BACC63BN1 Search Results

Contextual Info: C0909A MMB Series C48 Family Vibration-Proof Plug Connector Cinch 1.345 Bayonet Coupling C0909AXXXXXXX BACC63BN1 Dimensions S hell Size 8 10 12 14 16 18 20 22 24 A Dia. in .328 .420 .580 .664 .769 .902 1.033 1.152 1.282 B Dia. mm 8.331 10.668 14.732 16.866

Contextual Info: C0909A MMB Series C48 Family Vibration-Proof Plug Connector 1.345 (34.164) Max. Bayonet Coupling C0909AXXXXXXX BACC63BN1 3 Dimensions Shell Size 8 10 12 14 16 18 20 22 24 A Dia. in .328 .420 .580 .664 .769 .902 1.033 1.152 1.282 B Dia. mm 8.331 10.668 14.732

BACC63 Series

Abstract: BACC63 BACC10GH BOEING bacc63 BACC45FT BACC63BP bacc10 BACC10JS BACC45FN BACC45
Contextual Info: CYLINDRICAL C48 Series/MIL-C-26500 Accessories & Application Tooling Boeing: BACC45 / BACC63 Series MIL-C-26500 C48 Series Introduction • Qualified to MIL-C-26500. ■ Styles qualified to Boeing BACC45 Series. FEATURES ■ Styles qualified to Boeing BACC63 Series.

DC-37PTI

Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

DIN 41529

Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

BACC63CB

Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.