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    30A10

    Abstract: ME17 Dense-Pac Microsystems
    Contextual Info: DENSE-PAC 16 Megabit CMOS DRAM MICROSYSTEMS DPD1MX16M2H3 PRELIMINARY D E S C R IP T IO N : T he D P D 1 M X 1 6 M 2 H 3 " S T A C K " m odule is a r e v o lu tio n a ry n e w m em o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLC Q stacked and leaded for surface


    OCR Scan     		dpd1mx16m2h316-megabits512kx8110-c+6100ris40-pin30m08-1430a10me17dense-pac microsystems PDF

    DP5Z

    Contextual Info: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS


    OCR Scan     		128kx864kx16256kx8384kx8+1dp5z PDF