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Catalog Datasheet	Type	Document Tags	PDF
GTO MODULE Abstract: ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8 Contextual Info: PRELIMINARY RMPA1766 i-Lo tm WCDMA Band IV Power Amplifier Module Features General Description • 40% WCDMA efficiency at +28dBm Pout The RMPA1766 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA	Original	rmpa1766 28dbm 16dbm gto module +4ecj-1vb1h102k sn63 sn96 solder paste, indium 5.8	PDF

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GTO MODULE

Abstract: ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8
Contextual Info: PRELIMINARY RMPA1766 i-Lo tm WCDMA Band IV Power Amplifier Module Features General Description • 40% WCDMA efficiency at +28dBm Pout The RMPA1766 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA

Original

rmpa1766 28dbm 16dbm gto module +4

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