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    A5573 Search Results

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    Carling Technologies 2GA55-73

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    Master Electronics 2GA55-73
    • 1 -
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    • 100 $5.30
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    Mouser Electronics 2GA55-73
    • 1 $9.98
    • 10 $8.47
    • 100 $6.70
    • 1000 $5.93
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    Sager 2GA55-73 1
    • 1 $8.76
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    • 100 $7.40
    • 1000 $4.74
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    Carling Technologies 2GA55-73/DUST-COVER

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    Master Electronics 2GA55-73/DUST-COVER
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    Carling Technologies 2GA55-73/272-06747

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    Master Electronics 2GA55-73/272-06747
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    Mouser Electronics 2GA55-73/272-06747
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    Sager 2GA55-73/272-06747 1
    • 1 $9.71
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    • 100 $7.34
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    Pasternack Enterprises PE3FCA557-30M

    Fiber Optic Cable Assemblies 4-Fiber SC UPC to ST UPC, OM5 Multimode Indoor Distribution Cable, 4.5mm Riser, 2.0mm breakout, Lime Green-30M
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    Mouser Electronics PE3FCA557-30M
    • 1 $226.77
    • 10 $193.57
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    Pasternack Enterprises US PE3FCA557-30M 71 1
    • 1 $202.99
    • 10 $186.75
    • 100 $178.63
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    Carling Technologies 2GA55-73/DUST COVER

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    Mouser Electronics 2GA55-73/DUST COVER
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    A5573 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Connectors - SMAyDrop-in HermeticjrSeals nch<a» •Replace Connectors without the loss of hermeticity ■Low VSWR and EMI/RFI Leakage - Center Conductor Diameters of .012, .015, .018, and .020 Hermetically sealed microwave components that are required to meet the


    OCR Scan
    mil-std-883bmil-m-38510without15-5662-14-drp-02+4-5364-14-drp-02-5563-14-drp-02-5363-14-drp-02-5562-14-drp-02 PDF

    KD 2107

    Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
    Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type A B C


    Original
    a5580-01kd 2107a5515a5568-01+7a54450pqfp 132 package dimension intela5500-01a5522-01a5506intel 1702 eprompackage/module/pc card outlines and dimensions PDF

    diode databook package outline

    Abstract: sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC
    Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type – –


    Original
    a5579-01a5580-01diode databook package outlinesip connector, pitch 2.5mm, 4 pin+8package ceramic leadless chip carrier lcca5501a5540side brazed ceramic dual-in-line packagesside brazed ceramic dual-in-line packages 28eprom databook35 x 35 pbga, 580 100 balls64 ceramic leadless chip carrier lcc PDF

    Contextual Info: AT5573 Global Mixed-mode Technology Inc. 4+2 CH Serial Input Motor Driver IC for DSC Features Applications „ Built in 4+1 full-swing drivers switched by serial „ „ „ „ „ „ „ „ „ „ „ „ control with brake function Built in 1 constant current drivers for shutter or IRIS


    Original
    at5573ch13/23at5573rv1ua5573+2tqfn4x4-28vm345 PDF