64-PIN BGA THERMAL RESISTANCE Search Results

smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue

BGA 64 PACKAGE thermal resistance

Abstract: G42-88 G38-87 492-Ball
Contextual Info: Thermal Management Introduction to Thermal Management Ways to Reduce Junction Temperature Thermal considerations are rarely an issue with lowdensity PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

MSM048

Abstract: MSD100 602 Media Specification
Contextual Info: MSM048/MSM096 and MSD048/MSD096 Microsemi Corporation MSM048 and MSM096 MSD048 and MSD096 Shortened data sheet version Secure SLC NAND SATA BGA with Hardware Authentication and Self Destruct NOTE: Microsemi does not publish the full data sheet for this product on the web.

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

35 x 35 PBGA, 580 100 balls

Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
Contextual Info: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

MSD100

Contextual Info: MSM048/MSM096 and MSD048/MSD096 Microsemi Corporation MSM048 and MSM096 MSD048 and MSD096 Shortened data sheet version Secure SLC NAND SATA BGA with Hardware Authentication and Self Destruct NOTE: Microsemi does not publish the full data sheet for this product on the web.

diagrams hitachi ecu

Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

Sanyo Denki encoder

Abstract: ORLI10G TRCV0110G TTRN0110G STM-16 chips 25LVD L30A
Contextual Info: Preliminary Data Sheet March 2001 ORCA ORLI10G Field-Programmable System Chip 10 Gbits/s Transmit and Receive Line Interface Introduction Agere Systems Inc has developed a new ORCA Series 4 based FPSC, which combines a high-speed line interface with a flexible FPGA logic core. Built on the Series

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

BGA 11x11 junction to board thermal resistance

Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
Contextual Info: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature

mpc5668g

Abstract: MPC5668X a3700 automotive power transistor PJ15 SPC5668GF1AMMG SPC5668GF1 PJ59 SPC5668 317 MG 707 SPC5668x
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 6, 03/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 6, 03/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category

Wakefield Thermal Solutions

Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
Contextual Info: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:

4572 IC 8PIN

Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Contextual Info: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines

SPC5668

Abstract: MPC5668G MPC5668X Nexus S automotive power transistor PJ15 e200z650 nexus 5001 PJ11 N13T1 MPC5668
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5668X Rev. 3, 9/2009 MPC5668x MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category

G42-88

Contextual Info: Thermal Management Introduction to Thermal Management Ways to Reduce Junction Temperature Thermal considerations are rarely an issue with lowdensity PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound

smd diode marking sG

Abstract: V048K015T80 JESD22-A-103A JESD22-A-104B SR-332 V048L015T80 P8095 SMD diode sg 46 SG 94 DIODE SMD
Contextual Info: V•I Chip – VTM Voltage Transformation Module TM V048K015T80 1 Vf = 32 - 57.6 V VOUT = 1.0 - 1.8 V IOUT = 80 A K = 1/32 ROUT = 1.5 mΩ max • 48V to 1.5V V•I Chip Converter • >92% efficiency at 1.5V • 80 A 120 A for 1 ms • 125°C operation • High density – up to 320 A/in3

Contextual Info: CDC7005 3.3ĆV HIGH PERFORMANCE CLOCK SYNTHESIZER AND JITTER CLEANER SCAS685K− DECEMBER 2002 − REVISED MAY 2009 D High Performance 1:5 PLL Clock D D D CTRL_ CLK CTRL_ DATA CP_OUT OPA_IN 7 8 OPA_IP OPA_OUT STATUS_ LOCK GND GND GND GND C I_REF GND AVCC AVCC

T405R

Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Contextual Info: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink

8251 uart vhdl

Abstract: microprocessors interface 8086 to 8251 microprocessors architecture of 8251 DS4812 8048 8251 8086 microprocessor kit manual
Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

PPGA-B615

Abstract: CKDM66-M Intel Mobile Celeron Processor BGA
Contextual Info: MOBILE INTEL CELERON® PROCESSOR IN MICRO-PGA AND BGA PACKAGES AT 466 MHZ, 433 MHZ, 400 MHZ, 366 MHZ, 300 MHZ, AND 266 MHZ DATASHEET + Available at 266 MHz, 266 MHz at low voltage, 300 MHz, 333 MHz, 366 MHz, 400 MHz, 433 MHz, and 466 MHz + Supports Intel Architecture with