81C56RH Search Results

81C55

Abstract: intel 8155 80C85 8155 intel microprocessor programming 81C55RH 81C56RH HS-80C85RH HS-81C55RH HS-81C56RH 11KA2
Contextual Info: 5ÖE J> H A RR IS S E M I C O N D SE CT OR HARRIS S E M I C O N D U C T O R 4 3 0 S 27 1 0 0 4 5 5 3 t 217 « H A S HS-81C55RH HS-81C56RH Radiation Hardened 256 x 8 CMOS RAM Decem ber 1992 Features “ * 'P 4 U Pinouts '2 3 r l2 - . 4 0 P IN C E R A M IC D IP

HS-81C55RH

Abstract: HS-81C56RH 5962R9XXXX01QRC 5962R9XXXX01QXC 5962R9XXXX01VRC 81C55RH 81C56RH HS-80C85RH intel 8155 pa 3029 b
Contextual Info: HS-81C55RH, HS-81C56RH Radiation Hardened 256 x 8 CMOS RAM March 1996 Features Description • Devices QML Qualified in Accordance with MIL-PRF-38535 The HS-81C55/56RH are radiation hardened RAM and I/O chips fabricated using the Intersil radiation hardened SelfAligned Junction Isolated SAJI silicon gate technology.

81C55

Abstract: s125
Contextual Info: H A R R HS-81C55RH HS-81C56RH I S S E M I C O N D U C T O R Radiation Hardened 256 X 8 CMOS RAM December 1992 Pinouts Features 40 PIN CERAMIC DIP CASE OUTLINE D5, CONFIGURATION 3 • Radiation Hardened EPI-CMOS - Parametrlcs Guaranteed 1 x 10s RAD SI - Transient Upset > 1 x 10 RAD(SI)/s

sem ad 222m

Abstract: ic 8155 timer sem aa 222m T81C
Contextual Info: HS-81C55RH HS-81C56RH HARRIS S E M I C O N D U C T O R Radiation Hardened 256 x 8 CMOS RAM March 1996 Features Description • Devices QML Qualified in Accordance with MIL-PRF-38535 The HS-81C55/56RH are radiation hardened RAM and I/O chips fabricated using the Harris radiation hardened SelfAligned Junction Isolated SAJI silicon gate technology.

intel 8155

Abstract: HS1-81C55RH-8 8155 programmable peripheral interface 81C55 81c55 programmable peripheral interface HS-81C56RH 5962R9676601QXC 5962R9676601QYC 5962R9676601VXC 5962R9676601VYC
Contextual Info: HS-81C55RH, HS-81C56RH TM Data Sheet August 2000 File Number Radiation Hardened 256 x 8 CMOS RAM Features The HS-81C55/56RH are radiation hardened RAM and I/O chips fabricated using the Intersil radiation hardened SelfAligned Junction Isolated SAJI silicon gate technology.

intel 8155

Abstract: 8155 port 5962R9XXXX01QRC 5962R9XXXX01QXC 5962R9XXXX01VRC 81C55RH 81C56RH HS-80C85RH HS-81C55RH HS-81C56RH
Contextual Info: HS-81C55RH HS-81C56RH S E M I C O N D U C T O R Radiation Hardened 256 x 8 CMOS RAM March 1996 Features Description • Devices QML Qualified in Accordance with MIL-PRF-38535 The HS-81C55/56RH are radiation hardened RAM and I/O chips fabricated using the Harris radiation hardened SelfAligned Junction Isolated SAJI silicon gate technology.

Contextual Info: m W HS-81C55RH HS-81C56RH HARRIS S E M I C O N D U C T O R Radiation Hardened 256 x 8 CMOS RAM D e c e m b e r 1992 Features Pinouts 40 PIN CERAMIC DIP CASE OUTLINE D5, CONFIGURATION 3 TOP VIEW • R a d ia tio n H a rd e n e d E P I-C M O S - P a r a m e lric s G u a ra n te e d 1 x 1 0 s R A D S i

80c85

Abstract: Intel 8155 Port IC intel 8155 5962R9XXXX01QXC
Contextual Info: i l i h a r r is HS-81C55RH 81 S E M I C O N D U C T O R Radiation Hardened 256 X 8 CMOS RAM March 1996 Features Description • Devices QM L Qualified in Accordance with MIL-PRF-38535 The HS-81C55/56RH are radiation hardened RAM and I/O chips fabricated using the Harris radiation hardened SelfAligned Junction Isolated SAJI silicon gate technology.

Contextual Info: REVISIONS LTR DESCRIPTION A DATE YR-MO-DA Changes in accordance with NOR 5962-R153-96. - glg B Update drawing to meet current MIL-PRF-38535 requirements. glg. APPROVED 96-06-27 Michael A. Frye 13-05-01 Charles F. Saffle REV SHEET REV B B B B B B SHEET 15

HS1-81C55RH-8

Abstract: SMD marking code sbf SMD MARKING CODE AD0 QML-38535 Defense Electronics Supply Center 81C55RH 81C56RH QML38535
Contextual Info: 1. SCOPE 1.1 Scope. This drawing forms a part of a one part - one part number documentation system see 6.6 herein . Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines