CFP24 Search Results

Contextual Info: FPC Connector CIC Type H=2.4mm 1.0mm Spacing (SMT) ● Upper Contact Type CFP24 -01 F No. of Pins 極数 B A x× 01 02 11 12 Embossed Taping Embossed Taping Vinyl Bag Vinyl Bag 3.4 1.5 5.2 C 1.7 • Features 1.0 0.3 2.4 D 2.4 ● Lower Contact Type CFP25

Contextual Info: FPC Connectors FP-10 SU SL Series CIC Type 1.0mm Pitch SMT ● SU Series CFP24 -0150F (Upper Contact Type) No. of Pins / 極数 B A 1.0(Spacing) 1.5 5.2 3.4 (2.0) C 0.3 2.4 1.0 ● SL Series CFP25 B A 1. Rating : 0.5A, 100V AC/DC 2. Contact Resistance : 30mΩ max.

Contextual Info: FPC Connector CIC Type H=2.4mm 1.0mm Spacing (SMT) ● Upper Contact Type CFP24 -01 No. of Pins B A Hold Down Packing Style 01 02 11 12 3.4 1.5 5.2 C 1.7 • Features 1. 1.0mm-pitch SMT-ready FPC connector usable with CIC printing. 2. Either upper or lower contact location available.

Contextual Info: CIC Type H=2.4mm 1.0mm Spacing (SMT) ● Upper Contact Type CFP24 -01 F No. of Pins B A Hold Down Packing Style 01 02 11 12 3.4 5.2 1.5 1.7 • Features 1.0 0.3 2.4 D 2.4 ● Lower Contact Type CFP25 -01 F No. of Pins ■ Specifications Hold Down Packing Style

Contextual Info: FPC Connector FP-10 SU SL Series CIC Type 1.0mm Spacing SMT ● Upper Contact Type CFP24 -0150F No. of Pins B A (2.0) 1.0(Spacing) 1.5 5.2 3.4 C 1.0 0.3 2.4 2.4 D ● Lower Contact Type CFP25 -0150F No. of Pins B A • Specifications 1. Rating : 0.5A, 100V AC/DC

Contextual Info: FPC CONNECTOR 1.0mm Spacing SMT ¡SU Series CFP24 -01 (Upper Contact) No. of Pins B A Hold Down Packing Style 01 02 11 12 1.0 (Pitch) With Without With Without Embossed Taping Embossed Taping Pack in Bulk Pack in Bulk 2.4 1.0 0.3 •Features 2.4 D ¡SL Series

Contextual Info: FPC Connectors FP-10 SU SL Series CIC Type 1.0mm Pitch SMT ● SU Series CFP24 -0150F (Upper Contact Type) No. of Pins / 極数 B A (2.0) 1.0(Spacing) 1.5 5.2 3.4 C 0.3 2.4 2.4 ● SL Series CFP25 B A 1. Rating : 0.5A, 100V AC/DC 2. Contact Resistance : 30mΩ max.

Contextual Info: FPC Connectors FP-10 SU SL Series CIC Type 1.0mm Pitch SMT ● SU Series CFP24 -0150F (Upper Contact Type) No. of Pins B A 1.0(Spacing) 1.5 5.2 3.4 (2.0) C 0.3 2.4 1.0 2.4 D ● SL Series CFP25 -0150F (Lower Contact Type) No. of Pins B A • Specifications

CFP24

Contextual Info: FPC Connector CIC Type H=2.4mm 1.0mm Spacing (SMT) ● Upper Contact Type CFP24 -01 F No. of Pins B A x× 01 02 11 12 Embossed Taping Embossed Taping Pack in Bulk Pack in Bulk 1.5 5.2 3.4 C 1.7 • Features 1.0 0.3 2.4 2.4 D ● Lower Contact Type CFP25

Contextual Info: FPC Connector FP-10 SU SL Series CIC Type 1.0mm Spacing SMT ● Upper Contact Type CFP24 -0150F No. of Pins 極数 B A (2.0) 1.0(Spacing) 1.5 5.2 3.4 C 1.7 • Features 1.7 0.3 2.4 D A B C D 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 5.1 6.1 7.1

Contextual Info: FPC Connector CIC Type H=2.4mm 1.0mm Spacing (SMT) ● Upper Contact Type CFP24 -01 上接点タイプ No. of Pins 極数 B A x× 01 02 11 12 1.0 0.3 2.4 2.4 D ● Lower Contact Type • Specifications No. of Pins 極数 ×× 01 02 11 12 1. SMT対応1.0mmピッチのCIC対応FPCコネクタ

Contextual Info: FPC Connectors FP-10 SU SL Series CIC Type 1.0mm Pitch SMT ● SU Series CFP24 -0150F (Upper Contact) No. of Pins B A (2.0) 1.0(Spacing) 1.5 5.2 3.4 C 1.0 0.3 2.4 2.4 D ● SL Series CFP25 -0150F (Lower Contact) No. of Pins • Specifications B A 1. Rating : 0.5A, 100V AC/DC

Contextual Info: FPC Connectors FP-10 SU SL Series CIC Type 1.0mm Pitch SMT ● SU Series CFP24 -0150F (Upper Contact Type) No. of Pins B A (2.0) 1.0(Spacing) 1.5 5.2 3.4 C 0.3 2.4 1.0 2.4 D ● SL Series CFP25 -0150F (Lower Contact Type) No. of Pins • Specifications B

Contextual Info: CFP24S

Contextual Info: 186 I 8 SHEET File No. o 1 ~ / 1 S p e c if ic a t io n s . . . . . . . . . Current Rating : 1A AWG 2 8 /1 , 2A:awg 26 Insulation Resistance : 5*000 Megohms Dielectric withstanding voltage : 500V , a t sea level Operating tem perature : —55'C to +105’c lim ited by cable

Inter-ICs

Abstract: chn 940 S1C33L01 1431T dot led display large size with circuit diagram YUV411 i781symbol LUT43 S1C33L19 786LCD
Contextual Info: S1C33L19 Technical Manual CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33L19 Technical Manual S1C33L19 Technical Manual SEMICONDUCTOR OPERATIONS DIVISION EPSON Electronic Devices Website http://www.epson.jp/device/semicon_e Document code: 411664200 April 2009 in JAPAN D

S1C33L17

Abstract: S1C33L17D S1C33L17F Inter-ICs dot led display large size with circuit diagram LOT code stmicroelectronics S1C33L01 S1C33L17B 2451c BT 342 project
Contextual Info: S1C33L17 Technical Manual CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33L17 Technical Manual S1C33L17 Technical Manual SEMICONDUCTOR OPERATIONS DIVISION EPSON Electronic Devices Website http://www.epson.jp/device/semicon_e Document code: 411520600 Fist issue June, 2008 C B

bv228

Abstract: S1C33210 S1C33L01 MF1517-01 CP4D
Contextual Info: MF1517-01 CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33210 Technical Manual S1C33210 PRODUCT PART S1C33210 FUNCTION PART NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.

Contextual Info: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33301 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any

Contextual Info: V ~5 F ile N o. S H EET 186 JL_Z1 J S p e c ific a tio n s Current Rating : 1A AWG 2 8 /1 , 2A: awg 26 Insulation Resistance : 3 0 0 0 Megohms Dielectric withstanding voltage : 500V , at sea level Operating te m perature : —55'C to + 1 05 ‘c lim ited by cable

rca thyristor manual

Abstract: S1C33L01 a12b 014-698
Contextual Info: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33301 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any

A18I

Abstract: RELE RAS 1210 S1C33L01 K53D
Contextual Info: MF1552-01 CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33205 Technical Manual S1C33205 PRODUCT PART S1C33205 FUNCTION PART NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any

MF1359-02

Abstract: Q11C02RX Q22MA306 E0C33202 E0C33204 E0C33A104 PC-9800 S1C33L01 EM33-4M ASM-33
Contextual Info: MF1359-02 CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33 ASIC DESIGN GUIDE Embedded Array S1X50000 Series NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.

tc35

Abstract: A18E P26D S1C33000 S1C33L01 S1C33S01 8255A ic details CFP10
Contextual Info: MF1399-01 CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33S01 Technical Manual S1C33S01 PRODUCT PART S1C33S01 FUNCTION PART NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.