78156 Search Results

78156

Abstract: DDR3 Drawing 78156-0001 DDR3 DIMM
Contextual Info: This document was generated on 08/07/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 78156-0001 Active DDR3 DIMM 1.00mm Pitch DDR3 DIMM Socket, Vertical, SMT, with Beveled Metal Pins, Black Housing and Latches, 0.76µm Gold Au Plating, 3.94mm Beveled Metal Pin Length,

Contextual Info: This document was generated on 01/21/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 78156-0001 Active DDR3 DIMM 1.00mm Pitch DDR3 DIMM Socket, Vertical, SMT, with Beveled Metal Pins, Black Housing and Latches, 0.76µm Gold Au Plating, 3.94mm Beveled Metal Pin Length,

MATERIAL DECLARATION inductor

Contextual Info: MATERIAL DECLARATION SHEET Material SRP8040 Series Product Line SHIELDED SMD POWER INDUCTOR Date 11-October-2005 No. Construction element 1 Core 2 Wire Material group Ferrite Mn-Zn Series Copper Wire Total weight Headquarters Riverside CA Material Weight [g]

Contextual Info: MATERIAL DATA SHEET Material PMH1206 Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO

Contextual Info: MATERIAL DECLARATION SHEET Material # Model 4416T-L Product Line Networks Date 02-January-2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.14324 0.000026 0.000013 0.000037

Contextual Info: MATERIAL DATA SHEET Material PMA1206L Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO

PM32

Abstract: PM-104
Contextual Info: MATERIAL DECLARATION SHEET PM32/PM43/PM52/PM54/PM73/PM75 /PM104/PM105/PM125S SMD POWER INDUCTOR Material Product Line Date No. 1 2 3 4 31-August-2006 Construction element Core Solder Wire Adhesive PM32 Headquarters Riverside CA Material group Ferrite Ni-Zn Series

3PAD

Contextual Info: MATERIAL DECLARATION SHEET Material SRP7050 Series Product Line Power Inductor Date 14-October-2005 Rev. NO. Construction element Material group Material weight_g_ Materials CAS If applicable Average mass _%_ 1 Core Ferrite 0.946 Fe203 - Business Confidential

WIRE WOUND CHIP INDUCTOR

Abstract: MATERIAL DECLARATION inductor 88MN
Contextual Info: MATERIAL DECLARATION SHEET Material PM0402C SERIES Product Line Wire Wound Chip Inductor Date 12-September-2006 No. Construction element Material group Material Weight [g] Materials 1 Ceramic Core Ceramic 0.000695 2 Copper Wire Copper 0.00005 3 Epoxy UV epoxy

DAP 08

Abstract: FERRITE core TRANSFORMER
Contextual Info: MATERIAL DECLARATION SHEET Material # SM51522L Product Line 10/100 Transformer Date 12-February-2006 Rev. Date No. Construction element 1 Core Material group Mn-Zn FERRITE CORE Material weight [g] Materials 0.26 Fe2O3 CAS if applicable N/A MnO N/A 16 N/A 13

NC-2H

Abstract: BC-359 FEER-11 BC359 propylene oxide Iron monoxide PM600-RC er core bobbin nc-2h transformer A5075
Contextual Info: MATERIAL DECLARATION SHEET Material PM600-RC Product Line TRANSFORMER Date No. 1 10-September-2006 Construction element Iron Power Core Material group FEER-11 5S NC-2H Material Weight [g] 0.6 if applicable Average mass [%] Sum [%] Iron Monoxide 1309-37-1 70

Contextual Info: MATERIAL DECLARATION SHEET Material Model 4818T-L Product Line Resistor Network Date 27-December-2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.11340 0.000017 0.000012

Contextual Info: MATERIAL DECLARATION SHEET Material PM3316H/PM5022H Product Line SMD POWER INDUCTOR Date No. 1 2 3 4 5 2006/08/31 Construction element Core Solder Base Wire Adhesive Headquarters Riverside CA Material group Ferrite Mn-Zn Series Bar Solder Material Weight [g]

phenolic resin

Contextual Info: MATERIAL DECLARATION SHEET Material Model 4816T-L Product Line Resistor Network Date 27-December-2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.10080 0.000015 0.000011

MATERIAL DECLARATION inductor

Abstract: SRP1235
Contextual Info: MATERIAL DECLARATION SHEET Material SRP1235 SERIES Product Line SMD POWER INDUCTOR Date 13-October-2005 Rev. No. Construction element Material group Material weight [g] 1 Iron Body Iron 2.91 2 Lead Sn100% 0.07 Copper 3 4 5 Wire Coating A Adhesive Headquarters Riverside CA

CAY10-J4LF

Abstract: CAY10J4 CAY10-J4
Contextual Info: MATERIAL DECLARATION SHEET Material # CAY10-J4LF Series Product Line Chip Resistor Arrays Date 25-April-2006 RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Ceramic Substrate 0.00238 2 Conductor Terminal Electrode 0.00007 3

Contextual Info: MATERIAL DECLARATION SHEET Material CM201212 Series Product Line Wirewound Chip Inductor Date 27-April-2006 1 Construction Element Core 2 Solder Internal Connection 0.0005 3 Pad 0.0015 4 Solder Plate Terminal Electrode Terminal Solder 5 Wire Coated Wire 0.0005

PM1206CM-601-RC

Contextual Info: MATERIAL DATA SHEET Material PM1206CM-601-RC Product Line WIRE WOUND TYPE Date No. 1 2 3 06-Nov-2006 Construction element CORES WIRE EPOXY Headquarters Riverside CA if applicable Average mass [%] Fe2O3 1309-37-1 49 0.004725 NiO2 01313-99-1 15 0.000945 CuO2

Contextual Info: MATERIAL DECLARATION SHEET Material # SRP1040 SERIES Product Line SMD POWER INDUCTOR Date 13-October-2005 Rev., date No. Construction element Material group Material weight [g] 1 Iron Body Iron 2.17 2 Lead Sn100% 0.06 Copper 3 4 5 Wire Coating A Adhesive Headquarters Riverside CA

Contextual Info: MATERIAL DECLARATION SHEET Material Product Line Date Rev. CRL0603-LF Series Chip Resistor 10-March-2006 No. Construction element Material group Material weight [g] 1 Substrate Ceramic 0.0018110 2 Top conductor Silver 3 Bottom conductor Silver 4 Resistor Ruthenium

pm1008s

Abstract: e180 MATERIAL DECLARATION ferrite material declaration "MATERIAL DECLARATION SHEET"
Contextual Info: MATERIAL DECLARATION SHEET Material PM1008S SERIES Product Line Date Wire Wound Chip Power Inductor 12-September-2006 No. Construction element Material group Material Weight [g] Materials 1 Ferrite Core Ferrite 0.028 if applicable Average mass [%] Sum [%]

BT 156 transistor

Abstract: TRANSISTOR BJ 122 RCA-40637 sf 122 transistor Arnold Magnetics transistor sf 127 RCA-40637A i53b 5659065 rca transistor
Contextual Info: File No. 655 . □uobz/d RF Pow er Tran sisto rs Solid State Divi8ion 40637A Silicon N-P-N Epitaxial Planar Transistor For Frequency-Multiplier Service in Mobile, Marine, and Sonobuoy V H F Transmitters Features: • High transistor dissipation rating P j = 2 W max.

78156

Abstract: DDR3 DIMM MO-269 SD-78156-001 781560 DDR3 Drawing
Contextual Info: This document was generated on 02/16/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 781560001 Active DDR3 DIMM 1.00mm Pitch DDR3 DIMM Socket, Vertical, SMT, with Beveled Metal Pins, Black Housing and Latches, 0.76µm Gold Au Plating, 3.94mm Beveled Metal Pin Length,

SYLGARD

Abstract: SYLGARD 539 MA47416-132 MA4P202-134
Contextual Info: RoHS Compliant Silicon PIN Diode Chips V 6.0 Absolute Maximum Ratings1 @ TAMB = +25°C Unless otherwise specified Features • Switch & Attenuator Die • Extensive Selection of I-Region Lengths • Hermetic Glass Passivated CERMACHIP • Oxide Passivated Planar Chips