DPZ2MX16NV3 Search Results

Dense-Pac Microsystems

Abstract: NC-641
Contextual Info: DENSE-PAC 32 Megabit FLASH EEPROM MICROSYSTEMS DPZ2MX16NV3 PRELIMINARY DESCRIPTION: The D PZ 2 M X 1 6 N V 3 "V E R S A - S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers

Contextual Info: _ DENSE-PAC ñ n J 1' 32 Megabit FLASH EEPROM DPZ2MX16NV3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: T h e D P Z 2 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a

Contextual Info: DENSE-PAC 32 Megabit FLASH EEPROM DPZ2MX16NV3 M I C R O I Y S ï .Ir- y. s DESCRIPTION: The D P Z 2 M X 1 6 N V 3 " V E R S A - S T A C K ” m o d u le is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers

Contextual Info: 32 Megabit FLASH EEPROM D E N S E -P A C MICROSYSTEMS DPZ2MX16NV3 DESCRIPTION: T h e D P Z 2 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a revolutionary new m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers

Contextual Info: 32 Megabit FLASH EEPROM DPZ2MX16NV3 DESCRIPTION: The DPZ2MX16NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

Contextual Info: 32 Megabit FLASH EEPROM DPZ2MX16Nn3 DESCRIPTION: The DPZ2MX16Nn3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded

Contextual Info: 32 Megabit FLASH EEPROM D E N S E - P A C MICROSYSTEMS DPZ2MX16Nn3 D ESC RIPTIO N : The D PZ2M X16N n3 " S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC . A vailable in straight leaded, " J " leaded or gullwing leaded

DP5Z

Contextual Info: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS

Contextual Info: 32 Megabit FLASH EEPROM D PZ2M X16N n3 M I G R O S Y S T Ji M S DESCRIPTION: The D P Z 2 M X l6 N n 3 "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems'ceramic Stackable LeadlessChip Carriers SLCC . Available in straight leaded, " J " leaded or gullwing leaded