LFBGA216 Search Results

Contextual Info: Package outline LFBGA216: plastic low profile fine-pitch ball grid array package; 216 balls; body 16 x 16 x 1.05 mm SOT715-1 A B D ball A1 index area A A2 A1 E detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C V e U T R P N M L K e2 J H 1/2 e G F E D C

LFBGA216

Abstract: LFBGA MO-205 sot715
Contextual Info: PDF: 2001 Nov 15 Philips Semiconductors Package outline LFBGA216: plastic low profile fine-pitch ball grid array package; 216 balls; body 16 x 16 x 1.05 mm SOT715-1 A B D ball A1 index area A A2 A1 E detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C V e

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA216 package SOT715-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste