L323C
Contextual Info: ADVANCE INFORMATION AMDZ1 Am29DL32xC 32 Megabit 4 M x 8 -Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Sim ultaneous Operation Flash Mem ory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Simultaneous Read/Write operations — Data can be continuously read from one bank w hile
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AMD marking CODE flash AM29DL323DB
Abstract: AM29DL32XD 56-Pin S29JL032 DL322 DL323 DL324 S29JL032H S29PL032J
Contextual Info: Am29DL322D/323D/324D Data Sheet This product has been retired and is not available for designs. For new and current designs involving TSOP packages, S29JL032H supersedes Am29DL32xD and is the factory-recommended migration path. Please refer to the S29JL032H Datasheet for specifications and ordering information.
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am29dl322d/323d/324ds29jl032ham29dl32xds29pl032j+6amd marking code flash am29dl323db56-pins29jl032dl322dl323dl324
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Contextual Info: TECHNOLOGY BACKGROUND AMD DL160 and DL320 Series Flash: New Densities, New Features 2 Am29DL16x and Am29DL32x Series: New Densities, New Features Introduction The DL160 series and DL320 series are the newest devices in the family of low power Simultaneous Read/Write Flash devices from AMD. These devices utilize the same
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S29JL032
Abstract: S29JL032H am29dl323 DL322 DL323 DL324 S29PL032J
Contextual Info: Am29DL32xG Data Sheet RETIRED PRODUCT This product has been retired and is not recommended for designs. For new and current designs, S29JL032H for TSOP packages and S29PL032J (for FBGA packages) supersede AM29DL32xG as the factory-recommended migration path. Please refer to each respective datasheets for specifications and ordering information. Availability of this document is retained for reference and historical
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am29dl32xgs29jl032hs29pl032js29jl032+4am29dl323dl322dl323dl324
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AM29DL32XD
Abstract: d323db 324D S29JL032 DL322 DL323 DL324 S29JL032H S29PL032J AM29DL322DB120
Contextual Info: Am29DL322D/323D/324D Data Sheet For new designs involving TSOP packages, S29JL032H supersedes Am29DL32xD and is the factory-recommended migration path. Please refer to the S29JL032H Datasheet for specifications and ordering information. For new designs involving Fine-pitch BGA FBGA packages, S29PL032J supersedes Am29DL32xD and is the
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S29JL032
Abstract: DL322 DL323 DL324 S29JL032H S29PL032J
Contextual Info: Am29DL32xG Data Sheet RETIRED PRODUCT This product has been retired and is not recommended for designs. For new and current designs, S29JL032H for TSOP packages and S29PL032J (for FBGA packages) supersede AM29DL32xG as the factory-recommended migration path. Please refer to each respective datasheets for specifications and ordering information. Availability of this document is retained for reference and historical
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Contextual Info: P R O D U C T B R I E F Simultaneous Read/Write Flash Memory Devices Am29DL400 Am29DL800 Am29DL16x Am29DL32x New High Density Device Features Ba n M k 1 b Ba n (M k 2 b) t Pa r Ba n (M k 2 b) Key features include the following: Device Bank Sizes Ba n (M k 1
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am29dl400am29dl800am29dl16xam29dl32x+6am29lvxxxam29dl400bb/tam29dl800bb/tam29dl16xcb/t16/512k16/1m
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Contextual Info: ADVANCE INFORMATION AMDZ1 Am29DL32xC 32 Megabit 4 M x 8 -Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Sim ultaneous Operation Flash Mem ory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • — Data can be continuously read from one bank w hile executing erase/program functions in other bank.
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am29dl32xc16-bitfbd06340-pin+129dl32xc
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d323gb90v
Abstract: D323GB9 am29dl324 D323GT90V DL322 DL323 DL324 D323GB d323gb90
Contextual Info: ADVANCE INFORMATION Am29DL32xG 32 Megabit 4 M x 8-Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Simultaneous Read/Write operations — Data can be continuously read from one bank while
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AM29DL32XD
Abstract: DL322 DL323 DL324
Contextual Info: Am29DL32xG Data Sheet -XO\ 7KH IROORZLQJ GRFXPHQW VSHFLILHV 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG
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am29dl32xg64-ballam29dl32xddl322+2dl323dl324
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d323gb90v
Abstract: d323gb90 D323GT90V D323GB D323GB90P AMD K6
Contextual Info: ADVANCE INFORMATION Am29DL32xG 32 Megabit 4 M x 8-Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Minimum 1 million write cycles guaranteed per sector ■ Simultaneous Read/Write operations
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Contextual Info: PRELIMINARY Am49DL32xBG Stacked Multi-Chip Package MCP Flash Memory and SRAM Am29DL32xG 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) Pseudo Static RAM with Page Mode DISTINCTIVE CHARACTERISTICS
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AM29DL32XD
Abstract: AMD K7 data sheet PAL 0007 E amplificador DL322 DL323 DL324 AM29DL323GB-90WDI D323GB
Contextual Info: ADVANCE INFORMATION Am29DL32xG 32 Megabit 4 M x 8-Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Simultaneous Read/Write operations — Data can be continuously read from one bank while
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AM29DL32XD
Abstract: SA06 SA07 SA64 SA65 SA70 SA66 sa69
Contextual Info: Migrating from Am29DL32xD Family to Am29DL32xG Family Application Note -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ
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d323gb90v
Abstract: AM29DL32XD DL322 DL323 DL324 Am29DL322
Contextual Info: Am29DL32xG Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and
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DL322
Abstract: DL323 Am29DL32xCT
Contextual Info: ADVANCE INFORMATION Am29DL32xC 32 Megabit 4 M x 8-Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory Back DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Simultaneous Read/Write operations — Data can be continuously read from one bank while
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DL160
Contextual Info: TECHNOLOGY BACKGROUND Back AMD DL160 and DL320 Series Flash: New Densities, New Features 2 Am29DL16x and Am29DL32x Series: New Densities, New Features Introduction The DL160 series and DL320 series are the newest devices in the family of low power Simultaneous Read/Write Flash devices from AMD. These devices utilize the same
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A9RV
Contextual Info: Am29DL32xG Data Sheet RU QHZ GHVLJQV LQYROYLQJ 7623 SDFNDJHV 6-/+ VXSHUVHGHV $P'/[* DQG LV WKH IDFWRU\UHFRPPHQGHG PLJUDWLRQ SDWK 3OHDVH UHIHU WR WKH 6-/+ 'DWDVKHHW IRU VSHFLILFDWLRQV DQG RUGHULQJ LQIRUPDWLRQ )RU QHZ GHVLJQV LQYROYLQJ )LQHSLWFK %*$ )%*$ SDFNDJHV 63/- VXSHUVHGHV $P'/[* DQG LV WKH
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amd part marking
Abstract: AM29DL32XD AMD K7 data sheet D323GB9 marking code j6 marking E5 PAL 0007 E amplificador DL322 DL323 DL324
Contextual Info: ADVANCE INFORMATION Am29DL32xG 32 Megabit 4 M x 8-Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Simultaneous Read/Write operations — Data can be continuously read from one bank while
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s29al004d55
Abstract: S29AL016D70TFI010 am29LV8000 S29PL064J70BFI120 S29AL016D70BFI020 Am29LV8000B S29JL064H90TFI000 S29AL008D70TFI020 S29JL032H70TFI020 S29JL032
Contextual Info: ORDERING PART NUMBER MAPPING GUIDE March, 2005 Release AMD PRODUCTS FUJITSU PRODUCTS SPANSION PRODUCTS Am29LV400B S29AL004D Am29LV800B/D S29AL008D Am29LV160D MBM29LV160TE/BE S29AL016D Am29LV160M S29AL016M Am29DL32xG TSOP MBM29DL32xE • MBM29DL32F • MBM29DL34F (TSOP)
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d323gb90
Abstract: SA69-SA67 D323GB12V D323GT90V
Contextual Info: ADVANCE INFORMATION Am29DL32xG 32 Megabit 4 M x 8-Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Simultaneous Read/Write operations — Data can be continuously read from one bank while
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DL322
Abstract: DL323 DL324
Contextual Info: PRELIMINARY Am41DL32x4G Stacked Multi-Chip Package MCP Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (512 K x 8-Bit/256 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features
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CA 324G
Abstract: DL322 DL323 DL324
Contextual Info: PRELIMINARY Am42DL32x4G Stacked Multi-Chip Package MCP Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (256 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features SOFTWARE FEATURES
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DL322
Abstract: DL323 DL324 M41000002R
Contextual Info: Am41DL32x8G Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and
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