SMJ626162 Search Results

SMJ626162

Abstract: SDRAM A9C0
Contextual Info: SMJ626162 524288 BY 16-BIT BY 2-BANK SYNCHRONOUS DYNAMIC RANDOM-ACCESS MEMORY SGMS737C – JULY 1997 – REVISED MARCH 1999 D D D D D D D D D D D D D D D D HKD PACKAGE TOP VIEW Organization 512K x 16 Bits × 2 Banks 3.3-V Power Supply (±5% Tolerance) Two Banks for On-Chip Interleaving

Contextual Info: SMJ626162 524288 BY 16-BIT BY 2-BANK SYNCHRONOUS DYNAMIC RANDOM-ACCESS MEMORY S G M S 737B -JU LY 1997-R E V IS E D APRIL 1998 Organization 512K x 16 Bits x 2 Banks 3.3-V Power Supply ±5% Tolerance Two Banks for On-Chip Interleaving (Gapless Accesses) DGE+/HKD PACKAGE

Contextual Info: SMJ626162 524288 BY 16-BIT BY 2-BANK SYNCHRONOUS DYNAMIC RANDOM-ACCESS MEMORY SGMS737A - JULY 1997 - REVISED NOVEMBER 1997 Organization 512K x 16 Bits x 2 Banks 3.3-V Power Supply ±5% Tolerance Two Banks for On-Chip Interleaving (Gapless Accesses) High Bandwidth - Up to 66-MHz Data Rates

A11C30

Contextual Info: SMJ626162 524288 BY 16-BIT BY 2-BANK SYNCHRONOUS DYNAMIC RANDOM-ACCESS MEMORY SGMS737B - JULY 1997 - REVISED APRIL 1998 Organization 512K x 16 Bits x 2 Banks 3.3-V Power Supply ±5% Tolerance Two Banks for On-Chip Interleaving (Gapless Accesses) High Bandwidth - Up to 83-MHz Data Rates

SMJ626162

Contextual Info: SMJ626162 524288 BY 16-BIT BY 2-BANK SYNCHRONOUS DYNAMIC RANDOM-ACCESS MEMORY S G M S 7 3 7 A -J U L Y 1 9 9 7 -R E V IS E D N O VEM BER 1997 Organization 512K x 16 Bits x 2 Banks 3.3-V Power Supply ±5% Tolerance Two Banks for On-Chip Interleaving (Gapless Accesses)

missile seeker

Abstract: military processors SCTD002 SMJ55161 SMJ44C256 military switch 320F240 SMJ5C1008 military mcm 1553 MILITARY QUALIFIED DIP SWITCHES
Contextual Info: TI Mi l itary Semiconductors winning missile designs with TI military semiconductors Seeker Launcher/ Aircraft Link Memory Signal Conditioning SDRAM SRAM VRAM Data Conversion A/D Data Correction gain, offset C80, ASIC EPROM Target Detection Recognition FIFO

SMJ626162-15HKDM

Abstract: QML-38535 MIL-PRF38535 5962-9754501QXA x16-Bit
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA A Updated boilerplate. Added device type 03 to drawing. Changed tAPW minimum limits from 75ns and 100 ns to the quantity tRP + tCK. Removed all references to nBSD from drawing. - glg 98-01-20 Raymond Monnin B Changes in accordance with NOR 5962-R071-98. - glg

qml-38535

Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Updated boilerplate. Added device type 03 to drawing. Changed tAPW minimum limits from 75ns and 100 ns to the quantity tRP + tCK. Removed all references to nBSD from drawing. - glg 98-01-20 Raymond Monnin

qml-38535

Abstract: marking co6
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED Updated boilerplate. Added device type 03 to drawing. Changed tAPw minimum limits from 75ns and 100 ns to the quantity tRp + tcK. Removed all references to nBsp from drawing. - gig_ 98-01-20 Raymond Monnin

TSMC 0.18 um MOSfet

Abstract: M38510 10102BCA IDT7204L 5962-8768401MQA 0.18um LDMOS TSMC sl1053 TSMC 0.25Um LDMOS UT63M125BB SMD RTAX250S-CQ208 5962-04221
Contextual Info: DSCC Supplemental Information Sheet for Electronic QML-38535 Specification Details: Date: 9/2/2008 Specification: MIL-PRF-38535 Title: Advanced Microcircuits Federal Supply Class FSC : 5962 Conventional: No Specification contains quality assurance program: Yes

5962L0053605VYC

Abstract: 5962-9069204QXA ATMEL 302 24C16 UT9Q512E-20YCC MOH0268D UT54ACS164245SEIUCCR Z085810 5962-9762101Q2A UT28F256QLET-45UCC 5962R0250401KXA
Contextual Info: NOT MEASUREMENT SENSITIVE MIL-HDBK-103AJ 19 SEPTEMBER 2011 SUPERSEDING MIL-HDBK-103AH 28 MARCH 2011 DEPARTMENT OF DEFENSE HANDBOOK LIST OF STANDARD MICROCIRCUIT DRAWINGS This handbook is for guidance only. Do not cite this document as a requirement. AMSC N/A