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Bel Fuse 14A-56-515 50\\60 HZ, LAMINATED TRANSFORMER - Tape and Reel (Alt: 14A-56-515)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	14A-56-515	Tape & Reel		18 Weeks	40	1 - 10 - 100 $25.08 1000 $21.82 10000 $21.82	Buy Now
Bel Fuse 14A-56-512 50\\60 HZ, LAMINATED TRANSFORMER - Tape and Reel (Alt: 14A-56-512)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	14A-56-512	Tape & Reel		18 Weeks	40	1 - 10 - 100 $25.11 1000 $21.84 10000 $21.84	Buy Now
Newark	14A-56-512	Bulk			3	1 - 10 $39.04 100 $33.78 1000 $33.78 10000 $33.78	Buy Now
Kingbright DA56-51EWA LED Displays & Accessories Dual Red 625nm Common Anode
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	DA56-51EWA		3,985			1 $3.31 10 $2.36 100 $1.83 1000 $1.52 10000 $1.39	Buy Now
Kingbright ACSA56-51SURKWA LED Displays & Accessories 0.56" SINGLE DIGIT RED SMD LED DISPLAY
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	ACSA56-51SURKWA		985			1 $3.35 10 $2.19 100 $1.77 1000 $1.53 10000 $1.47	Buy Now
TTI	ACSA56-51SURKWA	Reel			400	1 - 10 - 100 - 1000 - 10000 -	Buy Now
Bristol Electronics	ACSA56-51SURKWA		50		1	1 $3.99 10 $2.59 100 $1.88 1000 $1.88 10000 $1.88	Buy Now
Kingbright DA56-51GWA LED Displays & Accessories Dual Green 568nm Common Anode
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	DA56-51GWA		960			1 $3.31 10 $2.36 100 $1.83 1000 $1.52 10000 $1.39	Buy Now

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A5651 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
compal la-5651P REV 1.0 Abstract: nav50 la-5651p rev 1.0 SN0806081RHBR NAV50 AR8132L RTM875N-397 LA-5651P pcbga360 nav50 A5651 pcbga360 Contextual Info: A B C D E 1 1 Compal Confidential 2 2 NAV70 Schematics Document Intel Pineview Processor with Tigerpoint + DDRII 2010-04-29 3 3 l.c om REV: 2.0 Title Date: A B C D SCHEMATICS， MB A5651 in THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL	Original	nav70 r1387 r1388 pin97 +14page17 nav50 nav60 sa00003j400 page18 compal la-5651p rev 1.0 nav50 la-5651p rev 1.0 sn0806081rhbr ar8132l rtm875n-397 la-5651p pcbga360 nav50 a5651 pcbga360	PDF
28F160 Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING Contextual Info: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than	Original	28f160 28f160b3 bga thermal resistance 6x8 intel 28f160 s5 +5sop jedec tray a576 ubga package board solder reflow process recommendations transport media and packing	PDF
BPW22A Abstract: cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8 Contextual Info: Contents Page Page New product index Combined index and status codes viii x Mullard approved components BS9000, CECC, and D3007 lists CV list Integrated circuits Section index xliii 1 5 Standard functions LOGIC FAMILIES CMOS HE4000B family specifications CMOS HE4000B family survey	OCR Scan	bs9000 d3007 he4000b 80ribution +10bpw22a cm .02m z5u 1kv pin configuration of bfw10 la4347 b2x84 tda3653 equivalent triac tag 9322 hef40106bp equivalent fx4054 core dsq8	PDF

Catalog Datasheet

Type

Document Tags

PDF

compal la-5651P REV 1.0

Abstract: nav50 la-5651p rev 1.0 SN0806081RHBR NAV50 AR8132L RTM875N-397 LA-5651P pcbga360 nav50 A5651 pcbga360
Contextual Info: A B C D E 1 1 Compal Confidential 2 2 NAV70 Schematics Document Intel Pineview Processor with Tigerpoint + DDRII 2010-04-29 3 3 l.c om REV: 2.0 Title Date: A B C D SCHEMATICS， MB A5651 in THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

Original

nav70 r1387 r1388 pin97 +14

PDF

28F160

Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Contextual Info: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than

Original

28f160 28f160b3 bga thermal resistance 6x8 intel 28f160 s5 +5

PDF

BPW22A

Abstract: cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8
Contextual Info: Contents Page Page New product index Combined index and status codes viii x Mullard approved components BS9000, CECC, and D3007 lists CV list Integrated circuits Section index xliii 1 5 Standard functions LOGIC FAMILIES CMOS HE4000B family specifications CMOS HE4000B family survey

OCR Scan

bs9000 d3007 he4000b 80ribution +10

PDF

A5651 Search Results

A5651 Price and Stock

Bel Fuse 14A-56-515

Bel Fuse 14A-56-512

Kingbright DA56-51EWA

Kingbright ACSA56-51SURKWA

Kingbright DA56-51GWA

A5651 Datasheets Context Search

compal la-5651P REV 1.0

28F160

BPW22A