6887 Search Results

100x150

Abstract: components in set top box usb mini dwg
Contextual Info: 107-68875 Packaging Specification 11Dec09 Rev C Mini I/O PLUG KIT 1. PURPOSE 目的 Define the packaging specifiction and packaging method of Mini I/O PLUG KIT. 订定 Mini I/O PLUG KIT 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

Contextual Info: 10/100 Mbps SMD 6887-37 RD1+ 1 RD1- 2 3 4 5 TD1+ CTD1 TD1TM RD2+ 6 RD2TD2+ CTD2 TD2- 7 8 9 10 RD3+ 11 RD3TD3+ CTD3 TD3- 12 13 14 15 RD4+ 16 RD4TD4CTD4 TD4- TX/RX 1:1 1CT:1CT 1:1 1CT:1CT 1:1 1CT:1CT 1:1 17 1CT:1CT 18 19 20 40 RX1+ 39 38 37 36 RX1TX1+ CTX1 Features

Contextual Info: 10/100 Mbps SMD Quad 000-6887-37R LANDatacom 1:1 1 Features 40 • Meets IEEE 802.3 standard • Supports 10Base2, 10Base5, & 10Base-T • Quad transmit and receive • Different pin-outs and turn ratios to match Level One, NSC, ICS and PMC-Sierra PHY chips

Contextual Info: P AN ASONIC INDL/ELEK -CIO 72 R m 1C ' r D?| b^EâSE □ T-52-13-07 ^ b ~ 6887 AN 6887 7 ^ LED IE ! HISS/?-Dot LED Driver Circuit 6887 l± , .m 7® W LED A * d - t KM L T (d B ) W tÎS ÎÆ le J: o T > f lj# p î g « "Tjfê * ÎËïifc 7 >• T" £ 2 f l I «

RJ45-T8

Abstract: 57201-6330
Contextual Info: 10/100 Mbps SMD 000-6887-37R LANDatacom Features • Meets IEEE 802.3 standard • Supports 10Base2, 10Base5, & 10Base-T • Quad transmit and receive • Different pin-outs and turn ratios to match Level One, NSC, ICS and PMC-Sierra PHY chips • ISO 9002 Certified manufacturing

Contextual Info: 107-68875 Packaging Specification 03May11 Rev E Mini I/O PLUG KIT 1. PURPOSE 目的 Define the packaging specifiction and packaging method of Mini I/O PLUG KIT. 订定 Mini I/O PLUG KIT 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

AO201

Abstract: AN6887 et 1109
Contextual Info: PANASONIC INDL/ELEK -CIO 72 r Rm 1C ' b^EflSE □ r T -52-13-07 ^ b ~ 6887 A N 6887 7 ^ L E D IE ! H ISS/?-D ot LED D river C ircuit 6887 l±, 7 ® W L E D .* i» A * d - t KM L T (dB) W tÎS ÎÆ le J: o T > flj# p îg « "Tjfê * ÎËïifc 7 >• T" £ 2 f l I « L T iJ

Model 450

Abstract: 2SD1857A
Contextual Info: SPICE PARAMETER 2SD1857A by ROHM TR Div. * Q2SD1857A NPN BJT model * Date: 2006/11/20 .MODEL Q2SD1857A NPN + IS=450.00E-15 + BF=101.86 + VAF=9.5235 + IKF=2.0711 + ISE=450.00E-15 + NE=1.4191 + BR=22.448 + VAR=100 + IKR=.96913 + ISC=31.986E-12 + NC=1.3523 + NK=.68874

13AC126V1

Abstract: SEMIKRON 13AC126V1
Contextual Info: SKiiP 13AC126V1 Absolute Maximum Ratings Symbol Conditions IGBT - Inverter ,$3  9 ,$3  0 ' 12      !    0 (' 6.47 1  0 (' 6.47 12 ! : * - = Values Units *(44 8* 6&*7 ;( 6%(7 < (4 ,   , > 84 ### ? *'4 1 &4 6(7 %4 6887 

13ac126v1

Contextual Info: SKiiP 13AC126V1 Absolute Maximum Ratings Symbol Conditions IGBT - Inverter ,$3  9 ,$3  0 ' 12      !    0 (' 6.47 1  0 (' 6.47 12 ! : * - = Values Units *(44 8* 6&*7 ;( 6%(7 < (4 ,   , > 84 ### ? *'4 1 &4 6(7 %4 6887 

Contextual Info: 10/100 Mbps SMD 000-6887-37R LANDatacom Features 1:1 1 • Meets IEEE 802.3 standard • Supports 10Base2, 10Base5, & 10Base-T • Quad transmit and receive • Different pin-outs and turn ratios to match Level One, NSC, ICS and PMC-Sierra PHY chips • ISO 9002 Certified manufacturing

AN6887

Abstract: AO201
Contextual Info: P AN ASONIC INDL/ELEK -CIO 72 r Rm 1C ' b^EflSE □ r T-52-13-07 ^ b ~ 6887 A N 6887 7 ^ L E D IE ! H ISS/?-D ot L E D D river C ircuit 6887 l± , .*i» 7® W LED A * d - t KM L T (d B ) W tÎS ÎÆ le J: o T > f l j # p î g « "Tjfê * ÎËïifc 7 >• T" £ 2 f l I «

junction box

Abstract: 100 junction box 102X51
Contextual Info: 107-68878 Packaging Specification 28Dec09 Rev A JUNCTION BOX 1. PURPOSE 目的 Define the packaging specifiction and packaging method of JUNCTION BOX. 订定 JUNCTION BOX 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 TYPE Product P/N

TX33

Contextual Info: TransformingMagneticsTM LANDatacom 10/100 Mbps SMD Quad 000-6887-37R 1.135 MAX .485 REF Features • Meets IEEE 802.3 standard • Supports 10Base2, 10Base5, & 10Base-T • Quad transmit and receive • Different pin-outs and turn ratios to match Level One, NSC, ICS and

Q2SD1918

Abstract: 2SD1918 Model 450
Contextual Info: SPICE PARAMETER 2SD1918 by ROHM TR Div. * Q2SD1918 NPN BJT model * Date: 2006/11/20 .MODEL Q2SD1918 NPN + IS=450.00E-15 + BF=101.86 + VAF=9.5235 + IKF=2.0711 + ISE=450.00E-15 + NE=1.4191 + BR=22.448 + VAR=100 + IKR=.96913 + ISC=31.986E-12 + NC=1.3523 + NK=.68874

Contextual Info: TransformingMagneticsTM LANDatacom 10/100 Mbps SMD Quad 000-6887-37R 1.135 MAX .485 REF Features .950 .088 • Meets IEEE 802.3 standard • Supports 10Base2, 10Base5, & 10Base-T • Quad transmit and receive • Different pin-outs and turn ratios to match Level One, NSC, ICS and

RQR-ME-030B

Abstract: 91208 INNER CARTON LABEL MR260
Contextual Info: 107-68879 Packaging Specification 07Aug09 Rev O RITS CONN & MEMORY BOARD 1. PURPOSE 目的 Define the packaging specifiction and packaging method of RITS CONN & MEMORY BOARD. 订定 RITS CONN & MEMORY BOARD 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

Contextual Info: 10/100 Mbps SMD Quad 000-6887-37R LANDatacom Features Part # date code • Meets IEEE 802.3 standard • Supports 10Base2, 10Base5, & 10Base-T • Quad transmit and receive • Different pin-outs and turn ratios to match Level One, NSC, ICS and PMC-Sierra PHY chips

Contextual Info: 107-68879 Packaging Specification 06Nov2012 Rev E RITS CONN & MEMORY BOARD 1. PURPOSE 目的 Define the packaging specifiction and packaging method of RITS CONN & MEMORY BOARD. 订定 RITS CONN & MEMORY BOARD 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

str f 6456

Abstract: str x 6456 SM 5126 BP STR F 6168 str 6668 STR G 6352 STR 6456 str f 6468 321 CJ 7121 AXP 209 IC
Contextual Info: Tem ic Se ni i co n fi li c t ci Sales Offices rs Addresses Europe France TE M IC France Les Q uadrants 3. avenue du centre B.P. 309 78054 S t.-Q uentin-en-Y veL nes Cedex Tel: 33 I 3060 7000 F a x :33 I 3060 V 11 i Germany TE M IC TE LEFU N K EN m icroelectronic G m bH

Contextual Info: 2SK3390 Silicon N-Channel MOS FET UHF Power Amplifier REJ03G0208-0400 Rev.4.00 Nov 08, 2007 Features • High power output, High gain, High efficiency PG = 17 dB, Pout = 6.31 W, ηadd = 60% min. f = 836 MHz • Compact package capable of surface mounting

Contextual Info: FX30KMJ-06 High-Speed Switching Use Pch Power MOS FET REJ03G1446-0200 Previous: MEJ02G0276-0101 Rev.2.00 Aug 07, 2006 Features • • • • • • Drive voltage : 4 V VDSS : –60 V rDS(ON) (max) : 54 mΩ ID : –30 A Integrated Fast Recovery Diode (TYP.) : 55 ns

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

TDA 7277

Abstract: TDA 8345 TDA 7988 tda 9580 TDA 8344 TDA 9394 TDA 8659 AN tda 8945 j tda 7840 ic tda 9361
Contextual Info: Tem ic S e m i c o n d u c t o r s Addresses Europe France T E M IC F rance L es Q u a d ra n ts 3. av en u e du centre B.P. 309 7 8 0 5 4 S t.-Q u e n tin -e n -Y v e lin e s C ed ex Tel: 33 1 3 0 6 0 7 0 0 0 Fax: 33 1 3 0 6 0 7111 Germany T E M IC T E L E F U N K E N