895X3 Search Results

91208

Abstract: INNER CARTON LABEL
Contextual Info: 107-68674 Packaging Specification 07May08 Rev B PCI EXPRESS CONN. 1. PURPOSE 目的 Define the packaging specifiction and packaging method of PCI EXPRESS CONN. 订定 PCI EXPRESS CONN. 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

DSA0030957

Abstract: INNER CARTON LABEL
Contextual Info: 107-68668 Packaging Specification 20Dec07 Rev G SPRING CLIP 1. PURPOSE 目的 Define the packaging specifiction and packaging method of SPRING CLIP. 订定 SPRING CLIP 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 Product Description

Contextual Info: 107-68766 Packaging Specification 08Jan09 Rev B CONTACTS, HDMI, HDMI/E-SATA STACKED 1. PURPOSE 目的 Define the packaging specifiction and packaging method of CONTACTS, HDMI, HDMI/E-SATA STACKED. 订定 CONTACTS, HDMI, HDMI/E-SATA STACKED 产品之包装规格及包装方式。

1981386-1

Abstract: 2069496 1981080-1
Contextual Info: 107-68888 Packaging Specification 13Nov09 Rev B INDUSTRIAL MINI I/O ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of INDUSTRIAL MINI I/O ASSY. 订定 INDUSTRIAL MINI I/O ASSY 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

02 123 202 895 02

Contextual Info: Type 300/301, - 5 5 °C to 105 °C Long-Life, Switching Power Grade Radial High Capacitance and Ultra-Low ESR The Types 300 and 301 are the wide-temperature, low-ESR capacitors for power-supply outputs and UPS battery stiffening. The exceptionally low ESRs enable high ripplecurrent capability. With series inductance o f 12 to 16 nH

HP 1003 WA

Contextual Info: A C O M P A N Y OF TYPE 767D Alum inum C apacitors SPRAGUE + 105°C, Tubular, Radial Lead FEATURES • Long life and stability • Low impedance • Low ESR • High ripple current capability • High capacitance PERFORMANCE CHARACTERISTICS Life Validation Test: 5000 hours @ + 105°C.

SOCKET MXM

Abstract: SOCKET MXM tyco 200POS SODIMM 200p tyco DDR1 DDR2 SODIMM X-1473149-X DDR2 SO-DIMM INNER CARTON LABEL X147300
Contextual Info: 107-68546 Packaging Specification Sep.13,06 Rev E SEMI-HARD TRAY ASSY FOR DDR SODIMM SOCKET 200POS AND ASSY VGM MXM SOCKET 230P 7.8H WITH NUT 1. PURPOSE 目的 Define the packaging specifiction and packaging method of SEMI-HARD TRAY ASSY FOR DDR SODIMM SOCKET 200POS.

INNER CARTON LABEL

Contextual Info: 107-68834 Packaging Specification 18Dec08 Rev B Micro TCA CONN. 1. PURPOSE 目的 Define the packaging specifiction and packaging method of Micro TCA CONN. 订定 Micro TCA CONN 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 Product

RQR-ME-030B

Abstract: 91208 INNER CARTON LABEL MR260
Contextual Info: 107-68879 Packaging Specification 07Aug09 Rev O RITS CONN & MEMORY BOARD 1. PURPOSE 目的 Define the packaging specifiction and packaging method of RITS CONN & MEMORY BOARD. 订定 RITS CONN & MEMORY BOARD 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

68271

Abstract: 425x30
Contextual Info: 107-68335 Packaging Specification 28May08 Rev P SINGLE SLOT CARDBUS ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of SINGLE SLOT CARDBUS ASSY. 订定 SINGLE SLOT CARDBUS ASSY 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围