74299 Search Results

74299

Abstract: fci dh 22
Contextual Info: 74299 OUTPUT COMTBOIS A t Mode s elect C lear CK SI SO H L H H H L H H H H L L X X V itì* Output control C l m ft Q G 2 &>7 b I S _ £ > _ z v — h K * — ;u K X 7 H X X H '1 T z “ it) ''• 7 yg7 3 sta te r -. 74323 7) 1 ÎÈ.L tzfA 'T £ # fp J » ] U :

TMS320D

Abstract: dpdi EC K2U 74299 TMS320C30 EF vs EC LS74
Contextual Info: TLC32044C, TLC32044I VOICE BAND ANALOG INTERFACE CIRCUITS D3098, MARCH 1988-REV ISED DECEMBER 1990 Advanced LinCMOS Silicon-Gate Process Technology N PA C KA G E T O P V IE W NU C 1 ^ 2 8 D n u RESET C 2 27 U n u EODR C 3 26 J I N FSR C 4 24 D A U X IN +

To39 transistor header

Abstract: 731 triac 715 triac
Contextual Info: Package Details - TO-39 Mechanical Drawing DIMENSIONS INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX A DIA 0.335 0.370 8.51 9.40 B (DIA) 0.315 0.335 8.00 8.51 C 0.040 1.02 D 0.240 0.260 6.10 6.60 E 0.500 12.70 F (DIA) 0.016 0.021 0.41 0.53 G (DIA) 0.200 5.08

pwr4525

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR4525 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY ENCAPSULANT

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR2615 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY Headquarters Riverside CA

3050b

Abstract: TISP7350H3SL-S Bourns Sip IT 8572
Contextual Info: MATERIAL DECLARATION SHEET 3-SIP Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP7350H3SL-S

Contextual Info: Model: FVXO-PC53 SERIES LVPECL 5 x 3.2mm 3.3V VCXO Freq: 0.75 MHz to 1.35GHz Rev. 12/12/2007 Features XTREMELY Low Jitter Low Cost XPRESS Delivery Frequency Resolution to six decimal places Absolute Pull Range APR of ±50ppm -20 to +70°C or -40 to +85°C operating temperatures

26.6M

Abstract: CT-26-6M copper chromium CA 5668
Contextual Info: MATERIAL DECLARATION SHEET Material Number CT-26-6M Product Line Dials Compliance Date January 1995 RoHS Compliant Yes No. 1 2 3 4 Construction Element subpart External Housing Brake Bushing Gearwheel Housing Headquarters Riverside CA MSL Homogeneous Material

DAD 5

Abstract: TO 92 leadframe 3050b TISP4240M3LMFR-S TISP4350H3LM-S
Contextual Info: MATERIAL DECLARATION SHEET Package Type DO-92 Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the part number e.g. TISP4350H3LM-S or TISP4240M3LMFR-S.

Contextual Info: MATERIAL DECLARATION SHEET Material Number 85L CP Dual Cup Product Line Panel Control Compliance Date September 30, 2005 RoHS Compliant Yes MSL N/A Subpart mass of total wt. (%) 72 Material Mass % of total unit wt. 3.920 25 1.361 5.455 7440-50-08 3 0.163

encoder 9985

Abstract: 9985 encoder 112945-52-5 adhesive fr 309 92278 9985, encoder
Contextual Info: MATERIAL DECLARATION SHEET Material Number EMS22 – Dual Ball Bearing Product Line Magnetic Encoder Compliance Date Since inception RoHS Compliant Yes No. 1 Construction Element subpart C-Clip MSL Homogeneous Material Stainless Steel N/A Material weight

CT-23-6A

Contextual Info: MATERIAL DECLARATION SHEET Material Number CT-23-6A Product Line Dials Compliance Date January 1995 RoHS Compliant Yes No. 1 2 Construction Element subpart External Housing MSL Homogeneous Material Polycarbonate N/A Material weight [g] 1.2 Steel 0.2 Finish

CT-26-6A

Contextual Info: MATERIAL DECLARATION SHEET Material Number CT-26-6A Product Line Dials Compliance Date January 1995 RoHS Compliant Yes No. 1 2 Construction Element subpart External Housing Brake MSL Homogeneous Material Polycarbonate N/A Material weight [g] 1.2 Steel 0.2

leadframe to-220

Abstract: 727 triac triac 410 triac to-220
Contextual Info: Package Details - TO-220 Mechanical Drawing SYMBOL A B C D E F DIA G H I J K L M DIMENSIONS INCHES MILLIMETERS MIN MAX MIN MAX 0.170 0.190 4.31 4.82 0.045 0.055 1.15 1.39 0.013 0.026 0.33 0.65 0.083 0.107 2.10 2.72 0.394 0.417 10.01 10.60 0.140 0.157 3.55

7435

Abstract: H-494-3 615-PIN
Contextual Info: MATERIAL DECLARATION SHEET Material Number H-494-3 Product Line Dial Compliance Date 1985 RoHS Compliant Yes No. 1 Construction Element subpart Brake Arm MSL Homogeneous Material Stainless Steel N/A Material weight [g] 0.18 2 Brake Knob Nylon 0.08 3 Bracket

PPAP level submission requirement table

Abstract: PPAP MANUAL for automotive industry foundry metals quality MANUALS result of 200 prize bond INCOMING MATERIAL INSPECTION checklist, PCB TSMC 90nm sram SMD a006 ISO 9001 Sony foundry INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION procedure
Contextual Info: Contents Contents i Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2000 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning 1.4.3 Quality Assurance in the Project Approval Stage

material declaration semiconductor package

Abstract: asbestos safety material declaration vishay 89901 DO-219AB 58018
Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their

material declaration

Abstract: VO48
Contextual Info: 100% Material Declaration Data Sheet VO48 PK176 v2.0 February 12, 2008 Material Declaration Data Sheet Average Weight: 0.543 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight

Contextual Info: ASV,ASVK,ASL Ceramic Type List of main material declaration Item Weight(mg) 183.7 INFORMATION Material Package Base Process Name of the part Package Base Ceramic SMD Material Ceramics Item Name Lead Free Material Au / Ni Material Weight(mg) 156 Die Bonding

FXO-HC53

Abstract: HP3048
Contextual Info: Model: FXO-HC53 SERIES HCMOS 5 x 3.2mm 3.3V Oscillator Freq: 0.75 MHz to 250MHz Rev. 11/28/2007 Features XTREMELY Low Jitter Low Cost XPRESS Delivery Frequency Resolution to six decimal places Stabilities to ± 20 PPM -20 to +70°C or -40 to +85°C operating temperatures

To39 transistor header

Abstract: SCR SN 102 57287
Contextual Info: Package Details - TO-39 Mechanical Drawing DIMENSIONS INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX A DIA 0.335 0.370 8.51 9.40 B (DIA) 0.315 0.335 8.00 8.51 C 0.040 1.02 D 0.240 0.260 6.10 6.60 E 0.500 12.70 F (DIA) 0.016 0.021 0.41 0.53 G (DIA) 0.200 5.08

Contextual Info: Package Details - TO-66 Mechanical Drawing Lead Code: As indicated on mechanical drawing. Packing options: Bulk - Packing Code: C C = Anti-static coated plastic sleeves. Bulk Packing Quantity: 30 per sleeve Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m

Contextual Info: Type FCN Material Content Declaration 1913 thru 6040 Stacked Metallized Film PEN Chips for Reflow Soldering Material Content for RoHS Compliant Parts Typical Construction Material Element Group Active Part Termination CAS Mass Sum Materials if Applicable

74299

Contextual Info: Types AEB, AFC, AFK Material Content Declaration SMT Aluminum Electrolytic Capacitors AHA, AHD, AVS Material Content for RoHS Compliant Parts <1000 ppm Lead Content Typical Construction Material CAS Element Group Mass Materials if Applicable (Wt. %) ppm