CC0508 Search Results

C0816X7R1C104M

Abstract: C0510 C0816 C1220 C1632 C1632X5R0J106MT C0816X5R0J225M
Contextual Info: 持蚊薮頭盲管頭塀窮否匂 詰 ESL, 宜廾侏 C 狼双 Type: C0510[EIA CC0204] C0816[EIA CC0306] C1220[EIA CC0508] C1632[EIA CC0612] Issue date: April 2007 ●芝墮坪否，壓短嗤嚠御議秤趨和嗤辛嬬個序才延厚，萩嚠參疎盾。 ● RoHS 峺綜議斤哘：燕幣茅阻卆象 EU Directive 2002/95/EC 窒茅議喘余岻翌，隆聞喘忍，鑽，康，鎗勺候式蒙協粤狼佃伴質 PBB，PBDE 吉。

C0510

Abstract: C0816X7R1C104K C0816 C1220 C1632 capacitor 475 CC0306 C0816X5R0J225M
Contextual Info: C Series Low ESL Flipped Type Type: C0510 [EIA CC0204] C0816 [EIA CC0306] C1220 [EIA CC0508] C1632 [EIA CC0612] Issue date: January 2011 TDK MLCC US Catalog Version A11 REMINDERS Please read before using this product SAFETY REMINDERS REMINDERS 1. 2. 3. 4.

Contextual Info: MULTILAYER CERAMIC CHIP CAPACITORS C Series Commercial Grade Low ESL Reverse Geometry Type: C0510 [EIA CC0204] C0816 [EIA CC0306] C1220 [EIA CC0508] C1632 [EIA CC0612] lssue date: January 2013 Version A13 MULTILAYER CERAMIC CHIP CAPACITORS REMINDERS Please read before using this product

C4927

Abstract: SDRAM 2MX16X4 TSOP54 RNA4A8E103JT CC0603 2MX16x4 MCR03EZHF K4S281632B-TC-L1H cc0508 105-1089-00 RM73B1JT301J
Contextual Info: Valis_X2_BOM.txt # Board Station BOM file # date : Thursday September 20, 2001; 14:04:26 # Variant : No_Stuff REFERENCE COMPANY PART NO. COUNT DESCRIPTION GEOMETRY 1 2 05085C104MA11A 1 24 cap, AVX, 0.1uF outline cc0508 3 4 0603YC103JAT2A 0603YC104JAT2A 1 51

085AC

Abstract: C0816X5R0J225M050AC
Contextual Info: Multilayer Ceramic Chip Capacitors General use Low ESL, Flipped type C series Type: C0510[EIA CC0204] C0816[EIA CC0306] C1220[EIA CC0508] C1632[EIA CC0612] Issue date: August 2011 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

diode c05*10

Abstract: C0510 jb transistor C0816X7R1C104M diode c0510 JB 80 JB Series C0816 C1220 C1632
Contextual Info: Multilayer Ceramic Chip Capacitors Low ESL, Flipped type C series Type: C0510[EIA CC0204] C0816[EIA CC0306] C1220[EIA CC0508] C1632[EIA CC0612] Issue date: April 2007 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

C0816X7R1C104K

Abstract: C0510 CC0612 C0816X5R0J225M
Contextual Info: C Series Low ESL Flip Type Type: C0510 [EIA CC0204] C0816 [EIA CC0306] C1220 [EIA CC0508] C1632 [EIA CC0612] Issue date: April 2011 TDK MLCC US Catalog Version B11 REMINDERS Please read before using this product SAFETY REMINDERS REMINDERS 1. 2. 3. 4. 5. 6.

AMP 120527-1

Abstract: CJ10-000J MNR14-EOAB-J-103 sanyo c35 SMB-403 RM73B1JT100J WSL2512R010F WSL-2512-R010F CR10-102J LED0603
Contextual Info: # Board Station BOM file # date : Tuesday March 14, 2000; 15:45:35 # Variant : No_Stuff ITEM_NUMBER COMPANY PART NO. GEOMETRY 1 2 05085C104MA11A 0603YC104JAT2A cc0508 cc0603 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

C1220X7R1E104M085AC

Abstract: C0816X5R0J225M050AC
Contextual Info: MULTILAYER CERAMIC CHIP CAPACITORS C Series Low ESL Reverse Geometry Type: Issue date: C0510 [EIA CC0204] C0816 [EIA CC0306] C1220 [EIA CC0508] C1632 [EIA CC0612] January 2013 TDK MLCC Global Catalog Version A13 REMINDERS Please read before using this product

Contextual Info: MULTILAYER CERAMIC CHIP CAPACITORS C Series Commercial Grade Low ESL Reverse Geometry Type: C0510 [EIA CC0204] C0816 [EIA CC0306] C1220 [EIA CC0508] C1632 [EIA CC0612] lssue date: Oct 2013 004-01 / 20131010 / mlcc_commercial_lwreverse_en MULTILAYER CERAMIC CHIP CAPACITORS

Contextual Info: 2/3 C0816 (EIA CC0306) TYPE SHAPES AND DIMENSIONS C1220 (EIA CC0508) TYPE SHAPES AND DIMENSIONS 1.6 Dimensions in mm 0.2min. T T 0.8 1.25±0.2 0.5min. 2.0±0.2 Dimensions in mm CAPACITANCE RANGES: CLASS 2 TEMPERATURE CHARACTERISTICS: JIS B(BJ)(±10%), EIA X5R/X7R(±15%)

C0816X7R1C104K

Abstract: C0816X5R0J474K C0510 CC0306 C0816 C1220 C1632 C0816X7S0G474M C0816X7R1C104M CC0612
Contextual Info: 積層セラミックチップコンデンサ 低 ESLフリップタイプ C シリーズ Type: C0510[EIA CC0204] C0816[EIA CC0306] C1220[EIA CC0508] C1632[EIA CC0612] Issue date: April 2007 ●製品をより正しく、安全にご使用いただくために、さらに詳細な特性・仕様をご確認いただける納入仕様書をぜひご請求ください。

CC0508

Contextual Info: MULTILAYER CERAMIC CHIP CAPACITORS Low ESL flip type C series, C1220 EIA:CC0508 APPLICATIONS Personal computers, word processors, portable telephones, cordless telephones, camcorders, etc. SHAPES AND DIMENSIONS 0.2min. 0.5min. 1.25±0.2 2±0.2 1max. C1220 TYPE [EIA: CC0508]

CKD310

Abstract: CGA3E C3216X7R2E473KT CKD310JB0J226S CC01005 AEC-Q200 C1005 C1608 C3216 CC0201
Contextual Info: TDK MLCC US Catalog Version A10 This page is intentionally left blank. ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ General Application, C Series Mid Voltage Application, C Series High Voltage Application, C Series High Temperature Application, C Series Tight Tolerance Capacitor, C Series

JB Series

Abstract: C0816 C1220
Contextual Info: 1/3 LW Flipped Type Multilayer Ceramic Chip Capacitors C Series FEATURES • Positioning the electrodes along the length of the chip device, reduces ESR and ESL components over conventional products. • Provides high frequency noise suppression effect because the

MNR14EOABJ103

Abstract: nichicon c86 sot23 63 sot23 6pin RC0603 c143 MCR10-EZHM-J MCR10-EZHM RN56 Z4 SOT23
Contextual Info: Sandpoint_X3B_BOM.txt # Board Station BOM file # date : Wednesday May 23, 2001; 16:19:41 # Variant : No_Stuff Sandpoint X3B ITEM_NUMBER REFERENCE COMPANY PART NO. COUNT 1 2 05085C103MA11A 05085C104MA11A 1 9 0603YC104JAT2A 49 4 5 6 C1 C71 C90 C91 C92 C93 C94 C95 C96

DE0805B102K2K

Abstract: epson r230 C355 SMD TP-105-01-00 c217 samsung c246 SMD R220 HEADER 1x2 epson c224 NPI-6120-30
Contextual Info: # Board Station BOM file # date : Thursday August 2, 2001; 16:08:26 # Variant : No_Stuff REFERENCE C54 C55 C56 C57 C58 C59 C60 C61 C62 C63 C64 C65 C66 C67 C68 C69 C70 C71 C72 C73 C74 C75 C76 C77 C78 C79 C80 C81 C82 C83 C84 C85 C86 C87 C88 C89 C90 C91 C92 C93 C94

RC0603

Abstract: MTD20N03HDL 0603YC104JAT2A 218-8LPST 293D476X9016D2T AM29DL323CB90EI DS1834S GRM39COG101J050AD IHSM-5832 IS24C02-3G
Contextual Info: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 A B # Board Station BOM file # date : Thursday October 4, 2001; 11:39:51 AM # Variant : No_ ITEM_NO COMPANY PART NO. 1

Intel BGA

Abstract: ROHM R25 c143 epson c45 LH5168SHN RN66 IEEE-1386 epson c67 145154-4 c86 sot23
Contextual Info: # Board Statio n BOM file # date : Wednesday November 29, 2000; 11:57:19 # Variant : No_Stuff Sandpoint_X Updated on 2 ITEM COUNT REFERENCE 1 COMPANY PART NO. ppceval-sp3 rev x3 1 2 C1 05085C103MA11A 1 3 C71 C90 C91 C92 C93 C94 C95 C96 C138 05085C104MA11A

RC0603

Abstract: TSSOP48 R77 motorola ROHM R25 RNA4A 1206YC105MAT2A RM73B2ET000J apple bom 2MX16x4 0603YC104JAT2A
Contextual Info: # Board Station BOM file # date : Wednesday September 6, 2000; 16:04:09 # Variant : No_Stuff # Modified for MPC7400P Processor This BOM reflects VDD=1.8V and VIO=3.3V REFERENCE ITEM COMPANY PART NO. AlLTIMUS REV X3 7400/107 PMC Updated on 11/28/2000 COUNT

RNA4A8E472JT

Abstract: CC1812 j1 u10 samsung MCCA104K0NRT RC0402 RNA4A header 2x5 MIC29152BU SDRAM 2MX16X4 TSOP54 LED-0603
Contextual Info: # Board Station BOM file # date : Thursday August 14, 2003; 10:42:21 # Variant : No_Stuff REFERENCE C37 C38 C39 C40 C41 C42 C43 C44 C45 C46 C47 C48 C49 C50 C51 C52 C53 C55 C56 C57 C58 C59 C60 C61 C62 C63 C64 C65 C66 C67 C68 C69 C70 C71 C72 C73 C74 C75 C76

105-1089-00

Abstract: TSSOP48 RC0603 ROHM R25 ECEA1CGE100 CC0603 108 c42 1206YC105MAT2A 293D107X96R3D2T 74VCX16244MTD
Contextual Info: # Board Station BOM file # date : Wednesday September 6, 2000; 16:04:09 # Variant : No_Stuff # AlLTIMUS REV X3 750/107 PMC Updated on 11/28/2000 Modified for MPC750P Processor This BOM reflects VDD=1.9V and VIO=3.3V REFERENCE ITEM COMPANY PART NO. COUNT MPMCMAX Rev. X3

Contextual Info: 1/3 LW Flipped Type Multilayer Ceramic Chip Capacitors C Series FEATURES • Positioning the electrodes along the length of the chip device, reduces ESR and ESL components over conventional products. • Provides high frequency noise suppression effect because the

TSSOP48

Abstract: ROHM R25 CJ10-000J RC0603 108 c42 SSOP20 0603YC104JAT2A 1206YC105MAT2A 293D107X96R3D2T SMB-403
Contextual Info: # Board Station BOM file # date : Wednesday September 6, 2000; 16:04:09 # Variant : No_Stuff # AlLTIMUS REV X3 7410/107 PMC Updated on 11/28/2000 Modified for MPC7410P Processor This BOM reflects VDD=1.8V and VIO=3.3V GEOMETRY MPMCMAX Rev. X3 PCB C1 1 05085C103MA11A