14.00 .551 19.00 .748 24.00 .945 29.00 1.142 31.00 |
OCR Scan |
sda-71439-3sda 5222 | |