6X6 TRAY Search Results

CHL8228G-00CRT

Contextual Info: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN, MSL2 package APPLICATIONS  Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based

schematic atx 250

Contextual Info: nRF2460 2.4 GHz wireless mono audio streamer Product Specification v1.0 Features • • • • • • • • • • • • World-wide 2.4 GHz ISM band operation 6x6 mm 36 pin QFN package 4 Mbps on-air data rate Mono 32 kHz audio rate 16 bit resolution

schematic atx 250

Contextual Info: nRF2460 2.4 GHz wireless mono audio streamer Product Specification v1.0 Features • • • • • • • • • • • • World-wide 2.4 GHz ISM band operation 6x6 mm 36 pin QFN package 4 Mbps on-air data rate Mono 32 kHz audio rate 16 bit resolution

6x6mm

Contextual Info: KEYSWITCHES SERIES KB CHARACTERISTICS • • • • • SPECIFICATIONS Small 6x6 mm Base Lighted and not lighted Round and square caps Available w/o Cap Only 8.2 mm High Rating: Switching 50 mA @ 12VDC max Contact Resistance: 100 mΩ max initial Insulation Resistance: 100 MΩ min @ 500V

84 FBGA

Abstract: JEDEC FBGA 141-PIN tray fbga 84
Contextual Info: TRAY CONTAINER NEC 135.9 119.6 PPE 14x35=490 UNIT : mm 135°C MAX. 7 FBGA 6×6ESP A' 6.50 8.15 9.20 A 6.50 8.80 299.2 7.90 315.0 322.6 Section A – A' 6.50 (6.16) (5.62) 7.62 6.00 Applied Package Quantity (pcs) Tray FBGA 6×6 ESP 64-pin Plastic FBGA (6×6)

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12
Contextual Info: TRAY CONTAINER NEC 119.6 8.80 6.50 299.2 315.0 322.6 7.90 6.50 6.00 (5.62) (6.16) Section A – A' 7.62 6.50 135° CMAX. FBGA6 x 6C A' A 8.15 9.20 135.9 PPE 14 × 35=490 UNIT : mm Applied Package Quantity (pcs) 64-pin Plastic FBGA (6×6) 65-pin Plastic FBGA (6×6)

DIELECTRIC COAXIAL RESONATOR

Abstract: Epcos coaxial resonators
Contextual Info: Gurtung und Verpackung Taping and Packing Koaxialresonatoren und dielektrische Resonatoren werden standardmäßig in Paletten geliefert. Lieferung im Gurt auf Anfrage. Gurtung und Rollenverpackung entsprechen den Vorschriften von DIN IEC 286, Teil 3. Coaxial and dielectric resonators are supplied in trays, if not

circuit diagram of sequential LED

Abstract: diagram for led cfl bulb cl8801 6x6 TRAY k6 driver QFn Package tray CL8801K63-G
Contextual Info: CL8801 Product Summary Sheet Sequential Linear LED Driver 120V transient protection Applications: ►► Fluorescent tube retrofit ►► Incandescent & CFL bulb replacement ►► General LED lighting AC Mains TAP1 BIAS TAP2 1 0 in reg TAP3 1 0 TAP4 1 0 GND

circuit diagram of sequential LED

Abstract: CL8800K63-G CL8800 tray qfn 6x6 33-lead diagram for led cfl bulb 6x6 TRAY QFn Package tray cl8800k63 k6 driver
Contextual Info: CL8800 Product Summary Sheet Sequential Linear LED Driver Applications: ►► Fluorescent tube retrofit ►► Incandescent & CFL bulb replacement ►► General LED lighting Transient Protection 22Ω 33Ω 275VAC 10mm 440VDC 1.5kW AC Mains TAP1 TAP2 BIAS 1 0

10X14 package tray

Abstract: 5060
Contextual Info: CHIP PACKING METHOD W A FFL E P A C K Packing method Top cover carrier 25 carriers i P 26 carriers 717 PACKAGE INFORMATION Carrier o Ï "1 T'LZJ Figure 1. Carrier Drawings 718 ELECTRONICS PACKAGE INFORMATION Table 1. Carrier Dimensions Unit:mm, Tolerance: ± 0. Imm

HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

cu pillar

Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

BGA 64 PACKAGE thermal resistance

Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect

tray qfn 6x6

Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
Contextual Info: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA

mathcad rectifier

Abstract: QFN ac driver led CL8800 tray qfn 6x6 Pcb cl8800 33-lead
Contextual Info: Supertex inc. CL8801 Sequential Linear LED Driver Features ►► ►► ►► ►► ►► ►► ►► ►► ►► ►► General Description Minimal component count base config: CL8801 + 4 resistors + diode bridge No magnetics, no capacitors Up to 13W output

CL8800

Abstract: Pcb cl8800 tray qfn 6x6 QFN ac driver led
Contextual Info: Supertex inc. CL8801 Sequential Linear LED Driver Features General Description ►► Minimal component count base config: CL8801 + 4 resistors + diode bridge ►► No magnetics, no capacitors ►► Up to 13W output ►► >115Lm/W using efficient LEDs

CHL8325A

Contextual Info: Digital Multi-Phase Buck Controller FEATURES IR3541 CHL8325A/B DESCRIPTION • 5-phase dual output PWM Controller  Phases are flexibly assigned between Loops 1 & 2  Intel VR12, AMD® 400kHz & 3.4MHz SVI and Memory modes The IR3541 and CHL8325A/B are dual-loop digital

peak tray qfn 6x6

Abstract: tqfp 6X6 tray 6x6 TRAY tqfp
Contextual Info: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o

atmel 038

Abstract: QFN-6x6 48 tray qfn 6x6 5047B QFN-6x6 package AT88RF1354 ATMEL Tape and Reel code AT88SC0808CRF AT88SC1616CRF AT88SC6416CRF
Contextual Info: Standard Product Offerings The families of Secure RF devices in the tables below are available as standard products. Wafers, smart card modules, RFID tags, and standard package options are listed. Ordering codes indicate specific options to be used with the device number e.g.,

xg1015-SE

Abstract: XB1013-qt CMM6001-BD CFP0103-SP CMM6004-BD XZ1003-QT XU1016 QH XP1073-BD XD1008-QH XP1035-BD
Contextual Info: Sales Contact Information NORTH AMERICA COLORADO, UTAH USA ALABAMA, FLORIDA, GEORGIA, MISSISSIPPI, NORTH CAROLINA, SOUTH CAROLINA,TENNESSEE, Electronic Marketing Associates EMA 919-847-8800 rdenny@emarep.com Alabama Office 256-880-8050 djones@emarep.com

QFN48 6x6

Contextual Info: PM6690 Three phase controller for Intel MVP7 CPU power supply Data brief Features • 4.5 V to 28 V input voltage range ■ 0.25 V to 1.52 V output voltage range, 8 bit SVID ■ IMVP7 spec compliant ■ Selectable PWM switching frequency, maximum temperature, maximum currents,

CL8800

Abstract: 13w cfl circuit a0404 Pcb cl8800
Contextual Info: Supertex inc. CL8800 Sequential Linear LED Driver Features ►► Minimal component count base config: CL8800 + 6 resistors + diode bridge ►► No magnetics, no capacitors ►► Up to 13W output ►► >115Lm/W using efficient LEDs ►► 90% typical electrical efficiency

Contextual Info: IR3563A Single Output Digital Multi-Phase Controller FEATURES DESCRIPTION • 8-phase single output PWM Controller  Intel VR12 and VR12.5 modes & Memory VR mode  Overclocking & Gaming Mode  PVI and SVI GPU VR modes  Switching frequency from 200kHz to 2MHz per

IR3563A

Abstract: VR12 tray qfn 6x6 IR3563 intel VR12 IR3563AM VR12 INTEL PWM charge controller circuit Diagram
Contextual Info: IR3563A Single Output Digital Multi-Phase Controller FEATURES DESCRIPTION • 8-phase single output PWM Controller  Intel VR12 and VR12.5 modes & Memory VR mode  Overclocking & Gaming Mode  PVI and SVI GPU VR modes  Switching frequency from 200kHz to 2MHz per