93.5PB Search Results

DIN EN 60751

Contextual Info: Platinum Temperature Sensors FC – Product Series Temperature Range: –50°C.+150/250/400/600°C Platinum temperature sensor elements in FC Flip Chip construction Soldering junction (reflow solderable) Technical Data Specification: DIN EN 60751

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Abstract: Internal MLCC cracking result serious failure mode 93.5pb MLCC CRACK 95Pb desk fan hmp solder air filter planar AN-0011
Contextual Info: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: sales@syfer.co.uk Web: www.syfer.com Solder Alloy choice for through hole

Contextual Info: SMD series RTD Platinum Sensor For surface mounted temperature applications Benefits & Characteristics • Excellent long-term stability • Low self-heating • Fast response time • Class A available • Customer specific sensor available upon request Illustration

Contextual Info: FlipChip series FC platinum sensor For the automatic assembling on PCB by soldering or bonding Benefits & Characteristics ▪▪ Excellent long-term stability ▪▪ Optimal price-performance ratio ▪▪ Minimum space consumption on PCB ▪▪ Bondable versions available

smd t05

Abstract: Platinum Resistance Temperature sensor smd mk
Contextual Info: Platinum Temperature Sensors SMD – Product Series Temperature Range: –50°C.+150/250°C Platinum temperature sensor elements in SMD construction Soldering junction reflow solderable Technical Data Specification: DIN EN 60751 Temperature range:

93.5pb

Abstract: DIN IEC 68 din IEC 68 150 p1k0.1206 din IEC 68 soldering din 68 150 P0K5.1206
Contextual Info: Platinum Temperature Sensors SMD – Product Series Temperature Range: –50°C.+150/250°C Platinum temperature sensor elements in SMD construction Soldering junction reflow solderable , RoHs compliant Technical Data Temperature range: Classes: Contact connection:

Contextual Info: SMD Series SMD platinum sensor For the automatic assembling on PCBs Benefits & Characteristics ▪▪ Excellent long-term stability ▪▪ Class A available ▪▪ Low self-heating ▪▪ Customer specific sensor available upon request ▪▪ Fast response time

Contextual Info: FlipChip series RTD Platinum Sensor For surface mounted temperature applications Benefits & Characteristics • Excellent long-term stability • Optimal price-performance ratio • Minimum space consumption on PCB • Bondable versions available • Fast response time

P0K1.0805.2P.A

Abstract: P1K0.0805.2P.A
Contextual Info: SMD series RTD Platinum Sensor For surface mounted temperature applications Benefits & Characteristics • Excellent long-term stability • Class A available • Low self-heating • Customer specific sensor available upon request • Fast response time Illustration

Contextual Info: FlipChip series FC platinum sensor For the automatic assembling on PCB by soldering or bonding Benefits & Characteristics ▪▪ Excellent long-term stability ▪▪ Optimal price-performance ratio ▪▪ Minimum space consumption on PCB ▪▪ Bondable versions available

Contextual Info: 150 °C series Platinum sensor with wires For low temperatures Benefits & Characteristics ▪▪ Excellent long-term stability ▪▪ Fast response time ▪▪ Low self-heating ▪▪ Metalized backside available ▪▪ Long isolated wires ▪▪ Customer specific sensor available upon request

din 43760

Abstract: Pt 1000 sensor Pt 1000 sensor connection smd transistor 1p data din IEC 68 150 6180ppm SMD 2x 3850PPM class-a Pt 100 sensor connection
Contextual Info: SMD 0805 + 1206 Platinum and Nickel Thin-Film Chip Sensor Product To meet the market requirements for increasingly more efficient and economical manufacturing processes, we have developed the SMD 1206 series. A platinum or nickel temperature sensor which is designed for use in

din IEC 68 soldering

Abstract: din IEC 68
Contextual Info: Platinum Temperature Sensors FC – Product Series Temperature Range: –50° C.+150/250/400/600°C Platinum temperature sensor elements in FC Flip Chip construction Soldering junction (reflow solderable), RoHs compliant Technical Data Temperature range:

din 43760

Abstract: DIN IEC 68 din IEC 68 soldering
Contextual Info: Nickel Temperature Sensors FC – Product Series Temperature Range: –60°C.+200°C Nickel temperature sensor elements in FC Flip Chip construction Soldering junction (reflow solderable) Technical Data Specification: DIN 43760 Temperature range:

Internal MLCC cracking result serious failure mode

Abstract: hmp solder 93.5pb air filter planar MLCC CRACK 93.5pb
Contextual Info: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: sales@syfer.co.uk Web: www.syfer.com Solder Alloy choice for through hole