DPV3232V Search Results

Contextual Info: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

12 SQ 045 JF

Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPROM DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: □PM DPV3232VA Dense-Pac Microsystems. Inc. 32K X 3 2 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DPV3232VA Dense-Pac Microsystems. Inc. ^ 32K X 32 UVEPROM VERSAPAC DESCRIPTION: The D P V 3 2 3 2 V A is a 66-pin Pin Grid Array PG A consisting of four 32K X 8 U V E P R O M devices in ceramic L C C packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

A141

Abstract: A143 DPV3232V
Contextual Info: DPV3232V 32K X 32 UVEPROM VERSAPAC Dense-Pac Microsystems. Inc. O DESCRIPTION: The D PV3232V is a 66-pin Pin Grid Array PG A consisting of four 32K X 8 U V EPR O M devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate with matched thermal coefficients.

Contextual Info: □PM * r ~ T DPV3232VA Dense-Pac Microsystems. Inc. 32K X 32 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DPV3232V □PM Dense-Pac Microsystems, Inc. 32K X 32 U V E P R O M VERSAPAC O D ESCRIPTIO N: The D P V 3 2 3 2 V is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 U V E P R O M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPRO M DPV3232VA D ESC R IP T IO N : The D PV 3232V A is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

A143

Abstract: A140 A141 DPV3232V "32K x 32" SRAM
Contextual Info: DPV3232V Dense-Pac Microsystems. Inc. ^ 32K X 32 UVEPROM VERSAPAC DESCRIPTIO N : The DPV3232V is a 66-pin Pin Grid Array PGA consisting o f four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.

48-PIN

Contextual Info: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead