BZM5267B Search Results

BZM5221B

Abstract: BZM5222B BZM5223B BZM5224B BZM5225B BZM5226B BZM5267B
Contextual Info: BZM5221B - BZM5267B VISHAY 500mW SURFACE MOUNT ZENER DIODE LITEMZI y POWER SEMICONDUCTOR Features 500m W Power Dissipation High Stability Low Noise Fits onto S O D 323/S O T 23 Foot Print Hemetic Package Mechanical Data Case: MicroMELF Terminals: Solderable per M IL-STD-202,

BZM5221B

Abstract: BZM5222B BZM5223B BZM5224B BZM5225B BZM5226B BZM5267B DS30015
Contextual Info: BZM5221B - BZM5267B 500mW SURFACE MOUNT ZENER DIODE Features 500mW Power Dissipation High Stability Low Noise Hemetic Package Mechanical Data Case: MicroMELF, Glass Terminals: Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Marking: Cathode Band Only

Contextual Info: BZM5221B - BZM5267B 500mW SURFACE MOUNT ZENER DIODE POWER SEMICONDUCTOR Features 500mW Power Dissipation High Stability Low Noise Hemetic Package D C • • • • B A Mechanical Data • • • • • Case: MicroMELF, Glass Terminals: Solderable per MIL-STD-202,

Contextual Info: DIODES INC PRODUCT CHANGE NOTICE Contact Date: Implementation Date: 7/10/02 7/10/02 Alert Category: Discrete Semiconductor DCS/PCN-1008 Alert Type: PCN #: Obsolescence Notice - Not recommended for design PCN #:2002-1008 TITLE BZM5221B – BZM5267B Status Inactive

Contextual Info: BZM5221B - BZM5267B 500mW SURFACE MOUNT ZENER DIODE Features 500mW Power Dissipation High Stability Low Noise Hemetic Package D B A Mechanical Data • · · · · C · · · · Case: MicroMELF, Glass Terminals: Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band

Contextual Info: BZM5221B - BZM5267B 500mW SURFACE MOUNT ZENER DIODE Features 500m W Power Dissipation High Stability Low Noise Fits onto S O D 323/S O T 23 Foot Print Hemetic Package Mechanical Data_ Case: MicroMELF Terminals: Solderable per M IL-STD-202,

BZM5221B

Contextual Info: BZM5221B - BZM5267B 500mW SURFACE MOUNT ZENER DIODE Features • • • • • 500mW Power Dissipation High Stability Low Noise Fits onto SOD323/SOT23 Foot Print Hemetic Package Mechanical Data • • • • • Case: MicroMELF Terminals: Solderable per MIL-STD-202,

smd marking 911 zener

Abstract: d3g smd NPN Transistor smd code LY 83 marking codes transistors a8 sot-23 TRANSISTOR SMD MARKING CODE s2a 1045ct mosfet SOD-123 a18 W06* MARKING smd code KBJ 3580 6045pt
Contextual Info: RETURN TO SHORT FORM TABLE OF CONTENTS ################################### RETURN TO SHORT FORM INDEX RETURN TO DIODES INC. NEW PRODUCTS PAGE Short Form Diodes Incorporated 3050 E. Hillcrest Drive Westlake Village, CA 91362-3154 September 1999 Specifications are subject to change without notice.

Contextual Info: BZM5221B SERIES SURFACE MOUNT ZENER DIODES VOLTAGE 2.4 to 75 Volts MICRO-MELF 500 mWatts POWER Unit : inch mm FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes .040(1.0) .048(1.2)DIA. • Lead free in comply with EU RoHS 2002/95/EC directives

BZM5227B

Abstract: BZM5221B BZM5222B BZM5223B BZM5224B BZM5225B BZM5226B BZM5228B BZM5229B
Contextual Info: BZM5221B SERIES SURFACE MOUNT ZENER DIODES VOLTAGE 2.4 to 75 Volts MICRO-MELF 500 mWatts POWER Unit : inch mm FEATURES • Planar Die construction • 500mW Power Dissipation .040(1.0) .048(1.2)DIA. • Ideally Suited for Automated Assembly Processes MECHANICAL DATA

Contextual Info: BZM5221B SERIES SURFACE MOUNT ZENER DIODES VOLTAGE 2.4 to 75 Volts 500 mWatts POWER MICRO-MELF Unit : inch mm FEATURES • Planar Die construction • 500mW Power Dissipation .040(1.0) .048(1.2)DIA. • Ideally Suited for Automated Assembly Processes MECHANICAL DATA